页 5 - 嵌入式 - 微控制器，微处理器，FPGA 模块 | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
SOMOMAP3503-11-1782GFIR	Logic	SOM OMAP3530 SOM-LV TY Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, OMAP3503 Co-Processor: - Speed: 600MHz Flash Size: 512MB (NAND), 8MB (NOR) RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存5,456	ARM? Cortex?-A8, OMAP3503	-	600MHz	512MB (NAND), 8MB (NOR)	256MB	Board-to-Board (BTB) Socket - 240	1.23" x 3.01" (31.2mm x 76.5mm)	-40°C ~ 85°C
SOMOMAP3530-12-1782IFXR	Logic	SOM OMAP3530 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存6,688	-	-	-	-	-	-	-	-
CC-MX-MB6B-SLB	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存7,312	-	-	-	-	-	-	-	-
SOMLX800-11-000GCR	Logic	MODULE SOM LX800 GEODE WO/SODIMM Module/Board Type: MPU Core Core Processor: Geode, LX 800 Co-Processor: - Speed: 500MHz Flash Size: - RAM Size: - Connector Type: - Size / Dimension: 3.78" x 4.53" (96mm x 115mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,136	Geode, LX 800	-	500MHz	-	-	-	3.78" x 4.53" (96mm x 115mm)	0°C ~ 70°C
CENGSH7760-10-504HC	Logic	CARD ENGINE 32MB FLASH 64MB RAM Module/Board Type: MPU Core Core Processor: SH7760 Co-Processor: - Speed: 198MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存2,192	SH7760	-	198MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
5CSX-H6-4YA-RI	Critical Link LLC	MITYSOM-5CSX W/ ALTERA CYCLONE V Module/Board Type: MPU, FPGA Core Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Edge Connector Size / Dimension: 3.2" x 1.5" (82mm x 39mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存2,576	ARM? Cortex?-A9, Cyclone V SX/SE	NEON SIMD	800MHz	32MB	1GB	Edge Connector	3.2" x 1.5" (82mm x 39mm)	-40°C ~ 85°C
CC-9M-NA26-Z1	Digi International	MOD 9M 32MB SDRAM 64MB FLASH Module/Board Type: MPU Core Core Processor: ARM920T, SC2443 Co-Processor: - Speed: 533MHz Flash Size: 64MB RAM Size: 32KB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.36" x 1.73" (60mm x 44mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存2,432	ARM920T, SC2443	-	533MHz	64MB	32KB	Board-to-Board (BTB) Socket - 240	2.36" x 1.73" (60mm x 44mm)	-40°C ~ 85°C
5CSX-H6-42A-RC	Critical Link LLC	MITYSOM5CSX ALTERA CYCLONE V SOC Module/Board Type: MPU, FPGA Core Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 32MB RAM Size: 1.25GB Connector Type: Edge Connector Size / Dimension: 3.2" x 1.5" (82mm x 39mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存3,632	ARM? Cortex?-A9, Cyclone V SX/SE	NEON SIMD	800MHz	32MB	1.25GB	Edge Connector	3.2" x 1.5" (82mm x 39mm)	0°C ~ 70°C
L138-FG-225-RC	Critical Link LLC	MITYDSP-L138F SOM OMAP-L138 Module/Board Type: MPU, DSP, FPGA Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) Speed: 456MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 128MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,136	ARM926EJ-S, OMAP-L138	TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)	456MHz	256MB (NAND), 8MB (NOR)	8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)	SO-DIMM-200	2.66" x 2" (67.6mm x 50.8mm)	0°C ~ 70°C
20-101-1105	Digi International	MODULE RCM4100 RABBITCORE Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 58.98MHz Flash Size: 512KB RAM Size: 1MB Connector Type: IDC Header 2x25, 2x5 Size / Dimension: 1.41" x 1.88" (36mm x 48mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,528	Rabbit 4000	-	58.98MHz	512KB	1MB	IDC Header 2x25, 2x5	1.41" x 1.88" (36mm x 48mm)	-40°C ~ 85°C
DC-ME-01T-C-10	Digi International	ME 8MB SDRAM 2MB FLASH 10 PAK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存4,800	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
20-101-0436	Digi International	MODULE RABBITCORE RCM2120 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x20 Size / Dimension: 2" x 3.5" (51mm x 89mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,372	Rabbit 2000	-	22.1MHz	512KB	512KB	2 IDC Headers 2x20	2" x 3.5" (51mm x 89mm)	-40°C ~ 85°C
DC-EM-02T-GORL-1	Digi International	MODULE EM CUSTOMIZABLE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存2,368	-	-	-	-	-	-	-	-
G120E-SM-532	GHI Electronics, LLC	IC MOD CORTEX-M3 120MHZ 96KB Module/Board Type: MCU Core Core Processor: ARM® Cortex®-M3 Co-Processor: - Speed: 120MHz Flash Size: 512KB (Internal), 4MB (External) RAM Size: 96KB (Internal), 16MB (External) Connector Type: - Size / Dimension: 1.80" x 1.55" (45.8mm x 39.4mm) Operating Temperature: -40°C ~ 85°C (TA)	封装: -	库存7,260	ARM® Cortex®-M3	-	120MHz	512KB (Internal), 4MB (External)	96KB (Internal), 16MB (External)	-	1.80" x 1.55" (45.8mm x 39.4mm)	-40°C ~ 85°C (TA)
TE0712-02-81I36-X	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Artix-7 A200T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
OSD32MP157F-512M-EAA	Octavo Systems LLC	SYSTEM IN A PACKAGE ( SIP) Module/Board Type: MPU Core Core Processor: STM32MP157F Co-Processor: - Speed: 800MHz Flash Size: - RAM Size: 512MB Connector Type: DSI Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm) Operating Temperature: -20°C ~ 85°C	封装: -	Request a Quote	STM32MP157F	-	800MHz	-	512MB	DSI	0.710" L x 0.710" W (18.00mm x 18.00mm)	-20°C ~ 85°C
TE0820-05-5DI81MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TE0820-05-2BI21MA	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0715-05-71C33-A	Trenz Electronic GmbH	IC MOD Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存9	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0803-03-4DE21-L	Trenz Electronic GmbH	MODULE SOM TE0803-03 Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0715-04-51I33-A	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7015)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0720-03-1QFA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	1GB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-
ME-XU1-9EG-2I-D12E-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU9EG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0720-04-62I33ML	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: Ethernet Core Core Processor: ARM® Cortex®-A9 Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存9	ARM® Cortex®-A9	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0807-03-7DI21-AZ	Trenz Electronic GmbH	MPSOC MODULE WITH AMD ZYNQ ULTRA Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
FORLINX-FETMX6ULL-S-08256SN256IA12	Forlinx Embedded	NXP i.MX6ULLSOM, 256MB DDR3,256M Module/Board Type: MPU Core Processor: ARM® Cortex®-A7 Co-Processor: - Speed: 80MHz Flash Size: 256MB (NAND) RAM Size: 256MB Connector Type: Edge Connector Size / Dimension: 1.380" L x 1.732" W (35.00mm x 44.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A7	-	80MHz	256MB (NAND)	256MB	Edge Connector	1.380" L x 1.732" W (35.00mm x 44.00mm)	-40°C ~ 85°C
TE0745-02-93E31-A	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
SCM-20260D-C	GHI Electronics, LLC	SITCORE SCM20260D SOM Module/Board Type: MPU Core Core Processor: SITCore Co-Processor: - Speed: 480MHz Flash Size: 16MB RAM Size: 32MB Connector Type: - Size / Dimension: - Operating Temperature: -40°C ~ 85°C	封装: -	库存585	SITCore	-	480MHz	16MB	32MB	-	-	-40°C ~ 85°C
A20-SOM204-1G	Olimex LTD	IC Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A7 Co-Processor: - Speed: 1GHz Flash Size: 16MB RAM Size: 1GB Connector Type: 204 Pin Size / Dimension: 3.307" L x 2.638" W (84.00mm x 67.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	ARM® Cortex®-A7	-	1GHz	16MB	1GB	204 Pin	3.307" L x 2.638" W (84.00mm x 67.00mm)	0°C ~ 70°C
TE0712-03-71I36-A	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 XC7A100T-1FGG484I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Artix-7 XC7A100T-1FGG484I	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C

SOMOMAP3503-11-1782GFIR

Logic

SOM OMAP3530 SOM-LV TY

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, OMAP3503
Co-Processor: -
Speed: 600MHz
Flash Size: 512MB (NAND), 8MB (NOR)
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存5,456

ARM? Cortex?-A8, OMAP3503

-

600MHz

512MB (NAND), 8MB (NOR)

256MB

Board-to-Board (BTB) Socket - 240

1.23" x 3.01" (31.2mm x 76.5mm)

-40°C ~ 85°C

SOMOMAP3530-12-1782IFXR

Logic

SOM OMAP3530

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存6,688

-

CC-MX-MB6B-SLB

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存7,312

-

SOMLX800-11-000GCR

Logic

MODULE SOM LX800 GEODE WO/SODIMM

Module/Board Type: MPU Core
Core Processor: Geode, LX 800
Co-Processor: -
Speed: 500MHz
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: 3.78" x 4.53" (96mm x 115mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,136

Geode, LX 800

-

500MHz

-

3.78" x 4.53" (96mm x 115mm)

0°C ~ 70°C

CENGSH7760-10-504HC

Logic

CARD ENGINE 32MB FLASH 64MB RAM

Module/Board Type: MPU Core
Core Processor: SH7760
Co-Processor: -
Speed: 198MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存2,192

SH7760

-

198MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

5CSX-H6-4YA-RI

Critical Link LLC

MITYSOM-5CSX W/ ALTERA CYCLONE V

Module/Board Type: MPU, FPGA Core
Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Edge Connector
Size / Dimension: 3.2" x 1.5" (82mm x 39mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存2,576

ARM? Cortex?-A9, Cyclone V SX/SE

NEON SIMD

800MHz

32MB

1GB

Edge Connector

3.2" x 1.5" (82mm x 39mm)

-40°C ~ 85°C

CC-9M-NA26-Z1

Digi International

MOD 9M 32MB SDRAM 64MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM920T, SC2443
Co-Processor: -
Speed: 533MHz
Flash Size: 64MB
RAM Size: 32KB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.36" x 1.73" (60mm x 44mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存2,432

ARM920T, SC2443

-

533MHz

64MB

32KB

Board-to-Board (BTB) Socket - 240

2.36" x 1.73" (60mm x 44mm)

-40°C ~ 85°C

5CSX-H6-42A-RC

Critical Link LLC

MITYSOM5CSX ALTERA CYCLONE V SOC

Module/Board Type: MPU, FPGA Core
Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 32MB
RAM Size: 1.25GB
Connector Type: Edge Connector
Size / Dimension: 3.2" x 1.5" (82mm x 39mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存3,632

ARM? Cortex?-A9, Cyclone V SX/SE

NEON SIMD

800MHz

32MB

1.25GB

Edge Connector

3.2" x 1.5" (82mm x 39mm)

0°C ~ 70°C

L138-FG-225-RC

Critical Link LLC

MITYDSP-L138F SOM OMAP-L138

Module/Board Type: MPU, DSP, FPGA Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)
Speed: 456MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)
Connector Type: SO-DIMM-200
Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,136

ARM926EJ-S, OMAP-L138

TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)

456MHz

256MB (NAND), 8MB (NOR)

8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)

SO-DIMM-200

2.66" x 2" (67.6mm x 50.8mm)

0°C ~ 70°C

20-101-1105

Digi International

MODULE RCM4100 RABBITCORE

Module/Board Type: MPU Core
Core Processor: Rabbit 4000
Co-Processor: -
Speed: 58.98MHz
Flash Size: 512KB
RAM Size: 1MB
Connector Type: IDC Header 2x25, 2x5
Size / Dimension: 1.41" x 1.88" (36mm x 48mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,528

Rabbit 4000

-

58.98MHz

512KB

1MB

IDC Header 2x25, 2x5

1.41" x 1.88" (36mm x 48mm)

-40°C ~ 85°C

DC-ME-01T-C-10

Digi International

ME 8MB SDRAM 2MB FLASH 10 PAK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存4,800

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

20-101-0436

Digi International

MODULE RABBITCORE RCM2120

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x20
Size / Dimension: 2" x 3.5" (51mm x 89mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,372

Rabbit 2000

-

22.1MHz

512KB

2 IDC Headers 2x20

2" x 3.5" (51mm x 89mm)

-40°C ~ 85°C

DC-EM-02T-GORL-1

Digi International

MODULE EM CUSTOMIZABLE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存2,368

-

G120E-SM-532

GHI Electronics, LLC

IC MOD CORTEX-M3 120MHZ 96KB

Module/Board Type: MCU Core
Core Processor: ARM® Cortex®-M3
Co-Processor: -
Speed: 120MHz
Flash Size: 512KB (Internal), 4MB (External)
RAM Size: 96KB (Internal), 16MB (External)
Connector Type: -
Size / Dimension: 1.80" x 1.55" (45.8mm x 39.4mm)
Operating Temperature: -40°C ~ 85°C (TA)

封装: -

库存7,260

ARM® Cortex®-M3

-

120MHz

512KB (Internal), 4MB (External)

96KB (Internal), 16MB (External)

-

1.80" x 1.55" (45.8mm x 39.4mm)

-40°C ~ 85°C (TA)

TE0712-02-81I36-X

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Artix-7 A200T

-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

OSD32MP157F-512M-EAA

Octavo Systems LLC

SYSTEM IN A PACKAGE ( SIP)

Module/Board Type: MPU Core
Core Processor: STM32MP157F
Co-Processor: -
Speed: 800MHz
Flash Size: -
RAM Size: 512MB
Connector Type: DSI
Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm)
Operating Temperature: -20°C ~ 85°C

封装: -

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STM32MP157F

-

800MHz

-

512MB

DSI

0.710" L x 0.710" W (18.00mm x 18.00mm)

-20°C ~ 85°C

TE0820-05-5DI81MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

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-

TE0820-05-2BI21MA

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I

-

128MB

2GB

Pin(s)

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0715-05-71C33-A

Trenz Electronic GmbH

IC MOD

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存9

ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

TE0803-03-4DE21-L

Trenz Electronic GmbH

MODULE SOM TE0803-03

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU4EV-1SFVC784E

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

TE0715-04-51I33-A

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7015)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Zynq-7000 (Z-7015)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0720-03-1QFA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -

封装: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

1GB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

-

ME-XU1-9EG-2I-D12E-R5-0

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU9EG

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0720-04-62I33ML

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: Ethernet Core
Core Processor: ARM® Cortex®-A9
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存9

ARM® Cortex®-A9

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0807-03-7DI21-AZ

Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900I

-

128MB

4GB

Board-to-Board (BTB) Socket - 4 x 160

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C

FORLINX-FETMX6ULL-S-08256SN256IA12

Forlinx Embedded

NXP i.MX6ULLSOM, 256MB DDR3,256M

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A7
Co-Processor: -
Speed: 80MHz
Flash Size: 256MB (NAND)
RAM Size: 256MB
Connector Type: Edge Connector
Size / Dimension: 1.380" L x 1.732" W (35.00mm x 44.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A7

-

80MHz

256MB (NAND)

256MB

Edge Connector

1.380" L x 1.732" W (35.00mm x 44.00mm)

-40°C ~ 85°C

TE0745-02-93E31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Zynq-7000 (Z-7045)

-

64MB

1GB

Board-to-Board (BTB) Socket - 480

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

SCM-20260D-C

GHI Electronics, LLC

SITCORE SCM20260D SOM

Module/Board Type: MPU Core
Core Processor: SITCore
Co-Processor: -
Speed: 480MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

封装: -

库存585

SITCore

-

480MHz

16MB

32MB

-

-40°C ~ 85°C

A20-SOM204-1G

Olimex LTD

IC

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A7
Co-Processor: -
Speed: 1GHz
Flash Size: 16MB
RAM Size: 1GB
Connector Type: 204 Pin
Size / Dimension: 3.307" L x 2.638" W (84.00mm x 67.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

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ARM® Cortex®-A7

-

1GHz

16MB

1GB

204 Pin

3.307" L x 2.638" W (84.00mm x 67.00mm)

0°C ~ 70°C

TE0712-03-71I36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 XC7A100T-1FGG484I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Artix-7 XC7A100T-1FGG484I

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C