页 21 - 嵌入式 - 微控制器,微处理器,FPGA 模块 | 集成电路(IC) | 黑森尔电子
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嵌入式 - 微控制器,微处理器,FPGA 模块

记录 1,650
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图片
零件编号
制造商
描述
封装
库存
数量
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
TE0600-02IVF
Trenz Electronic GmbH

SOM GIGABEE XC6SLX150 2X128MB 3I

  • Module/Board Type: FPGA
  • Core Processor: Spartan-6 LX-150
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 256MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
库存7,328
Spartan-6 LX-150
-
125MHz
16MB
256MB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
-40°C ~ 85°C
CC-MX-LD79-QTC-1
Digi International

CONNECTCORE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
库存4,960
-
-
-
-
-
-
-
-
CC-9P-V247-Z1-B
Digi International

CONNECTCORE 128MB FLASH 25PK

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
库存2,320
-
-
-
-
-
-
-
-
SOMXAM3517-10-1780FJCR
Logic

IC SOM AM3517 MODULE

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, AM3517
  • Co-Processor: -
  • Speed: 600MHz
  • Flash Size: 512MB
  • RAM Size: 256MB
  • Connector Type: Board-to-Board (BTB) Socket - 300
  • Size / Dimension: 1.61" x 2.02" (40.9mm x 51.2mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
库存7,120
ARM? Cortex?-A8, AM3517
-
600MHz
512MB
256MB
Board-to-Board (BTB) Socket - 300
1.61" x 2.02" (40.9mm x 51.2mm)
0°C ~ 70°C
CENGLH79524-10-403HCR
Logic

CARD ENGINE 16MB FLASH 32MB RAM

  • Module/Board Type: MPU Core
  • Core Processor: ARM720T, LH79524
  • Co-Processor: -
  • Speed: 77.4MHz
  • Flash Size: 16MB
  • RAM Size: 32MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
库存4,400
ARM720T, LH79524
-
77.4MHz
16MB
32MB
SO-DIMM-144
2.37" x 2.67" (60.2mm x 67.8mm)
0°C ~ 70°C
CC-9M-NA59-Z1-B
Digi International

MOD 9M 256MB SDRAM 512MB FL 25PK

  • Module/Board Type: MPU Core
  • Core Processor: ARM920T, SC2443
  • Co-Processor: -
  • Speed: 533MHz
  • Flash Size: 512MB
  • RAM Size: 256MB
  • Connector Type: Board-to-Board (BTB) Socket - 240
  • Size / Dimension: 2.36" x 1.73" (60mm x 44mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
库存7,520
ARM920T, SC2443
-
533MHz
512MB
256MB
Board-to-Board (BTB) Socket - 240
2.36" x 1.73" (60mm x 44mm)
-40°C ~ 85°C
DC-ME-01T-NS-50
Digi International

MODULE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
库存2,832
-
-
-
-
-
-
-
-
L138-FG-226-RC
Critical Link LLC

MITYDSP-L138F W/ OMAP-L138

  • Module/Board Type: MPU, DSP, FPGA Core
  • Core Processor: ARM926EJ-S, OMAP-L138
  • Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
  • Speed: 456MHz
  • Flash Size: 512MB (NAND), 8MB (NOR)
  • RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 256MB (External)
  • Connector Type: SO-DIMM-200
  • Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
库存5,552
ARM926EJ-S, OMAP-L138
TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
456MHz
512MB (NAND), 8MB (NOR)
8KB (Internal MPU), 256KB (Internal DSP), 256MB (External)
SO-DIMM-200
2.66" x 2" (67.6mm x 50.8mm)
0°C ~ 70°C
CC-MX-LB69-ZM
Digi International

CONNECTCORE I.MX51 MODULE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
库存5,936
-
-
-
-
-
-
-
-
3354-IX-X3A-RC
Critical Link LLC

MITYSOM-3354 W/ AM3354

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, AM3354
  • Co-Processor: NEON SIMD
  • Speed: 1GHz
  • Flash Size: 512MB
  • RAM Size: 1GB
  • Connector Type: SO-DIMM-204
  • Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
库存2,512
ARM? Cortex?-A8, AM3354
NEON SIMD
1GHz
512MB
1GB
SO-DIMM-204
2.66" x 1.5" (67.6mm x 38.1mm)
0°C ~ 70°C
CC-MX-LC47-Z1
Digi International

MODULE I.MX51 I.MX512 800MHZ

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
库存4,944
-
-
-
-
-
-
-
-
EZ80F920020MODG
Zilog

KIT EZ80F92 ACCLAIM 512K FLASH

  • Module/Board Type: MCU Core
  • Core Processor: eZ80F92
  • Co-Processor: -
  • Speed: 20MHz
  • Flash Size: 128KB
  • RAM Size: 8KB (Internal), 512KB (External)
  • Connector Type: Header 2x25
  • Size / Dimension: 2.5" x 2.5" (64mm x 64mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
库存5,520
eZ80F92
-
20MHz
128KB
8KB (Internal), 512KB (External)
Header 2x25
2.5" x 2.5" (64mm x 64mm)
0°C ~ 70°C
100-1470-2
Bluetechnix GmbH

MODULE I.MX53 1GB DDR2

  • Module/Board Type: MPU Core
  • Core Processor: CM-i.MX53
  • Co-Processor: -
  • Speed: 800MHz
  • Flash Size: 2GB (NAND), 4MB (NOR)
  • RAM Size: 1GB
  • Connector Type: Expansion 3 x 100
  • Size / Dimension: 3.15" x 1.77" (80mm x 45 mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
库存5,248
CM-i.MX53
-
800MHz
2GB (NAND), 4MB (NOR)
1GB
Expansion 3 x 100
3.15" x 1.77" (80mm x 45 mm)
-40°C ~ 85°C
TE0741-03-070-2CF
Trenz Electronic GmbH

SOM KINTEX-7 70T 32MB FLASH AES

  • Module/Board Type: FPGA
  • Core Processor: Kintex-7 70T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
库存6,096
Kintex-7 70T
-
200MHz
32MB
-
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
0°C ~ 70°C
SOMDM3730-20-2880AGXR
Logic

SOM TORPEDO DM3730/AM3703 1GHZ

  • Module/Board Type: MPU, DSP Core
  • Core Processor: ARM? Cortex?-A8, DM3730
  • Co-Processor: TMS320C64x (DSP)
  • Speed: 1GHz
  • Flash Size: 512MB
  • RAM Size: 512MB
  • Connector Type: Board-to-Board (BTB) Socket - 200
  • Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
  • Operating Temperature: -40°C ~ 70°C
封装: -
库存5,536
ARM? Cortex?-A8, DM3730
TMS320C64x (DSP)
1GHz
512MB
512MB
Board-to-Board (BTB) Socket - 200
0.59" x 1.06" (15mm x 27mm)
-40°C ~ 70°C
CC-MX-K650-Z1-1
Digi International

RF MODULE CONNECTCORE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封装: -
库存2,640
-
-
-
-
-
-
-
-
ATSAMA5D27-SOM1
Microchip Technology

SAMA5D2 SYST.ON MODULE 1

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A5
  • Co-Processor: -
  • Speed: 500MHz
  • Flash Size: 64Mb Flash, 1Kb EEPROM
  • RAM Size: 1Gb (128K x 8)
  • Connector Type: Edge Connector
  • Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C (TA)
封装: -
库存6,792
ARM® Cortex®-A5
-
500MHz
64Mb Flash, 1Kb EEPROM
1Gb (128K x 8)
Edge Connector
1.18" x 1.57" (30mm x 40mm)
-40°C ~ 85°C (TA)
TE0803-02-04EG-1E3
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
库存5,840
Zynq UltraScale+ XCZU4EG-1SFVC784E
-
-
128MB
2GB
B2B
2.05" x 2.99" (52mm x 76mm)
0°C ~ 85°C
6252-IX-XXD-RC
Critical Link LLC

SOM WITH TI SITARA AM6252, 1GHZ,

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A53
  • Co-Processor: NEON SIMD
  • Speed: 1GHz
  • Flash Size: -
  • RAM Size: 2GB
  • Connector Type: SO-DIMM-260
  • Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
Request a Quote
ARM® Cortex®-A53
NEON SIMD
1GHz
-
2GB
SO-DIMM-260
2.740" L x 1.500" W (69.60mm x 38.10mm)
0°C ~ 70°C
TE0712-02-82C11-P
Trenz Electronic GmbH

IC MODULE ARTIX7

  • Module/Board Type: FPGA Core
  • Core Processor: -
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
Request a Quote
-
-
200MHz
32MB
1GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 85°C
MYC-C7Z020-V2-4E1D-766-I
MYIR Tech Limited

System-On-Module, Zynq-7020

  • Module/Board Type: MPU, FPGA
  • Core Processor: ARM® Cortex®-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: 866MHz
  • Flash Size: 4GB eMMC, 32MB QSPI
  • RAM Size: 1GB
  • Connector Type: Pin(s)
  • Size / Dimension: 2.953" L x 2.165" W (75.00mm x 55.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
ARM® Cortex®-A9
Zynq-7000 (Z-7020)
866MHz
4GB eMMC, 32MB QSPI
1GB
Pin(s)
2.953" L x 2.165" W (75.00mm x 55.00mm)
-40°C ~ 85°C
CR00107-01
Trenz Electronic GmbH

CRUVI CARRIER BOARD WITH AMD SPA

  • Module/Board Type: FPGA
  • Core Processor: Spartan-7
  • Co-Processor: -
  • Speed: 100MHz
  • Flash Size: 32MB QSPI
  • RAM Size: 8MB
  • Connector Type: USB
  • Size / Dimension: 2.264" L x 1.766" W (57.50mm x 44.85mm)
  • Operating Temperature: -
封装: -
Request a Quote
Spartan-7
-
100MHz
32MB QSPI
8MB
USB
2.264" L x 1.766" W (57.50mm x 44.85mm)
-
TE0813-01-4AE11-A
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: Board-to-Board (BTB) Socket - 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
Request a Quote
Zynq UltraScale+ XCZU4CG-1SFVC784E
-
-
128MB
2GB
Board-to-Board (BTB) Socket - 240
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
TE0808-05-6BE21-AK
Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ UltraScale+™ ZU6EG-E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 160
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
Request a Quote
Zynq™ UltraScale+™ ZU6EG-E
-
-
128MB
4GB
Board-to-Board (BTB) Socket - 160
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
5749-PX-4AA-RC
Critical Link LLC

TEXAS INSTRUMENTS AM5749 SOM (32

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM® Cortex®-A15
  • Co-Processor: -
  • Speed: 1.5GHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310
  • Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
  • Operating Temperature: 0°C ~ 70°C
封装: -
Request a Quote
ARM® Cortex®-A15
-
1.5GHz
32MB
1GB
Board-to-Board (BTB) - 100, Edge Connector - 310
3.460" L x 2.730" W (87.88mm x 69.34mm)
0°C ~ 70°C
TE0813-02-4AE81-A
Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

  • Module/Board Type: MPU Core
  • Core Processor: Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 4 x 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
Request a Quote
Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E
-
-
128MB
4GB
Board-to-Board (BTB) Socket - 4 x 240
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
L138-DG-225-RI-CR
Critical Link LLC

MOD MITYDSP-L138F W/OMAP-L138

  • Module/Board Type: MPU, DSP, FPGA Core
  • Core Processor: ARM926EJ-S, OMAP-L138
  • Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)
  • Speed: 375MHz
  • Flash Size: 256MB (NAND), 8MB (NOR)
  • RAM Size: 8kB (Internal), 128MB (External)
  • Connector Type: SO-DIMM-200
  • Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
ARM926EJ-S, OMAP-L138
TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)
375MHz
256MB (NAND), 8MB (NOR)
8kB (Internal), 128MB (External)
SO-DIMM-200
2.660" L x 2.000" W (67.60mm x 50.80mm)
-40°C ~ 85°C
TE0821-01-3BE21ML
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: 2 x 100 Pin
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
封装: -
Request a Quote
Zynq UltraScale+ XCZU3EG-1SFVC784E
ARM® Cortex®-A53, ARM® Cortex®-R5
-
128MB
2GB
2 x 100 Pin
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 85°C
TE0725LP-01-72I-1T
Trenz Electronic GmbH

FPGA MODULE WITH XILINX ARTIX-7

  • Module/Board Type: FPGA
  • Core Processor: Artix™ 7 XC7A100T-2CSG324I
  • Co-Processor: -
  • Speed: 25MHz
  • Flash Size: 64MB
  • RAM Size: -
  • Connector Type: 2 x 50 Pin
  • Size / Dimension: 2.870" L x 1.380" W (73.00mm x 35.00mm)
  • Operating Temperature: -40°C ~ 85°C
封装: -
Request a Quote
Artix™ 7 XC7A100T-2CSG324I
-
25MHz
64MB
-
2 x 50 Pin
2.870" L x 1.380" W (73.00mm x 35.00mm)
-40°C ~ 85°C
TEM0007-01-CAA11-A
Trenz Electronic GmbH

MICROCHIP POLARFIRE SOC FPGA 25T

  • Module/Board Type: FPGA
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: B2B
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -
封装: -
Request a Quote
-
-
-
64MB
1GB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
-