页 19 - NXP 产品 - PMIC - 电源管理 - 专用

零件编号	制造商	描述	封装	库存	Current - Supply	Voltage - Supply	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
MFS8406AMBP4ES	NXP	SAFETY POWER MANAGEMENT IC, QFN4 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	封装: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	48-VFQFN Exposed Pad	48-HVQFN (7x7)
MPF5020AMBA0ES	NXP	POWER MANAGEMENT IC, PRE-PROG, 3 Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	封装: -	库存1,470	10µA	2.5V ~ 5.5V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	40-VFQFN Exposed Pad	40-HVQFN (6x6)
MWCT22C3AVLH	NXP	NEVIS3A_WCT,64LQFP Applications: Wireless Power Transmitter Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封装: -	Request a Quote	-	-	-	Surface Mount	64-LQFP	64-LQFP (10x10)
MWCT22C3AVLL	NXP	NEVIS3A_WCT,100LQFP Applications: Wireless Power Transmitter Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封装: -	Request a Quote	-	-	-	Surface Mount	100-LQFP	100-LQFP (14x14)
MC33PF8200DNESR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封装: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC34PF8101A0EPR2	NXP	POWER MANAGEMENT IC I.MX8 NON-PR Applications: High Performance i.MX 8 Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封装: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS8510B6ESR2	NXP	FS8500 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote	-	-	-	-	-	-
MWCT2D17SHVPB	NXP	MWCT2D17S,MAXQFP172 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote	-	-	-	-	-	-
MC33FS6517CAER2	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封装: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33VR5500V2ESR2	NXP	VR5500 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote	-	-	-	-	-	-
MC33FS6506NAER2	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封装: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33FS6600M2KSR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: - Current - Supply: - Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封装: -	Request a Quote	-	2.7V ~ 60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MFS8412AMBP8ES	NXP	SAFETY POWER MANAGEMENT IC, QFN4 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	封装: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	48-VFQFN Exposed Pad	48-HVQFN (7x7)
MFS8412AMBP7ES	NXP	SAFETY POWER MANAGEMENT IC, QFN4 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	封装: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	48-VFQFN Exposed Pad	48-HVQFN (7x7)
MPF5030BMMA0ESR2	NXP	PMIC 3 BUCKS 2 LDO A1 DIE Applications: System Basis Chip Current - Supply: - Voltage - Supply: 3.3V ~ 5.25V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-PowerVFQFN Supplier Device Package: 40-HVQFN (6x6)	封装: -	Request a Quote	-	3.3V ~ 5.25V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	40-PowerVFQFN	40-HVQFN (6x6)
MFS2603AMDA0ADR2	NXP	SAFETY SYSTEM BASIS CHIP WITH LO Applications: - Current - Supply: - Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	封装: -	Request a Quote	-	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MPF5024CMBA0ESR2	NXP	POWER MANAGEMENT IC, PRE-PROG, 4 Applications: High Performance i.MX 8 Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	封装: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	40-VFQFN Exposed Pad	40-HVQFN (6x6)
MWPR1124ZVHT	NXP	KW40 512 WCT 48LQFN Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote	-	-	-	-	-	-
MC33FS6505KAER2	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封装: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33FS4508NAER2	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封装: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MFS2321BMMA0EPR2	NXP	IC Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote	-	-	-	-	-	-
MFS2622AMDA0ADR2	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	封装: -	Request a Quote	30µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MC33PF8201A0ESR2	NXP	POWER MANAGEMENT IC I.MX8 NON-PR Applications: High Performance i.MX 8 Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封装: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MFS5600AMEA0ES	NXP	DUAL 36V AUTOMOTIVE DC-DC CONTRO Applications: - Current - Supply: 140µA Voltage - Supply: 2.7V ~ 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	封装: -	Request a Quote	140µA	2.7V ~ 36V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	32-VFQFN Exposed Pad	32-HVQFN (5x5)
MC32PF8121F2EPR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: Industrial, IoT Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封装: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 85°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MFS2302BMMA0EPR2	NXP	IC Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote	-	-	-	-	-	-
MC33FS6600M0ESR2	NXP	SAFETY SBC FOR S32S2 MCU Applications: Safety Current - Supply: - Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封装: -	Request a Quote	-	2.7V ~ 60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS8430G0ES	NXP	SYSTEM BASIS CHIP FS8430 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封装: -	库存780	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS6526CAE	NXP	SYSTEM BASIS CHIP, DCDC 2.2A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封装: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33FS6526NAE	NXP	SYSTEM BASIS CHIP, DCDC 2.2A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 2.7V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封装: -	Request a Quote	-	2.7V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)

MFS8406AMBP4ES

NXP

SAFETY POWER MANAGEMENT IC, QFN4

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

封装: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

48-VFQFN Exposed Pad

48-HVQFN (7x7)

MPF5020AMBA0ES

NXP

POWER MANAGEMENT IC, PRE-PROG, 3

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

封装: -

库存1,470

10µA

2.5V ~ 5.5V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

40-VFQFN Exposed Pad

40-HVQFN (6x6)

MWCT22C3AVLH

NXP

NEVIS3A_WCT,64LQFP

Applications: Wireless Power Transmitter
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封装: -

Request a Quote

-

Surface Mount

64-LQFP

64-LQFP (10x10)

MWCT22C3AVLL

NXP

NEVIS3A_WCT,100LQFP

Applications: Wireless Power Transmitter
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封装: -

Request a Quote

-

Surface Mount

100-LQFP

100-LQFP (14x14)

MC33PF8200DNESR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封装: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC34PF8101A0EPR2

NXP

POWER MANAGEMENT IC I.MX8 NON-PR

Applications: High Performance i.MX 8 Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封装: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33FS8510B6ESR2

NXP

FS8500

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

Request a Quote

-

MWCT2D17SHVPB

NXP

MWCT2D17S,MAXQFP172

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

Request a Quote

-

MC33FS6517CAER2

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封装: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33VR5500V2ESR2

NXP

VR5500

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

Request a Quote

-

MC33FS6506NAER2

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封装: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33FS6600M2KSR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: -
Current - Supply: -
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封装: -

Request a Quote

-

2.7V ~ 60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MFS8412AMBP8ES

NXP

SAFETY POWER MANAGEMENT IC, QFN4

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

封装: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

48-VFQFN Exposed Pad

48-HVQFN (7x7)

MFS8412AMBP7ES

NXP

SAFETY POWER MANAGEMENT IC, QFN4

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

封装: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

48-VFQFN Exposed Pad

48-HVQFN (7x7)

MPF5030BMMA0ESR2

NXP

PMIC 3 BUCKS 2 LDO A1 DIE

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 3.3V ~ 5.25V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-PowerVFQFN
Supplier Device Package: 40-HVQFN (6x6)

封装: -

Request a Quote

-

3.3V ~ 5.25V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

40-PowerVFQFN

40-HVQFN (6x6)

MFS2603AMDA0ADR2

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

Applications: -
Current - Supply: -
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

封装: -

Request a Quote

-

3.2V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MPF5024CMBA0ESR2

NXP

POWER MANAGEMENT IC, PRE-PROG, 4

Applications: High Performance i.MX 8 Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

封装: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

40-VFQFN Exposed Pad

40-HVQFN (6x6)

MWPR1124ZVHT

NXP

KW40 512 WCT 48LQFN

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

Request a Quote

-

MC33FS6505KAER2

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封装: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33FS4508NAER2

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封装: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MFS2321BMMA0EPR2

NXP

IC

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

Request a Quote

-

MFS2622AMDA0ADR2

NXP

AUTO SBC

Applications: -
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

封装: -

Request a Quote

30µA

3.2V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MC33PF8201A0ESR2

NXP

POWER MANAGEMENT IC I.MX8 NON-PR

Applications: High Performance i.MX 8 Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封装: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MFS5600AMEA0ES

NXP

DUAL 36V AUTOMOTIVE DC-DC CONTRO

Applications: -
Current - Supply: 140µA
Voltage - Supply: 2.7V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

封装: -

Request a Quote

140µA

2.7V ~ 36V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

32-VFQFN Exposed Pad

32-HVQFN (5x5)

MC32PF8121F2EPR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: Industrial, IoT
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封装: -

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-

2.5V ~ 5.5V

-40°C ~ 85°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MFS2302BMMA0EPR2

NXP

IC

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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-

MC33FS6600M0ESR2

NXP

SAFETY SBC FOR S32S2 MCU

Applications: Safety
Current - Supply: -
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封装: -

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-

2.7V ~ 60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33FS8430G0ES

NXP

SYSTEM BASIS CHIP FS8430

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封装: -

库存780

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33FS6526CAE

NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封装: -

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-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33FS6526NAE

NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 2.7V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封装: -

Request a Quote

-

2.7V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)