NXP 产品

PMN38EN,135

NXP

MOSFET N-CH 30V 5.4A 6TSOP

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 5.4A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 6.1nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 495pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 1.75W (Tc)
• Rds On (Max) @ Id, Vgs: 38 mOhm @ 3A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: 6-TSOP
• Package / Case: SC-74, SOT-457

封装: SC-74, SOT-457

MRFE6S9201HR5

NXP

FET RF 66V 880MHZ NI-780

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 20.8dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.4A
• Power - Output: 40W
• Voltage - Rated: 66V
• Package / Case: NI-780
• Supplier Device Package: NI-780

封装: NI-780

BF1100R,235

NXP

MOSFET N-CH 14V 30MA SOT143

• Transistor Type: N-Channel Dual Gate
• Frequency: 800MHz
• Gain: -
• Voltage - Test: 9V
• Current Rating: 30mA
• Noise Figure: 2dB
• Current - Test: 10mA
• Power - Output: -
• Voltage - Rated: 14V
• Package / Case: SOT-143R
• Supplier Device Package: SOT-143R

封装: SOT-143R

TEA1738T/N1,118

NXP

IC CTRLR SMPS GREEN OVP 8SO

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: -
• Topology: Flyback
• Voltage - Start Up: 20.6V
• Voltage - Supply (Vcc/Vdd): 12 V ~ 30 V
• Duty Cycle: 80%
• Frequency - Switching: 26.5kHz ~ 78kHz
• Power (Watts): 75W
• Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
• Control Features: -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO
• Mounting Type: Surface Mount

封装: 8-SOIC (0.154", 3.90mm Width)

74LVT16500ADL,512

NXP

IC UNIV BUS TXRX 18BIT 56SSOP

• Logic Type: Universal Bus Transceiver
• Number of Circuits: 18-Bit
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 56-SSOP

封装: 56-BSSOP (0.295", 7.50mm Width)

SAA7146AH/V4,557

NXP

IC VIDEO SPCI BRIDGE HP 160-QFP

• Type: Video Bridge
• Applications: DTV
• Mounting Type: Surface Mount
• Package / Case: 160-BQFP
• Supplier Device Package: 160-PQFP (28x28)

封装: 160-BQFP

CGD985LCU

NXP

IC AMP CATV PWR DOUBLER 8SIL

• Applications: CATV
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 365mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): 24V
• Mounting Type: Surface Mount
• Package / Case: SOT-115AE
• Supplier Device Package: 8-SIL

封装: SOT-115AE

TDF8546JS/N1,512

NXP

IC PWR AMP I2C BUS CTRL 27DBSMS

• Type: Class AB
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 25W x 4 @ 4 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -
• Supplier Device Package: 27-DBSMS
• Package / Case: 27-DBSMS

封装: 27-DBSMS

TJA1029TK/20/1J

NXP

IC TXRX LIN 2.2/SAE 8-HVSON

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: 175mV
• Data Rate: -
• Voltage - Supply: 5 V ~ 18 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-HVSON (3x3)

封装: 8-VDFN Exposed Pad

74HC4351N,652

NXP

IC MUX/DEMUX 8X1 20DIP

• Switch Circuit: -
• Multiplexer/Demultiplexer Circuit: 8:1
• Number of Circuits: 1
• On-State Resistance (Max): 120 Ohm
• Channel-to-Channel Matching (ΔRon): 6 Ohm
• Voltage - Supply, Single (V+): 2 V ~ 10 V
• Voltage - Supply, Dual (V±): ±1 V ~ 5 V
• Switch Time (Ton, Toff) (Max): 55ns, 45ns
• -3db Bandwidth: 170MHz
• Charge Injection: -
• Channel Capacitance (CS(off), CD(off)): 3.5pF
• Current - Leakage (IS(off)) (Max): 100nA
• Crosstalk: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

封装: 20-DIP (0.300", 7.62mm)

P1017NSE5BFB

NXP

IC MPU Q OR IQ 400MHZ 457TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Security; SEC 4.2
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 457-LFBGA
• Supplier Device Package: 457-TEPBGA-1 (19x19)

封装: 457-LFBGA

MPC8540PX833LB

NXP

IC MPU MPC85XX 833MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 833MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

封装: 784-BBGA, FCBGA

KMPC852TCVR100A

NXP

IC MPU MPC8XX 100MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 100MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 100°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

封装: 256-BBGA

MC8640DVJ1250HE

NXP

IC MPU E600 DUAL CORE 1023FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.25GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BCBGA, FCCBGA
• Supplier Device Package: 1023-FCCBGA (33x33)

封装: 1023-BCBGA, FCCBGA

SCP2207VMU

NXP

IC MPU ARM926EJ-S 236MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: LCD
• Ethernet: -
• SATA: -
• USB: USB 2.0 OTG (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 236-LFBGA
• Supplier Device Package: 236-MAPBGA (9x9)

封装: 236-LFBGA

MC68HC908JB16FA

NXP

IC MCU 8BIT 16KB FLASH 32LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 6MHz
• Connectivity: SCI, USB
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 21
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

MC68HC711E9CFN2

NXP

IC MCU 8BIT 12KB OTP 52PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 38
• Program Memory Size: 12KB (12K x 8)
• Program Memory Type: OTP
• EEPROM Size: 512 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 52-LCC (J-Lead)
• Supplier Device Package: 52-PLCC (19.1x19.1)

封装: 52-LCC (J-Lead)

MAC7131MVF40

NXP

IC MCU 32BIT 544KB FLASH 208BGA

• Core Processor: ARM7?
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
• Peripherals: DMA, POR
• Number of I/O: 128
• Program Memory Size: 544KB (544K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 32x8/10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 208-BGA
• Supplier Device Package: 208-MAPBGA (17x17)

封装: 208-BGA

MC68331CEH20

NXP

IC MCU 32BIT ROMLESS 132QFP

• Core Processor: CPU32
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 132-BQFP Bumpered
• Supplier Device Package: 132-PQFP (24.13x24.13)

封装: 132-BQFP Bumpered

MK21FX512VLQ12

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 100
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 42x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

MC9S12GC16CPBE

NXP

IC MCU 16BIT 16KB FLASH 52LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 52-LQFP
• Supplier Device Package: 52-LQFP (10x10)

封装: 52-LQFP

MCF51JU32VHS

NXP

IC MCU 32BIT 32KB FLASH 44MAPLGA

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 9x12b, D/A 1x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 44-VFLGA
• Supplier Device Package: 44-MAPLGA (5x5)

封装: 44-VFLGA

LPC54114J256UK49Z

NXP

IC MCU 32BIT 256KB FLASH 49WLCSP

• Core Processor: ARM? Cortex?-M4/M0+
• Core Size: 32-Bit Dual-Core
• Speed: 100MHz
• Connectivity: I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 192K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 49-UFBGA, WLCSP
• Supplier Device Package: 49-WLCSP (3.44x3.44)

封装: 49-UFBGA, WLCSP

T1042NSE7MQPB

NXP

QORIQ 4X E5500 1200MHZ DDR3L/

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

封装: -

MCIMX535DVV1C2

NXP

I.MX53 32-BIT MPU ARM CORTEX-A8

• Core Processor: ARM® Cortex®-A8
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, DDR2, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: SATA 1.5Gbps (1)
• USB: USB 2.0 (2), USB 2.0 + PHY (2)
• Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
• Operating Temperature: -20°C ~ 85°C (TC)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 529-FBGA
• Supplier Device Package: 529-FBGA (19x19)

封装: 529-FBGA

MC9S12DJ64VFUER

NXP

S12DJ 16-BIT MCU HCS12 CORE 64

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, I²C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 59
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

封装: 80-QFP

S912ZVMBA4F0VLH

NXP

VMB64 64K FLASH 4K RAM 64LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: LINbus, SCI, SPI
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

SAF7770EL-203Z130Y

NXP

IC

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

Request a Quote

MIMX8UX6CVLDZAC

NXP

I.MX8 QXP 21X21

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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MIMXRT685SFVKB

NXP

IC MCU 32BIT EXT MEM 176VFBGA

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Dual-Core
• Speed: 300MHz
• Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 96
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 4.5M x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 12x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 176-VFBGA
• Supplier Device Package: 176-VFBGA (9x9)

封装: -