NXP 产品

PMGD400UN,115

NXP

MOSFET 2N-CH 30V 0.71A 6TSSOP

• FET Type: 2 N-Channel (Dual)
• FET Feature: Logic Level Gate
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 710mA
• Rds On (Max) @ Id, Vgs: 480 mOhm @ 200mA, 4.5V
• Vgs(th) (Max) @ Id: 1V @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 0.89nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 43pF @ 25V
• Power - Max: 410mW
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

封装: 6-TSSOP, SC-88, SOT-363

BFU590GX

NXP

TRANS RF NPN 12V 200MA SOT223-4

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 12V
• Frequency - Transition: 8.5GHz
• Noise Figure (dB Typ @ f): -
• Gain: 8dB
• Power - Max: 2W
• DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 80mA, 8V
• Current - Collector (Ic) (Max): 200mA
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-261-4, TO-261AA
• Supplier Device Package: SOT-223

封装: TO-261-4, TO-261AA

PCF8534AU/DA/1,026

NXP

IC LCD DISPLAY DVR 60SEG

• Display Type: LCD
• Configuration: 60 Segment
• Interface: I2C
• Digits or Characters: -
• Current - Supply: 8µA
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

封装: Die

TEA1533P/N1,112

NXP

IC CTRLR SMPS GREEN OVP 8DIP

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: 650V
• Topology: Flyback
• Voltage - Start Up: 11V
• Voltage - Supply (Vcc/Vdd): 8.7 V ~ 20 V
• Duty Cycle: -
• Frequency - Switching: 25kHz ~ 175kHz
• Power (Watts): 250W
• Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage, Short Circuit
• Control Features: -
• Operating Temperature: -20°C ~ 145°C (TJ)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-DIP
• Mounting Type: Through Hole

封装: 8-DIP (0.300", 7.62mm)

HEC40106BT,112

NXP

IC TRIGG SCHM HEX INVRT 14-SOIC

• Logic Type: Inverter
• Number of Circuits: 6
• Number of Inputs: 6
• Features: Schmitt Trigger
• Voltage - Supply: 3 V ~ 15 V
• Current - Quiescent (Max): 1µA
• Current - Output High, Low: 3.4mA, 3.4mA
• Logic Level - Low: 1.5 V ~ 4 V
• Logic Level - High: 3.5 V ~ 11 V
• Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

封装: 14-SOIC (0.154", 3.90mm Width)

TDA19989BET/C1,551

NXP

IC HDMI INTERFACE 64TFBGA

• Type: HDMI 1.4
• Applications: HDMI, DVI, Receivers
• Mounting Type: Surface Mount
• Package / Case: 64-TFBGA
• Supplier Device Package: 64-TFBGA (4.5x4.5)

封装: 64-TFBGA

MHW1244N

NXP

IC CATV AMP MOD 200MHZ 7-CATV

• Applications: CATV
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 210mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Mounting Type: Surface Mount
• Package / Case: Module
• Supplier Device Package: 7-CATV Module

封装: Module

SC16C2550BIN40,112

NXP

IC UART DUAL W/FIFO 40-DIP

• Features: -
• Number of Channels: 2, DUART
• FIFO's: 16 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Through Hole
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-DIP

封装: 40-DIP (0.600", 15.24mm)

UJA1078ATW/5V0,112

NXP

IC SBC CAN/LIN 5.0V HS 32HTSSOP

• Applications: Automotive
• Interface: CAN, LIN
• Voltage - Supply: 4.5 V ~ 28 V
• Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
• Supplier Device Package: 32-HTSSOP
• Mounting Type: Surface Mount

封装: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

PTN3300BHF2,518

NXP

IC DVI/HDMI LEVEL SHIFT 48-HWQFN

• Applications: DVI, HDMI Level Switching
• Interface: I2C
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 48-WFQFN Exposed Pad
• Supplier Device Package: 48-HWQFN
• Mounting Type: Surface Mount

封装: 48-WFQFN Exposed Pad

PX1011B-EL1/Q900'5

NXP

IC PCI EXPRESS X1 PHY 81-LFBGA

• Applications: PCI Express MAX to PCI Express PHY
• Interface: JTAG
• Voltage - Supply: 1.2V
• Package / Case: 81-LFBGA
• Supplier Device Package: 81-LFBGA (9x9)
• Mounting Type: Surface Mount

封装: 81-LFBGA

TJA1040T/N1,518

NXP

IC CAN TRANSCEIVER HS 8-SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 70mV
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

封装: 8-SOIC (0.154", 3.90mm Width)

MCIMX6Q4AVT10AD

NXP

IC MPU I.MX6Q 1.0GHZ 624FCBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-FBGA, FCBGA
• Supplier Device Package: 624-FCBGA (21x21)

封装: 624-FBGA, FCBGA

P80C552EFA/08,512

NXP

IC MCU 8BIT ROMLESS 68PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, I2C, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC (24.23x24.23)

封装: 68-LCC (J-Lead)

MPC566MZP56

NXP

IC MCU 32BIT 1MB FLASH 388BGA

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 56MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 36K x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 40x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 388-BBGA
• Supplier Device Package: 388-PBGA (27x27)

封装: 388-BBGA

MK22FX512VLQ12

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 100
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 42x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

S9S08DV16F2MLF

NXP

IC MCU 8BIT 16KB FLASH 48LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

MC68332GCEH25

NXP

IC MCU 32BIT ROMLESS 132QFP

• Core Processor: CPU32
• Core Size: 32-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 15
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 132-BQFP Bumpered
• Supplier Device Package: 132-PQFP (24.13x24.13)

封装: 132-BQFP Bumpered

PESD9X7.0L,315

NXP

TVS DIODE 7VWM 18VC SOD882

• Type: Zener
• Unidirectional Channels: 1
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): 7V (Max)
• Voltage - Breakdown (Min): 7.5V
• Voltage - Clamping (Max) @ Ipp: 18V
• Current - Peak Pulse (10/1000µs): 10A (8/20µs)
• Power - Peak Pulse: 150W
• Power Line Protection: No
• Applications: Automotive
• Capacitance @ Frequency: 62pF @ 1MHz
• Operating Temperature: -55°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SOD-882
• Supplier Device Package: DFN1006-2

封装: SOD-882

MMA1251KEGR2

NXP

ACCELEROMETER 5G ANALOG 16SOIC

• Type: Analog
• Axis: Z
• Acceleration Range: ±5g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 400
• Bandwidth: 50Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

封装: 16-SOIC (0.295", 7.50mm Width)

TEF6730AHW/V1,518

NXP

IC DIGITAL IF FRONT END 64-HTQFP

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM, WB
• Applications: AM/FM Radio Receiver
• Current - Receiving: 85.3mA, 114.7mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 8 V ~ 9 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

封装: 64-TQFP Exposed Pad

MC33FS6521NAE

NXP

SYSTEM BASIS CHIP DCDC 2.2A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP Exposed Pad

TDA8026ET/C3K

NXP

MULTIPLE SMART CARD SLOT INTERFA

• Applications: -
• Interface: I²C
• Voltage - Supply: 2.7 V ~ 5.5 V
• Package / Case: 64-TFBGA
• Supplier Device Package: 64-TFBGA
• Mounting Type: Surface Mount

封装: 64-TFBGA

T4081NSN7PQB

NXP

QORIQ 64B POWER 8X 1.5GHZ THRE

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

封装: -

T2080NSE8P1B

NXP

QORIQ64B POWER ARCH8X 1.5GHZ T

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

封装: -

SPC5744PK1AMMM8

NXP

NXP 32-BIT MCU DUAL CORE POWER

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 180MHz
• Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: -
• Program Memory Size: 2.5MB (2.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 257-LFBGA
• Supplier Device Package: 257-MAPBGA (14x14)

封装: 257-LFBGA

MC33FS8510A2ES

NXP

SYSTEM BASIS CHIP FS8500

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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TJA1462BT-0Z

NXP

IC TRANSCEIVER HALF 1/1 8SO

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 100 mV
• Data Rate: 8Mbps
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

封装: -

MGD3160AM338EKR2

NXP

GATE DRIVER

• Driven Configuration: High-Side
• Channel Type: Single
• Number of Drivers: 1
• Gate Type: IGBT, SiC MOSFET
• Voltage - Supply: 4.5V ~ 40V
• Logic Voltage - VIL, VIH: -
• Current - Peak Output (Source, Sink): 15A, 15A
• Input Type: Non-Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC

封装: -

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MC56F81748MLH

NXP

32-BIT DSC, 56800EX CORE, 64KB F

• Type: Digital Signal Controllers
• Interface: I2C, LINbus, QSCI, QSPI
• Clock Rate: 100MHz
• Non-Volatile Memory: FLASH (64kB)
• On-Chip RAM: 12kB
• Voltage - I/O: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: -

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