页 27 - TE Connectivity AMP Connectors 产品 - 用于 IC 的插座，晶体管 | 黑森尔电子
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TE Connectivity AMP Connectors 产品 - 用于 IC 的插座，晶体管

记录 941
页  27/32
图片
零件编号
制造商
描述
封装
库存
数量
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
643648-3
TE Connectivity AMP Connectors

CONN SOCKET SIP 16POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 16 (1 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存4,356
16 (1 x 16)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
4-1571552-5
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 18POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 18 (2 x 9)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 20µin (0.51µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 20µin (0.51µm)
  • Contact Material - Post: Copper
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存8,766
18 (2 x 9)
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
20µin (0.51µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
4-1571551-8
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 25µin (0.63µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 25µin (0.63µm)
  • Contact Material - Post: Nickel
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存2,898
24 (2 x 12)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Nickel
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1-1437531-8
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 14POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 14 (2 x 7)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Copper Alloy
  • Housing Material: -
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存6,390
14 (2 x 7)
0.100" (2.54mm)
Gold
-
Copper Alloy
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
-
Copper Alloy
-
-55°C ~ 125°C
1-1437536-3
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 18POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 18 (2 x 9)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: -
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: -
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
封装: -
库存2,682
18 (2 x 9)
0.100" (2.54mm)
Gold
-
-
Through Hole
Closed Frame
-
0.100" (2.54mm)
-
-
-
-
-
1571539-2
TE Connectivity AMP Connectors

CONN SOCKET PLCC 28POS TIN

  • Type: PLCC
  • Number of Positions or Pins (Grid): 28 (4 x 7)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 180µin (4.57µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 180µin (4.57µm)
  • Contact Material - Post: Copper Alloy
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存6,066
28 (4 x 7)
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Polyphenylene Sulfide (PPS), Glass Filled
-55°C ~ 125°C
2-641616-1
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存8,496
40 (2 x 20)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic
-55°C ~ 105°C
1571540-1
TE Connectivity AMP Connectors

CONN SOCKET PLCC 32POS TIN

  • Type: PLCC
  • Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 180µin (4.57µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 180µin (4.57µm)
  • Contact Material - Post: Copper Alloy
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -
封装: -
库存7,992
32 (2 x 7, 2 x 9)
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Polyphenylene Sulfide (PPS)
-
hot 1761505-1
TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 604POS GOLD

  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): 604 (25 x 31)
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: -
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
封装: -
库存9,888
604 (25 x 31)
0.050" (1.27mm)
Gold
30µin (0.76µm)
-
Surface Mount
Open Frame
-
-
-
-
-
-
-
1571541-2
TE Connectivity AMP Connectors

CONN SOCKET PLCC 52POS TIN

  • Type: PLCC
  • Number of Positions or Pins (Grid): 52 (4 x 13)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 180µin (4.57µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 180µin (4.57µm)
  • Contact Material - Post: Copper Alloy
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -
封装: -
库存4,374
52 (4 x 13)
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Polyphenylene Sulfide (PPS)
-
1571541-4
TE Connectivity AMP Connectors

CONN SOCKET PLCC 84POS TIN

  • Type: PLCC
  • Number of Positions or Pins (Grid): 84 (4 x 21)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 180µin (4.57µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 180µin (4.57µm)
  • Contact Material - Post: Copper Alloy
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -
封装: -
库存7,542
84 (4 x 21)
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Polyphenylene Sulfide (PPS)
-
4-1571551-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 8 (2 x 4)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 25µin (0.63µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 25µin (0.63µm)
  • Contact Material - Post: Nickel
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存5,742
8 (2 x 4)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Nickel
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
2-1571586-6
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 25µin (0.63µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 25µin (0.63µm)
  • Contact Material - Post: Copper
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存4,014
20 (2 x 10)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
7-1437539-7
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 5µin (0.127µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Polyester
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存4,500
24 (2 x 12)
0.100" (2.54mm)
Gold
5µin (0.127µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C
9-1437539-4
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 80µin (2.03µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Polyester
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存2,430
28 (2 x 14)
0.100" (2.54mm)
Gold
80µin (2.03µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C
824-AG31D
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 25µin (0.63µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Copper Alloy
  • Housing Material: Polyester
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存7,758
24 (2 x 12)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
-
Copper Alloy
Polyester
-55°C ~ 105°C
643662-3
TE Connectivity AMP Connectors

CONN SOCKET SIP 30POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 30 (1 x 30)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存8,370
30 (1 x 30)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
643653-1
TE Connectivity AMP Connectors

CONN SOCKET SIP 21POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 21 (1 x 21)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存6,660
21 (1 x 21)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
9-1437535-4
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 14POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 14 (2 x 7)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 25µin (0.63µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 25µin (0.63µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: -
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存6,498
14 (2 x 7)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
-
-55°C ~ 125°C
2-382462-3
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS TIN

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 8 (2 x 4)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存8,010
8 (2 x 4)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic
-55°C ~ 105°C
1-822473-7
TE Connectivity AMP Connectors

CONN SOCKET PLCC 84POS TIN

  • Type: PLCC
  • Number of Positions or Pins (Grid): 84 (4 x 21)
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 100µin (2.54µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 100µin (2.54µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic
  • Operating Temperature: -
封装: -
库存7,704
84 (4 x 21)
0.050" (1.27mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Thermoplastic
-
1-822473-5
TE Connectivity AMP Connectors

CONN SOCKET PLCC 52POS TIN

  • Type: PLCC
  • Number of Positions or Pins (Grid): 52 (4 x 13)
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 100µin (2.54µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 100µin (2.54µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic
  • Operating Temperature: -
封装: -
库存6,336
52 (4 x 13)
0.050" (1.27mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Thermoplastic
-
1571541-3
TE Connectivity AMP Connectors

CONN SOCKET PLCC 68POS TIN

  • Type: PLCC
  • Number of Positions or Pins (Grid): 68 (4 x 17)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 180µin (4.57µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 180µin (4.57µm)
  • Contact Material - Post: Copper Alloy
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -
封装: -
库存4,734
68 (4 x 17)
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Polyphenylene Sulfide (PPS)
-
4-1571552-6
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 20µin (0.51µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 20µin (0.51µm)
  • Contact Material - Post: Copper
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存6,408
20 (2 x 10)
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
20µin (0.51µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
1571541-1
TE Connectivity AMP Connectors

CONN SOCKET PLCC 44POS TIN

  • Type: PLCC
  • Number of Positions or Pins (Grid): 44 (4 x 11)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 180µin (4.57µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 180µin (4.57µm)
  • Contact Material - Post: Copper Alloy
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -
封装: -
库存5,760
44 (4 x 11)
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Polyphenylene Sulfide (PPS)
-
2-5916783-9
TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 370POS GOLD

  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): 370 (19 x 19)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Copper Alloy
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
封装: -
库存5,202
370 (19 x 19)
0.100" (2.54mm)
Gold
Flash
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Copper Alloy
Liquid Crystal Polymer (LCP)
-
2-5916783-8
TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 370POS GOLD

  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): 370 (19 x 19)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Copper Alloy
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
封装: -
库存3,384
370 (19 x 19)
0.100" (2.54mm)
Gold
Flash
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Copper Alloy
Liquid Crystal Polymer (LCP)
-
2-5916783-7
TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 370POS GOLD

  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): 370 (19 x 19)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Copper Alloy
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
封装: -
库存6,066
370 (19 x 19)
0.100" (2.54mm)
Gold
Flash
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Copper Alloy
Liquid Crystal Polymer (LCP)
-
2-5916783-6
TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 370POS GOLD

  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): 370 (19 x 19)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 15µin (0.38µm)
  • Contact Material - Post: Copper Alloy
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
封装: -
库存3,132
370 (19 x 19)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Copper Alloy
Liquid Crystal Polymer (LCP)
-
2-5916783-1
TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 370POS GOLD

  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): 370 (19 x 19)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30µin (0.76µm)
  • Contact Material - Post: Copper Alloy
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
封装: -
库存7,506
370 (19 x 19)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Copper Alloy
Liquid Crystal Polymer (LCP)
-