NXP 产品

MRFE6S9045GNR1

NXP

FET RF 66V 880MHZ TO-270-2

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 22.1dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 350mA
• Power - Output: 10W
• Voltage - Rated: 66V
• Package / Case: TO-270BB
• Supplier Device Package: TO-270 WB-4 Gull

封装: TO-270BB

BFR505T,115

NXP

TRANS NPN 15V 9GHZ SOT-416

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 15V
• Frequency - Transition: 9GHz
• Noise Figure (dB Typ @ f): 1.2dB ~ 2.1dB @ 900MHz
• Gain: -
• Power - Max: 150mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
• Current - Collector (Ic) (Max): 18mA
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75

封装: SC-75, SOT-416

BAV170/ZLR

NXP

DIODE ARRAY GEN PURP 75V SOT23

• Diode Configuration: 1 Pair Common Cathode
• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 75V
• Current - Average Rectified (Io) (per Diode): 215mA (DC)
• Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 3µs
• Current - Reverse Leakage @ Vr: 5nA @ 75V
• Operating Temperature - Junction: 150°C (Max)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

封装: TO-236-3, SC-59, SOT-23-3

MC34727CFCR2

NXP

IC REG BUCK 3.3V 0.6A SYNC 8UDFN

• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Output Type: Fixed
• Number of Outputs: 1
• Voltage - Input (Min): 3.6V
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 3.3V
• Voltage - Output (Max): -
• Current - Output: 600mA
• Frequency - Switching: 2MHz
• Synchronous Rectifier: Yes
• Operating Temperature: -25°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-UFDFN
• Supplier Device Package: 8-QFN-D (2x2)

封装: 8-UFDFN

UBA2024P/N1,112

NXP

IC DRIVER HALF BRIDGE 8-DIP

• Type: CFL/TL Driver
• Frequency: 40.05kHz ~ 42.68kHz
• Voltage - Supply: 11.4 V ~ 13.3 V
• Current - Supply: 5mA
• Current - Output Source/Sink: 900mA
• Dimming: No
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-DIP

封装: 8-DIP (0.300", 7.62mm)

TDA7052B/N1,112

NXP

IC AMP AUDIO 1W MONO AB 8DIP

• Type: Class AB
• Output Type: 1-Channel (Mono)
• Max Output Power x Channels @ Load: 1W x 1 @ 8 Ohm
• Voltage - Supply: 4.5 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Volume Control
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 8-DIP
• Package / Case: 8-DIP (0.300", 7.62mm)

封装: 8-DIP (0.300", 7.62mm)

MC145010DW

NXP

IC SMOKE DETECT WITH I/O 16SOIC

• Type: Smoke Detector
• Input Type: Photoelectric
• Output Type: Voltage
• Interface: -
• Current - Supply: 12µA
• Operating Temperature: -10°C ~ 60°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

封装: 16-SOIC (0.295", 7.50mm Width)

PCA9554CPWJ

NXP

IC GPIO EXPANDER 16TSSOP

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

封装: 16-TSSOP (0.173", 4.40mm Width)

P2010NSE2MHC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Security; SEC 3.3
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

封装: 689-BBGA Exposed Pad

MPC8378VRANGA

NXP

IC MPU MPC83XX 800MHZ 689TEBGA

• Core Processor: PowerPC e300c4s
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

封装: 689-BBGA Exposed Pad

P87C51FA-4A,512

NXP

IC MCU 8BIT 8KB OTP 44PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: POR, PWM
• Number of I/O: 32
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

封装: 44-LCC (J-Lead)

SPC5748GSK1MKU6R

NXP

IC MCU 32BIT 6MB FLASH 176LQFP

• Core Processor: e200z2, e200z4, e200z4
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz/160MHz
• Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 129
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

封装: 176-LQFP

LPC1822JET100E

NXP

IC MCU 32BIT 512KB FLASH 100BGA

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
• Number of I/O: 49
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 16K x 8
• RAM Size: 104K x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 4x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-TFBGA (9x9)

封装: 100-TFBGA

LPC1820FET100,551

NXP

IC MCU 32BIT ROMLESS 100TFBGA

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 168K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-TFBGA (9x9)

封装: 100-TFBGA

LPC1114LVFHI33/303

NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 27
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

封装: 32-VFQFN Exposed Pad

PCF85363ATT1/AJ

NXP

IC RTC CLK/CALENDAR I2C 10TSSOP

• Type: Clock/Calendar
• Features: Alarm, Leap Year, Watchdog Timer
• Memory Size: -
• Time Format: HH:MM:SS:hh (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I2C, 2-Wire Serial
• Voltage - Supply: 0.9 V ~ 5.5 V
• Voltage - Supply, Battery: 0.9 V ~ 5.5 V
• Current - Timekeeping (Max): 0.885µA @ 3.3V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-TSSOP

封装: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)

PCKEP14PW,112

NXP

IC CLK BUFFER 2:5 2GHZ 20TSSOP

• Type: Fanout Buffer (Distribution), Multiplexer
• Number of Circuits: 1
• Ratio - Input:Output: 2:5
• Differential - Input:Output: Yes/Yes
• Input: ECL, HSTL, PECL
• Output: PECL
• Frequency - Max: 2GHz
• Voltage - Supply: 2.375 V ~ 3.8 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

封装: 20-TSSOP (0.173", 4.40mm Width)

IP5002CX8/P,135

NXP

IC MICROPHONE SGL-QUASI DIFF

• Function: Audio Signal Processor
• Applications: Audio Systems
• Number of Channels: 1
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Specifications: -
• Package / Case: -
• Supplier Device Package: -

封装: -

MPX12GP

NXP

SENSOR GAUGE PRESS 1.45PSI MAX

• Pressure Type: Vented Gauge
• Operating Pressure: 1.45 PSI (10 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 55 mV (3V)
• Accuracy: ±5%
• Voltage - Supply: 3 V ~ 6 V
• Port Size: Male - 0.19" (4.93mm) Tube
• Port Style: Barbed
• Features: -
• Termination Style: PCB
• Maximum Pressure: 10.88 PSI (75 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 4-SIP Module
• Supplier Device Package: -

封装: 4-SIP Module

MC13237CHT

NXP

IC RF TXRX+MCU 802.15.4 48-VFLGA

• Type: TxRx + MCU
• RF Family/Standard: 802.15.4
• Protocol: -
• Modulation: O-QPSK
• Frequency: 2.4GHz
• Data Rate (Max): 250kbps
• Power - Output: 2dBm
• Sensitivity: -93dBm
• Memory Size: 128kB Flash, 8kB RAM
• Serial Interfaces: I2C, SPI, UART
• GPIO: 28
• Voltage - Supply: 1.8 V ~ 3.6 V
• Current - Receiving: 22.3mA ~ 34.2mA
• Current - Transmitting: 26.6mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-VFLGA

封装: 48-VFLGA

1323XNSK-SFTW

NXP

1323X_NETWORK_PLUS

• Type: Transceiver; 802.15.4
• Frequency: 2.4GHz
• For Use With/Related Products: MC1323x
• Supplied Contents: 8 Boards, Cables, Power Supply, Accessories

封装: -

UJA1169TK/F/3Z

NXP

MINI HIGH-SPEED CAN SYSTEM BASIS

• Applications: System Basis Chip
• Interface: CAN
• Voltage - Supply: 5V
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

封装: -

PC33MR2001RVKR2

NXP

IC RX 77GHZ RADAR AUTO

• Type: -
• Protocol: -
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

LS1012ASN7EKB

NXP

LS1012A ST 600MHZ RV2

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

封装: -

S9S12ZVL16F0VLF

NXP

MAGNIV 16-BIT MCU S12Z CORE 16

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

A3T21H450W23SR6

NXP

RF MOSFET LDMOS 30V ACP1230S-4

• Transistor Type: LDMOS
• Frequency: 2.11GHz ~ 2.2GHz
• Gain: 15.4dB
• Voltage - Test: 30 V
• Current Rating: 10µA
• Noise Figure: -
• Current - Test: 600 mA
• Power - Output: 87W
• Voltage - Rated: 65 V
• Package / Case: ACP-1230S-4L2S
• Supplier Device Package: ACP-1230S-4L2S

封装: -

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SAF4000EL-101Z230Y

NXP

SAF4000EL

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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TDA18254AHN-C1S1-5

NXP

IC VIDEO SILICON TUNER

• Type: Tuner
• Applications: Consumer Video
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

封装: -

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