Analog Devices Inc. 产品

ADSP-SC571BSWZ-5

Analog Devices Inc.

ARM, 2X SHARC, LQFP PACKAGE, 500

• Type: Fixed/Floating Point
• Interface: CAN, EBI/EMI, Ethernet, DAI, I²C, MMC/SD/SDIO, SPI, SPORT, UART/USART, USB OTG
• Clock Rate: 500MHz, 500MHz
• Non-Volatile Memory: External
• On-Chip RAM: 1.768MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.15V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP-EP (24x24)

封装: 176-LQFP Exposed Pad

ADSP-21573BBCZ-5

Analog Devices Inc.

2X SHARC, DDR, BGA PKG 500 MHZ

• Type: Fixed/Floating Point
• Interface: CAN, EBI/EMI, Ethernet, DAI, I²C, MMC/SD/SDIO, SPI, SPORT, UART/USART, USB OTG
• Clock Rate: 500MHz
• Non-Volatile Memory: External
• On-Chip RAM: 1.768MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.15V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 400-LFBGA, CSPBGA
• Supplier Device Package: 400-CSPBGA (17x17)

封装: 400-LFBGA, CSPBGA

ADSP-21573KBCZ-5

Analog Devices Inc.

2X SHARC, DDR, BGA PKG 500 MHZ

• Type: Fixed/Floating Point
• Interface: CAN, EBI/EMI, Ethernet, DAI, I²C, MMC/SD/SDIO, SPI, SPORT, UART/USART, USB OTG
• Clock Rate: 500MHz
• Non-Volatile Memory: External
• On-Chip RAM: 1.768MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.15V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 400-LFBGA, CSPBGA
• Supplier Device Package: 400-CSPBGA (17x17)

封装: 400-LFBGA, CSPBGA

ADSP-21571BSWZ-5

Analog Devices Inc.

500 MHZ 2X SHARC, LQFP PACKAGE

• Type: Fixed/Floating Point
• Interface: CAN, EBI/EMI, Ethernet, DAI, I²C, MMC/SD/SDIO, SPI, SPORT, UART/USART, USB OTG
• Clock Rate: 500MHz
• Non-Volatile Memory: External
• On-Chip RAM: 1.768MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.15V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP-EP (24x24)

封装: 176-LQFP Exposed Pad

ADSP-21571KSWZ-5

Analog Devices Inc.

500 MHZ 2X SHARC, LQFP PACKAGE

• Type: Fixed/Floating Point
• Interface: CAN, EBI/EMI, Ethernet, DAI, I²C, MMC/SD/SDIO, SPI, SPORT, UART/USART, USB OTG
• Clock Rate: 500MHz
• Non-Volatile Memory: External
• On-Chip RAM: 1.768MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.15V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP-EP (24x24)

封装: 176-LQFP Exposed Pad

ADAU1452WBCPZ150

Analog Devices Inc.

150 MHZ 32BIT SIGMADSP AUDIO PRO

• Type: Sigma
• Interface: I²C, SPI
• Clock Rate: 147.456MHz
• Non-Volatile Memory: ROM (32 kB)
• On-Chip RAM: 160kB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 72-VFQFN Exposed Pad, CSP
• Supplier Device Package: 72-LFCSP-VQ (10x10)

封装: 72-VFQFN Exposed Pad, CSP

ADR4525CRZ-R7

Analog Devices Inc.

2.5V ULTRA LOW NOISE VOLTAGE REF

• Reference Type: Series
• Output Type: Fixed
• Voltage - Output (Min/Fixed): 2.5V
• Voltage - Output (Max): -
• Current - Output: 10mA
• Tolerance: ±0.02%
• Temperature Coefficient: 1ppm/°C
• Noise - 0.1Hz to 10Hz: 1.25µVp-p
• Noise - 10Hz to 10kHz: -
• Voltage - Input: 3V ~ 15V
• Current - Supply: 950µA
• Current - Cathode: -
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

封装: 8-SOIC (0.154", 3.90mm Width)

ADR365WHUJZ-R7

Analog Devices Inc.

5V PWR REF W/SINK/SOURCE

• Reference Type: Series
• Output Type: Fixed
• Voltage - Output (Min/Fixed): 5V
• Voltage - Output (Max): -
• Current - Output: 5mA
• Tolerance: ±0.16%
• Temperature Coefficient: 25ppm/°C
• Noise - 0.1Hz to 10Hz: 12.8µVp-p
• Noise - 10Hz to 10kHz: -
• Voltage - Input: 5.3V ~ 15V
• Current - Supply: 190µA
• Current - Cathode: -
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SOT-23-5 Thin, TSOT-23-5
• Supplier Device Package: TSOT-5

封装: SOT-23-5 Thin, TSOT-23-5

AD841SCHIPS

Analog Devices Inc.

IC OPAMP GP 1 CIRCUIT DIE

• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: -
• Slew Rate: 300V/µs
• Gain Bandwidth Product: 40MHz
• -3db Bandwidth: -
• Current - Input Bias: 3.5µA
• Voltage - Input Offset: 500µV
• Current - Supply: 11mA
• Current - Output / Channel: 50mA
• Voltage - Supply, Single/Dual (±): ±5V ~ 18V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

封装: Die

AD841JCHIPS

Analog Devices Inc.

IC OPAMP GP 1 CIRCUIT DIE

• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: -
• Slew Rate: 300V/µs
• Gain Bandwidth Product: 40MHz
• -3db Bandwidth: -
• Current - Input Bias: 3.5µA
• Voltage - Input Offset: 800µV
• Current - Supply: 11mA
• Current - Output / Channel: 50mA
• Voltage - Supply, Single/Dual (±): ±5V ~ 18V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

封装: Die

ADHV4702-1BCPZ-R7

Analog Devices Inc.

IC OPAMP GP 200V 12LFCSP

• Amplifier Type: General Purpose
• Number of Circuits: -
• Output Type: -
• Slew Rate: 74V/µs
• Gain Bandwidth Product: -
• -3db Bandwidth: -
• Current - Input Bias: -
• Voltage - Input Offset: -
• Current - Supply: 3mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): 24V ~ 220V, ±12V ~ 110V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 12-WQFN Exposed Pad, CSP
• Supplier Device Package: 12-LFCSP (7x7)

封装: 12-WQFN Exposed Pad, CSP

OP2177CRZ-REEL7

Analog Devices Inc.

DUAL, PRECISION LOW NOISE OP AMP

• Amplifier Type: -
• Number of Circuits: -
• Output Type: -
• Slew Rate: -
• Gain Bandwidth Product: -
• -3db Bandwidth: -
• Current - Input Bias: -
• Voltage - Input Offset: -
• Current - Supply: -
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

OP2177CRMZ-R7

Analog Devices Inc.

DUAL, PRECISION LOW NOISE OP AMP

• Amplifier Type: -
• Number of Circuits: -
• Output Type: -
• Slew Rate: -
• Gain Bandwidth Product: -
• -3db Bandwidth: -
• Current - Input Bias: -
• Voltage - Input Offset: -
• Current - Supply: -
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

OP2177CRZ-REEL

Analog Devices Inc.

DUAL, PRECISION LOW NOISE OP AMP

• Amplifier Type: -
• Number of Circuits: -
• Output Type: -
• Slew Rate: -
• Gain Bandwidth Product: -
• -3db Bandwidth: -
• Current - Input Bias: -
• Voltage - Input Offset: -
• Current - Supply: -
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

OP2177CRMZ-REEL

Analog Devices Inc.

DUAL, PRECISION LOW NOISE OP AMP

• Amplifier Type: -
• Number of Circuits: -
• Output Type: -
• Slew Rate: -
• Gain Bandwidth Product: -
• -3db Bandwidth: -
• Current - Input Bias: -
• Voltage - Input Offset: -
• Current - Supply: -
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

OP2177CRZ

Analog Devices Inc.

DUAL, PRECISION LOW NOISE OP AMP

• Amplifier Type: General Purpose
• Number of Circuits: 2
• Output Type: -
• Slew Rate: 0.7V/µs
• Gain Bandwidth Product: 1.3MHz
• -3db Bandwidth: -
• Current - Input Bias: 500pA
• Voltage - Input Offset: 15µV
• Current - Supply: 400µA
• Current - Output / Channel: 10mA
• Voltage - Supply, Single/Dual (±): ±2.5V ~ 15V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

封装: 8-SOIC (0.154", 3.90mm Width)

OP2177CRMZ

Analog Devices Inc.

DUAL, PRECISION LOW NOISE OP AMP

• Amplifier Type: General Purpose
• Number of Circuits: 2
• Output Type: -
• Slew Rate: 0.7V/µs
• Gain Bandwidth Product: 1.3MHz
• -3db Bandwidth: -
• Current - Input Bias: 500pA
• Voltage - Input Offset: 15µV
• Current - Supply: 400µA
• Current - Output / Channel: 10mA
• Voltage - Supply, Single/Dual (±): ±2.5V ~ 15V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

封装: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

ADHV4702-1BCPZ

Analog Devices Inc.

IC OPAMP GP 1 CIRCUIT 12LFCSP

• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: -
• Slew Rate: 74V/µs
• Gain Bandwidth Product: -
• -3db Bandwidth: 10MHz
• Current - Input Bias: 0.3pA
• Voltage - Input Offset: 150µV
• Current - Supply: 3mA
• Current - Output / Channel: 20mA
• Voltage - Supply, Single/Dual (±): 24V ~ 220V, ±12V ~ 110V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 12-WQFN Exposed Pad, CSP
• Supplier Device Package: 12-LFCSP (7x7)

封装: 12-WQFN Exposed Pad, CSP

AD9174BBPZRL

Analog Devices Inc.

DUAL, 16-BIT, 12GSPS DAC

• Type: RF DAC
• Applications: Wireless Infrastructure
• Mounting Type: Surface Mount
• Package / Case: 144-FBGA
• Supplier Device Package: 144-BGA-ED (10x10)

封装: 144-FBGA

AD9176BBPZRL

Analog Devices Inc.

16-BIT 12GSPS RF DAC

• Type: RF DAC
• Applications: Wireless Infrastructure
• Mounting Type: Surface Mount
• Package / Case: 144-FBGA
• Supplier Device Package: 144-BGA-ED (10x10)

封装: 144-FBGA

AD9175BBPZRL

Analog Devices Inc.

11-BIT 12GSPS RF DAC WITH 3GSPS

• Type: RF DAC
• Applications: Wireless Infrastructure
• Mounting Type: Surface Mount
• Package / Case: 144-FBGA
• Supplier Device Package: 144-BGA-ED (10x10)

封装: 144-FBGA

AD9175BBPZ

Analog Devices Inc.

11-BIT 12GSPS RF DAC WITH 3GSPS

• Type: RF DAC
• Applications: Wireless Infrastructure
• Mounting Type: Surface Mount
• Package / Case: 144-FBGA
• Supplier Device Package: 144-BGA-ED (10x10)

封装: 144-FBGA

AD9174BBPZ

Analog Devices Inc.

DUAL, 16-BIT, 12GSPS DAC

• Type: RF DAC
• Applications: Wireless Infrastructure
• Mounting Type: Surface Mount
• Package / Case: 144-FBGA
• Supplier Device Package: 144-BGA-ED (10x10)

封装: 144-FBGA

AD9176BBPZ

Analog Devices Inc.

16-BIT 12GSPS RF DAC

• Type: RF DAC
• Applications: Wireless Infrastructure
• Mounting Type: Surface Mount
• Package / Case: 144-FBGA
• Supplier Device Package: 144-BGA-ED (10x10)

封装: 144-FBGA

ADUCM355BCCZ-RL7

Analog Devices Inc.

16-BIT, LOW POWER SENSOR MICRO

• Core Processor: ARM® Cortex®-M3
• Core Size: 32-Bit
• Speed: 26MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.8V ~ 3.6V
• Data Converters: A/D 12b SAR; D/A 3x12b VDAC
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 72-VFLGA
• Supplier Device Package: 72-LGA (6x6)

封装: 72-VFLGA

ADUCM331WFSBCPZ-RL

Analog Devices Inc.

BATTERY MONITOR GENIII(128KB)

• Core Processor: ARM® Cortex®-M3
• Core Size: 32-Bit
• Speed: 16.384Mhz
• Connectivity: LINbus, SPI
• Peripherals: POR, WDT
• Number of I/O: 6
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 10K x 8
• Voltage - Supply (Vcc/Vdd): 3.6V ~ 19V
• Data Converters: A/D 2x20b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 115°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad, CSP
• Supplier Device Package: 32-LFCSP-VQ (6x6)

封装: 32-VFQFN Exposed Pad, CSP

ADUCM330WFSBCPZ-RL

Analog Devices Inc.

BATTERY MONITOR GEN III(96KB)

• Core Processor: ARM® Cortex®-M3
• Core Size: 32-Bit
• Speed: 16.384Mhz
• Connectivity: LINbus, SPI
• Peripherals: POR, WDT
• Number of I/O: 6
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 10K x 8
• Voltage - Supply (Vcc/Vdd): 3.6V ~ 19V
• Data Converters: A/D 2x20b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 115°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad, CSP
• Supplier Device Package: 32-LFCSP-VQ (6x6)

封装: 32-VFQFN Exposed Pad, CSP

ADUCM355BCCZ

Analog Devices Inc.

16-BIT, LOW POWER SENSOR MICRO

• Core Processor: ARM® Cortex®-M3
• Core Size: 32-Bit
• Speed: 26MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.8V ~ 3.6V
• Data Converters: A/D 12b SAR; D/A 3x12b VDAC
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 72-VFLGA
• Supplier Device Package: 72-LGA (6x6)

封装: 72-VFLGA