页 4 - 用于 IC 的插座，晶体管 - 适配器 | 连接器，互连器件

零件编号	制造商	描述	封装	库存	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
96-100M65	Aries Electronics	SOCKET ADAPTER QFP TO 100PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 100 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封装: -	库存7,596	PGA	100	0.026" (0.65mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
1110267-N	Aries Electronics	SOCKET ADAPTER PLCC TO 68DIP 0.9 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.9" (22.86mm) Row Spacing Number of Pins: 68 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封装: -	库存8,550	DIP, 0.9" (22.86mm) Row Spacing	68	-	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
97-80C251	Aries Electronics	SOCKET ADAPTER DIP TO PLCC Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封装: -	库存5,166	-	-	-	-	-	-	-	-	-	-
96-208M50	Aries Electronics	SOCKET ADAPTER QFP TO 208PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 208 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封装: -	库存3,258	PGA	208	0.020" (0.50mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
97-AQ132D-P	Aries Electronics	SCKT ADPT PQFP-132PGA PANELIZED Convert From (Adapter End): PQFP Convert To (Adapter End): PGA Number of Pins: 132 Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封装: -	库存6,696	PGA	132	0.025" (0.64mm)	Gold	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
48-6645-18	Aries Electronics	SOCKET ADAPTER TQFP TO 48DIP 0.6 Convert From (Adapter End): TQFP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 48 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封装: -	库存7,830	DIP, 0.6" (15.24mm) Row Spacing	48	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
20-353000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 20DIP 0.3 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封装: -	库存8,694	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	Tin-Lead	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
28-354000-20	Aries Electronics	SOCKET ADAPTER DIP TO 28SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 28 Pitch - Mating: - Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封装: -	库存6,678	SOIC	28	-	Gold	Surface Mount	Solder	0.100" (2.54mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
28-650000-10-P	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.6 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封装: -	库存7,956	DIP, 0.6" (15.24mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
16-354W00-20	Aries Electronics	DIP-TO-SOWIC ADAPTER Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Number of Pins: 16 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封装: -	库存3,490	SOWIC	16	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-351000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 24DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封装: -	库存3,258	DIP, 0.3" (7.62mm) Row Spacing	24	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
1107254-40	Aries Electronics	SOCKET ADAPTER DIP TO 40DIP 0.3 Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 40 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封装: -	库存3,762	DIP, 0.3" (7.62mm) Row Spacing	40	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
1106396-40	Aries Electronics	SOCKET ADAPTER DIP TO 40DIP 0.6 Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 40 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封装: -	库存4,374	DIP, 0.6" (15.24mm) Row Spacing	40	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
20-301550-10	Aries Electronics	SOCKET ADAPTER SOIC TO 20PLCC Convert From (Adapter End): SOIC Convert To (Adapter End): PLCC Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封装: -	库存4,554	PLCC	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
18-666000-00	Aries Electronics	SOCKET ADAPTER SOIC TO 18SOWIC Convert From (Adapter End): SOIC Convert To (Adapter End): SOWIC Number of Pins: 18 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封装: -	库存7,326	SOWIC	18	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
32-354000-10	Aries Electronics	SOCKET ADAPTER DIP TO 32SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 32 Pitch - Mating: - Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	封装: -	库存7,524	SOIC	32	-	Gold	Surface Mount	Solder	0.100" (2.54mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
12-666000-00	Aries Electronics	SOCKET ADAPTER SOIC TO 12SOWIC Convert From (Adapter End): SOIC Convert To (Adapter End): SOWIC Number of Pins: 12 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封装: -	库存2,286	SOWIC	12	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
LCQT-QFP0.65-52	Aries Electronics	SOCKET ADAPTER MULT PKG TO 52QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 52 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	封装: -	库存2,124	QFP	52	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
28-350002-10-P	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封装: -	库存3,490	DIP, 0.3" (7.62mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
18-350000-11-RC-P	Aries Electronics	SOCKET ADAPTER SOIC TO 18DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 18 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封装: -	库存8,190	DIP, 0.3" (7.62mm) Row Spacing	18	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
228-4817-19-0602J	3M	RECEPTACLE DIP SOCKET 28POS .4" Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	封装: -	库存4,536	DIP, 0.4" (10.16mm) Row Spacing	28	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
18-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 18DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 18 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封装: -	库存7,056	DIP, 0.3" (7.62mm) Row Spacing	18	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)
PA-SSD6SM18-40	Logical Systems Inc.	ADAPTER 40TSSOP TO 40DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 40 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	封装: -	库存8,820	DIP	40	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
PA-QSD3SM18-16	Logical Systems Inc.	ADAPTER 16QSOP TO 16DIP Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	封装: -	库存7,254	-	-	-	-	-	-	-	-	-	-
18-350000-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 18DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 18 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封装: -	库存7,326	DIP, 0.3" (7.62mm) Row Spacing	18	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)
PA-SOTD3SM18-06	Logical Systems Inc.	SOCKET ADAPTER SOIC TO 6DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP Number of Pins: 6 Pitch - Mating: 0.037" (0.95mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	封装: -	库存7,254	DIP	6	0.037" (0.95mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
PA-SOD3SM18-28	Logical Systems Inc.	SOCKET ADAPTER SOIC TO 28DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	封装: -	库存6,444	DIP	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
16-350000-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 16DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封装: -	库存34,182	DIP, 0.3" (7.62mm) Row Spacing	16	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)
08-350000-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 8DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 8 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封装: -	库存80,514	DIP, 0.3" (7.62mm) Row Spacing	8	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
LCQT-SOIC8-8	Aries Electronics	SOCKET ADAPTER SOIC TO 8DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 8 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	封装: -	库存20,952	DIP, 0.3" (7.62mm) Row Spacing	8	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass

96-100M65

Aries Electronics

SOCKET ADAPTER QFP TO 100PGA

Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Number of Pins: 100
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封装: -

库存7,596

PGA

100

0.026" (0.65mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

1110267-N

Aries Electronics

SOCKET ADAPTER PLCC TO 68DIP 0.9

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.9" (22.86mm) Row Spacing
Number of Pins: 68
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封装: -

库存8,550

DIP, 0.9" (22.86mm) Row Spacing

68

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

97-80C251

Aries Electronics

SOCKET ADAPTER DIP TO PLCC

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封装: -

库存5,166

-

96-208M50

Aries Electronics

SOCKET ADAPTER QFP TO 208PGA

Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Number of Pins: 208
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封装: -

库存3,258

PGA

208

0.020" (0.50mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

97-AQ132D-P

Aries Electronics

SCKT ADPT PQFP-132PGA PANELIZED

Convert From (Adapter End): PQFP
Convert To (Adapter End): PGA
Number of Pins: 132
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封装: -

库存6,696

PGA

132

0.025" (0.64mm)

Gold

Through Hole

Solder

-

Tin-Lead

-

FR4 Epoxy Glass

48-6645-18

Aries Electronics

SOCKET ADAPTER TQFP TO 48DIP 0.6

Convert From (Adapter End): TQFP
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 48
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封装: -

库存7,830

DIP, 0.6" (15.24mm) Row Spacing

48

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

20-353000-10

Aries Electronics

SOCKET ADAPTER PLCC TO 20DIP 0.3

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 20
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封装: -

库存8,694

DIP, 0.3" (7.62mm) Row Spacing

20

0.050" (1.27mm)

Tin-Lead

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

28-354000-20

Aries Electronics

SOCKET ADAPTER DIP TO 28SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 28
Pitch - Mating: -
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封装: -

库存6,678

SOIC

28

-

Gold

Surface Mount

Solder

0.100" (2.54mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

28-650000-10-P

Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.6

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封装: -

库存7,956

DIP, 0.6" (15.24mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

16-354W00-20

Aries Electronics

DIP-TO-SOWIC ADAPTER

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Number of Pins: 16
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封装: -

库存3,490

SOWIC

16

0.100" (2.54mm)

Gold

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

-

24-351000-10

Aries Electronics

SOCKET ADAPTER SSOP TO 24DIP 0.3

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 24
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封装: -

库存3,258

DIP, 0.3" (7.62mm) Row Spacing

24

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

1107254-40

Aries Electronics

SOCKET ADAPTER DIP TO 40DIP 0.3

Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 40
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封装: -

库存3,762

DIP, 0.3" (7.62mm) Row Spacing

40

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

1106396-40

Aries Electronics

SOCKET ADAPTER DIP TO 40DIP 0.6

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 40
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封装: -

库存4,374

DIP, 0.6" (15.24mm) Row Spacing

40

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

20-301550-10

Aries Electronics

SOCKET ADAPTER SOIC TO 20PLCC

Convert From (Adapter End): SOIC
Convert To (Adapter End): PLCC
Number of Pins: 20
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封装: -

库存4,554

PLCC

20

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

18-666000-00

Aries Electronics

SOCKET ADAPTER SOIC TO 18SOWIC

Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Number of Pins: 18
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封装: -

库存7,326

SOWIC

18

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

32-354000-10

Aries Electronics

SOCKET ADAPTER DIP TO 32SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 32
Pitch - Mating: -
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

封装: -

库存7,524

SOIC

32

-

Gold

Surface Mount

Solder

0.100" (2.54mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

12-666000-00

Aries Electronics

SOCKET ADAPTER SOIC TO 12SOWIC

Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Number of Pins: 12
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封装: -

库存2,286

SOWIC

12

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

LCQT-QFP0.65-52

Aries Electronics

SOCKET ADAPTER MULT PKG TO 52QFP

Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Number of Pins: 52
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

封装: -

库存2,124

QFP

52

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

28-350002-10-P

Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封装: -

库存3,490

DIP, 0.3" (7.62mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

18-350000-11-RC-P

Aries Electronics

SOCKET ADAPTER SOIC TO 18DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 18
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封装: -

库存8,190

DIP, 0.3" (7.62mm) Row Spacing

18

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

228-4817-19-0602J

3M

RECEPTACLE DIP SOCKET 28POS .4"

Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

封装: -

库存4,536

DIP, 0.4" (10.16mm) Row Spacing

28

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

18-350000-10

Aries Electronics

SOCKET ADAPTER SOIC TO 18DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 18
Pitch - Mating: -
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封装: -

库存7,056

DIP, 0.3" (7.62mm) Row Spacing

18

-

Tin

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

Polyimide (PI)

PA-SSD6SM18-40

Logical Systems Inc.

ADAPTER 40TSSOP TO 40DIP

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP
Number of Pins: 40
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

封装: -

库存8,820

DIP

40

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

PA-QSD3SM18-16

Logical Systems Inc.

ADAPTER 16QSOP TO 16DIP

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

封装: -

库存7,254

-

18-350000-11-RC

Aries Electronics

SOCKET ADAPTER SOIC TO 18DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 18
Pitch - Mating: -
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封装: -

库存7,326

DIP, 0.3" (7.62mm) Row Spacing

18

-

Tin

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

Polyimide (PI)

PA-SOTD3SM18-06

Logical Systems Inc.

SOCKET ADAPTER SOIC TO 6DIP

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP
Number of Pins: 6
Pitch - Mating: 0.037" (0.95mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

封装: -

库存7,254

DIP

6

0.037" (0.95mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

PA-SOD3SM18-28

Logical Systems Inc.

SOCKET ADAPTER SOIC TO 28DIP

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

封装: -

库存6,444

DIP

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

16-350000-11-RC

Aries Electronics

SOCKET ADAPTER SOIC TO 16DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 16
Pitch - Mating: -
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封装: -

库存34,182

DIP, 0.3" (7.62mm) Row Spacing

16

-

Tin

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

Polyimide (PI)

08-350000-11-RC

Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 8
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封装: -

库存80,514

DIP, 0.3" (7.62mm) Row Spacing

8

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

LCQT-SOIC8-8

Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 8
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

封装: -

库存20,952

DIP, 0.3" (7.62mm) Row Spacing

8

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass