页 148 - 用于 IC 的插座，晶体管 | 连接器，互连器件

643644-6

TE Connectivity AMP Connectors

CONN SOCKET SIP 12POS TIN

Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存5,688

12 (1 x 12)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 105°C

130-024-050

3M

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8µin (0.20µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -65°C ~ 125°C

封装: -

库存5,454

24 (2 x 12)

0.100" (2.54mm)

Gold

8µin (0.20µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

Flash

Brass

Polyphenylene Sulfide (PPS), Glass Filled

-65°C ~ 125°C

SIP050-1X04-157BLF

Amphenol FCI

CONN SOCKET SIP 4POS TIN

Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -

封装: -

库存8,244

4 (1 x 4)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-

8080-1G13

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

封装: -

库存2,214

3 (Oval)

-

Tin

-

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

2-641605-4

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15µin (0.38µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存7,164

28 (2 x 14)

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 125°C

68-536-11

Aries Electronics

CONN SOCKET PLCC ZIF 68POS GOLD

Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 68 (4 x 17)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12µin (0.30µm)
Contact Material - Mating: -
Mounting Type: Through Hole
Features: Open Frame
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存7,740

68 (4 x 17)

0.050" (1.27mm)

Gold

12µin (0.30µm)

-

Through Hole

Open Frame

-

550-10-500M30-001166

Preci-Dip

BGA PIN ADAPTER 1.27MM SMD

Type: BGA
Number of Positions or Pins (Grid): 500 (30 x 30)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存4,446

500 (30 x 30)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

239-5605-02-0602

3M

CONN ZIG-ZAG 39POS GOLD

Type: Zig-Zag
Number of Positions or Pins (Grid): 39 (1 x 19, 1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 150°C

封装: -

库存3,472

39 (1 x 19, 1 x 20)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 150°C

1109800-12

Aries Electronics

CONN IC DIP SOCKET 12POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Programmable
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封装: -

库存5,238

12 (2 x 6)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Programmable

Solder

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-

104-13-648-41-780000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 48POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass Alloy
Housing Material: Thermoplastic
Operating Temperature: -

封装: -

库存7,002

48 (2 x 24)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Press-Fit

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass Alloy

Thermoplastic

-

127-93-628-41-002000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 28POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,436

28 (2 x 14)

0.070" (1.78mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.070" (1.78mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

48-6551-10

Aries Electronics

CONN IC DIP SOCKET ZIF 48POS TIN

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封装: -

库存3,978

48 (2 x 24)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-

16-8380-310C

Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存4,212

16 (2 x 8)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

510-87-210-17-061101

Preci-Dip

CONN SOCKET PGA 210POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 210 (17 x 17)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存5,382

210 (17 x 17)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

16-1508-20

Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6
Operating Temperature: -55°C ~ 105°C

封装: -

库存3,384

16 (2 x 8)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyamide (PA46), Nylon 4/6

-55°C ~ 105°C

APA-624-T-M

Samtec Inc.

ADAPTOR PLUG

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存4,662

-

612-83-648-41-001101

Preci-Dip

CONN IC DIP SOCKET 48POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存6,894

48 (2 x 24)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

34-3513-10T

Aries Electronics

CONN IC DIP SOCKET 34POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 34 (2 x 17)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封装: -

库存3,472

34 (2 x 17)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-

124-83-624-41-002101

Preci-Dip

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存7,668

24 (2 x 12)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

121-83-624-41-001101

Preci-Dip

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,006

24 (2 x 12)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

110-83-632-41-005101

Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存5,400

32 (2 x 16)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

110-93-314-41-605000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,672

14 (2 x 7)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

D01-9950942

Harwin Inc.

CONN SOCKET SIP 9POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 9 (1 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.8µin (5.00µm)
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存4,644

9 (1 x 9)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

196.8µin (5.00µm)

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled

-55°C ~ 125°C

116-83-210-41-008101

Preci-Dip

CONN IC DIP SOCKET 10POS GOLD

Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存8,928

10 (2 x 5)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

116-87-210-41-001101

Preci-Dip

CONN IC DIP SOCKET 10POS GOLD

Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,780

10 (2 x 5)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

D0806-42

Harwin Inc.

CONN IC DIP SOCKET 6POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.8µin (5.00µm)
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存8,406

6 (2 x 3)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

196.8µin (5.00µm)

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled

-55°C ~ 125°C

146-87-308-41-036101

Preci-Dip

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,294

8 (2 x 4)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Press-Fit

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

ED020PLCZ-SM-N

On Shore Technology Inc.

CONN SOCKET PLCC 20POS SMD

Type: PLCC
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -55°C ~ 105°C

封装: -

库存5,418

20 (2 x 10)

0.050" (1.27mm)

-

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

-

Phosphor Bronze

Polyphenylene Sulfide (PPS)

-55°C ~ 105°C