图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 3POS TIN
|
封装: - |
库存7,596 |
|
3 (Oval) | - | Tin | 200µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | 200µin (5.08µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 8POS GOLD
|
封装: - |
库存5,580 |
|
8 (2 x 4) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Brass | Thermoplastic, Polyester | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 8POS GOLD
|
封装: - |
库存5,742 |
|
8 (2 x 4) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Assmann WSW Components |
CONN IC DIP SOCKET 28POS GOLD
|
封装: - |
库存7,758 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS TIN
|
封装: - |
库存7,992 |
|
48 (2 x 24) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Preci-Dip |
BGA PIN ADAPTER 1.27MM SMD
|
封装: - |
库存3,276 |
|
478 (26 x 26) | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
||
Preci-Dip |
BGA SOLDER TAIL
|
封装: - |
库存5,274 |
|
255 (16 x 16) | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 50POS GOLD
|
封装: - |
库存8,694 |
|
50 (2 x 25) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 32POS GOLD
|
封装: - |
库存3,400 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 32POS GOLD
|
封装: - |
库存4,428 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 42POS GOLD
|
封装: - |
库存6,318 |
|
42 (2 x 21) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 30POS GOLD
|
封装: - |
库存2,736 |
|
30 (2 x 15) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
|
封装: - |
库存7,812 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 20POS GOLD
|
封装: - |
库存3,114 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Preci-Dip |
CONN SOCKET PGA 142POS GOLD
|
封装: - |
库存6,480 |
|
142 (15 x 15) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN SOCKET SIP 51POS GOLD
|
封装: - |
库存8,280 |
|
51 (1 x 51) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 36POS GOLD
|
封装: - |
库存8,478 |
|
36 (2 x 18) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 24POS GOLD
|
封装: - |
库存3,508 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Threaded | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 30POS GOLD
|
封装: - |
库存3,510 |
|
30 (1 x 30) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN SOCKET SIP 16POS GOLD
|
封装: - |
库存6,210 |
|
16 (1 x 16) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Preci-Dip |
CONN IC DIP SOCKET 28POS GOLD
|
封装: - |
库存4,068 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 32POS GOLD
|
封装: - |
库存2,718 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Assmann WSW Components |
SOCKET 38 CONTACTS SINGLE ROW
|
封装: - |
库存8,298 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Preci-Dip |
CONN IC DIP SOCKET 16POS GOLD
|
封装: - |
库存4,716 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 10POS GOLD
|
封装: - |
库存5,544 |
|
10 (2 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
3M |
CONN IC DIP SOCKET 32POS TIN
|
封装: - |
库存3,690 |
|
32 (2 x 16) | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
||
Aries Electronics |
CONN IC DIP SOCKET 2POS GOLD
|
封装: - |
库存2,646 |
|
2 (1 x 2) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
On Shore Technology Inc. |
CONN SOCKET PLCC 32POS SMD
|
封装: - |
库存8,304 |
|
32 (2 x 16) | 0.050" (1.27mm) | - | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | - | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
SOCKET ASSY LGA2011-3 0.76UM AU
|
封装: - |
库存8,550 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
|
封装: - |
库存17,268 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | Copper Alloy | Polyester | -55°C ~ 105°C |