页 25 - 嵌入式 - 微控制器，微处理器，FPGA 模块 | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0600-02IMVF	Trenz Electronic GmbH	SOM GIGABEE XC6SLX150 2X128MB 3I Module/Board Type: FPGA Core Processor: Spartan-6 LX-150 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,872	Spartan-6 LX-150	-	125MHz	16MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
3354-GX-XX7-RC	Critical Link LLC	MITYSOM-335X SOM Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3354 Co-Processor: NEON SIMD Speed: 720MHz Flash Size: - RAM Size: 256MB Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,008	ARM? Cortex?-A8, AM3354	NEON SIMD	720MHz	-	256MB	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
CC-9P-V502-MF	Digi International	MODULE 9P 8MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 4MB RAM Size: 8MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存5,376	ARM926EJ-S, NS9215	-	150MHz	4MB	8MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
CC-9C-V226-Z6	Digi International	MODULE 9C 32MB SDRAM 64MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 64MB RAM Size: 32MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,688	ARM926EJ-S, NS9360	-	155MHz	64MB	32MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
SOMXOMAPL138-10-1502QHCR	Logic	SYSTEM ON MODULE LP OMAPL138 Module/Board Type: MPU, DSP Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C6748 Speed: 375MHz Flash Size: 8MB RAM Size: 64MB Connector Type: Board-to-Board (BTB) Socket - 300 Size / Dimension: 1.18" x 1.57" (30mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,360	ARM926EJ-S, OMAP-L138	TMS320C6748	375MHz	8MB	64MB	Board-to-Board (BTB) Socket - 300	1.18" x 1.57" (30mm x 40mm)	0°C ~ 70°C
CC-9C-V212-RJ	Digi International	MODULE 9C 16MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 4MB RAM Size: 16MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存2,112	ARM926EJ-S, NS9360	-	155MHz	4MB	16MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
FS-352	Digi International	MODULE 7U 16MB SDRAM 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 8MB RAM Size: 16MB Connector Type: 48-DIP Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存4,800	ARM7TDMI, NS7520	-	55MHz	8MB	16MB	48-DIP	2.48" x 0.73" (62.9mm x 18.5mm)	0°C ~ 70°C
CENG-LH79520-10-403HC	Logic	CARD ENGINE 32MB SDRAM Module/Board Type: MPU Core Core Processor: ARM720T, LH79520 Co-Processor: - Speed: 77.4MHz Flash Size: 16MB RAM Size: 32MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,520	ARM720T, LH79520	-	77.4MHz	16MB	32MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CC-9U-T724-Z1-B	Digi International	MODULE 9U 32MB SDRAM 16MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存6,704	-	-	-	-	-	-	-	-
TE0300-01IBMLP	Trenz Electronic GmbH	SOM SPARTAN-3E 1600K 666MB DDR Module/Board Type: FPGA, USB Core Core Processor: Spartan-3E Co-Processor: Cypress FX2 USB 2.0 Speed: 100MHz Flash Size: 4MB RAM Size: 64MB Connector Type: B2B Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存5,248	Spartan-3E	Cypress FX2 USB 2.0	100MHz	4MB	64MB	B2B	1.6" x 1.9" (40.5mm x 47.5mm)	0°C ~ 70°C
TE0726-03-07S-1C	Trenz Electronic GmbH	SBC ZYNQBERRY Z-7007S HDMI USB E Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7007S) Speed: 766MHz Flash Size: 16MB RAM Size: 512MB Connector Type: CSI, DSI Size / Dimension: 1.57" x 1.18" (40mm x 30mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,360	ARM Cortex-A9	Zynq-7000 (Z-7007S)	766MHz	16MB	512MB	CSI, DSI	1.57" x 1.18" (40mm x 30mm)	0°C ~ 70°C
SOMAM3703-10-2780HFCR	Logic	SYSTEM ON MODULE LV AM3703 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3703 Co-Processor: - Speed: 1GHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存3,728	ARM? Cortex?-A8, AM3703	-	1GHz	512MB	256MB	Board-to-Board (BTB) Socket - 480	1.23" x 3.01" (31.2mm x 76.5mm)	0°C ~ 70°C
EZ80F916005MODG	Zilog	MODULE EZ80F91 512K 50MHZ Module/Board Type: MCU, Ethernet Core Core Processor: eZ80F91 Co-Processor: - Speed: 50MHz Flash Size: 256KB RAM Size: 16KB (Internal), 128KB (External) Connector Type: Mini-Headers 2x56 Size / Dimension: 2" x 1.9" (50.8mm x 48.3mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,568	eZ80F91	-	50MHz	256KB	16KB (Internal), 128KB (External)	Mini-Headers 2x56	2" x 1.9" (50.8mm x 48.3mm)	0°C ~ 70°C
TE0808-04-06EG-1EE	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 4GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封装: -	库存6,480	Zynq UltraScale+ XCZU6EG-1FFVC900E	-	-	128MB	4GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
DC-VA-MPEG2-8B-60-1080-MD00C-A200T	System-On-Chip (SOC) Technologies Inc.	MOD MPEG2 DEC 60FPS 1080 SODIMM Module/Board Type: FPGA Core Core Processor: Artix-7 XC7A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 512MB Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	Artix-7 XC7A200T	-	200MHz	32MB	512MB	-	-	-
TE0813-01-4DE11-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0741-05-B2C-1-AF	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FFG676C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K160T-2FFG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0782-02-82I33MA	Trenz Electronic GmbH	IC MODULE CORTEX Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7035)	-	32MB	1GB	Board-to-Board (BTB) Socket	3.350" L x 3.350" W (85.00mm x 85.00mm)	-40°C ~ 85°C
TE0818-01-BBE21-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU15EG-1FFVC900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
CC-MX-ZC6D-Z1	Digi	CC 93 SOM SINGLE-CORE ETHERNET Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Co-Processor: - Speed: 250MHz, 1.7GHz Flash Size: 8GB RAM Size: 512MB Connector Type: - Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A55, ARM® Cortex®-M33	-	250MHz, 1.7GHz	8GB	512MB	-	1.770" L x 1.570" W (45.00mm x 40.00mm)	-40°C ~ 85°C
FORLINX-FETA40I-C-121GSE8GEA12	Forlinx Embedded	Allwinner A40iSOM,1GB DDR3,8GB e Module/Board Type: MPU Core Processor: ARM® Cortex®-A7 Co-Processor: - Speed: 1.2GHz Flash Size: 8GB eMMC RAM Size: 1GB Connector Type: Board-to-Board (BTB) 4 x 80 Pin Size / Dimension: 2.700" L x 1.772" W (68.00mm x 45.00mm) Operating Temperature: -25°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A7	-	1.2GHz	8GB eMMC	1GB	Board-to-Board (BTB) 4 x 80 Pin	2.700" L x 1.772" W (68.00mm x 45.00mm)	-25°C ~ 85°C
TE0820-05-2BE21ML	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0808-04-9GI21-AS	Trenz Electronic GmbH	STARTER KIT ZYNQ USCALE+ ZU9 FPG Module/Board Type: FPGA Core Core Processor: Zynq UltraScale+ ZU9 Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ ZU9	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
CC-WMX-FR6D-NN	Digi	CONNECTCORE 8M NANO, SOLOLITE, 8 Module/Board Type: MCU Core Core Processor: ARM® Cortex®-A53 Co-Processor: ARM® Cortex®-M7 Speed: 600MHz, 1.4GHz Flash Size: - RAM Size: 512MB Connector Type: USB Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53	ARM® Cortex®-M7	600MHz, 1.4GHz	-	512MB	USB	1.770" L x 1.570" W (45.00mm x 40.00mm)	-40°C ~ 85°C
TE0813-01-3BE11-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0712-02-100-2CA	Trenz Electronic GmbH	IC MOD ARTIX7 A100T 200MHZ 1GB Module/Board Type: FPGA Core Core Processor: Artix-7 A100T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Artix-7 A100T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
S00005	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TE0745-03-92I31-A	Trenz Electronic GmbH	SOM WITH AMD ZYNQ 7045-2I, 1 GBY Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-2FBG676I Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Xilinx Zynq 7045 SoC XC7Z045-2FBG676I	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C

TE0600-02IMVF

Trenz Electronic GmbH

SOM GIGABEE XC6SLX150 2X128MB 3I

Module/Board Type: FPGA
Core Processor: Spartan-6 LX-150
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,872

Spartan-6 LX-150

-

125MHz

16MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

3354-GX-XX7-RC

Critical Link LLC

MITYSOM-335X SOM

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3354
Co-Processor: NEON SIMD
Speed: 720MHz
Flash Size: -
RAM Size: 256MB
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,008

ARM? Cortex?-A8, AM3354

NEON SIMD

720MHz

-

256MB

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

CC-9P-V502-MF

Digi International

MODULE 9P 8MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存5,376

ARM926EJ-S, NS9215

-

150MHz

4MB

8MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

CC-9C-V226-Z6

Digi International

MODULE 9C 32MB SDRAM 64MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 64MB
RAM Size: 32MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,688

ARM926EJ-S, NS9360

-

155MHz

64MB

32MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

SOMXOMAPL138-10-1502QHCR

Logic

SYSTEM ON MODULE LP OMAPL138

Module/Board Type: MPU, DSP Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C6748
Speed: 375MHz
Flash Size: 8MB
RAM Size: 64MB
Connector Type: Board-to-Board (BTB) Socket - 300
Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,360

ARM926EJ-S, OMAP-L138

TMS320C6748

375MHz

8MB

64MB

Board-to-Board (BTB) Socket - 300

1.18" x 1.57" (30mm x 40mm)

0°C ~ 70°C

CC-9C-V212-RJ

Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存2,112

ARM926EJ-S, NS9360

-

155MHz

4MB

16MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

FS-352

Digi International

MODULE 7U 16MB SDRAM 8MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 8MB
RAM Size: 16MB
Connector Type: 48-DIP
Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存4,800

ARM7TDMI, NS7520

-

55MHz

8MB

16MB

48-DIP

2.48" x 0.73" (62.9mm x 18.5mm)

0°C ~ 70°C

CENG-LH79520-10-403HC

Logic

CARD ENGINE 32MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM720T, LH79520
Co-Processor: -
Speed: 77.4MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,520

ARM720T, LH79520

-

77.4MHz

16MB

32MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CC-9U-T724-Z1-B

Digi International

MODULE 9U 32MB SDRAM 16MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存6,704

-

TE0300-01IBMLP

Trenz Electronic GmbH

SOM SPARTAN-3E 1600K 666MB DDR

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-3E
Co-Processor: Cypress FX2 USB 2.0
Speed: 100MHz
Flash Size: 4MB
RAM Size: 64MB
Connector Type: B2B
Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存5,248

Spartan-3E

Cypress FX2 USB 2.0

100MHz

4MB

64MB

B2B

1.6" x 1.9" (40.5mm x 47.5mm)

0°C ~ 70°C

TE0726-03-07S-1C

Trenz Electronic GmbH

SBC ZYNQBERRY Z-7007S HDMI USB E

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7007S)
Speed: 766MHz
Flash Size: 16MB
RAM Size: 512MB
Connector Type: CSI, DSI
Size / Dimension: 1.57" x 1.18" (40mm x 30mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,360

ARM Cortex-A9

Zynq-7000 (Z-7007S)

766MHz

16MB

512MB

CSI, DSI

1.57" x 1.18" (40mm x 30mm)

0°C ~ 70°C

SOMAM3703-10-2780HFCR

Logic

SYSTEM ON MODULE LV AM3703

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3703
Co-Processor: -
Speed: 1GHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存3,728

ARM? Cortex?-A8, AM3703

-

1GHz

512MB

256MB

Board-to-Board (BTB) Socket - 480

1.23" x 3.01" (31.2mm x 76.5mm)

0°C ~ 70°C

EZ80F916005MODG

Zilog

MODULE EZ80F91 512K 50MHZ

Module/Board Type: MCU, Ethernet Core
Core Processor: eZ80F91
Co-Processor: -
Speed: 50MHz
Flash Size: 256KB
RAM Size: 16KB (Internal), 128KB (External)
Connector Type: Mini-Headers 2x56
Size / Dimension: 2" x 1.9" (50.8mm x 48.3mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,568

eZ80F91

-

50MHz

256KB

16KB (Internal), 128KB (External)

Mini-Headers 2x56

2" x 1.9" (50.8mm x 48.3mm)

0°C ~ 70°C

TE0808-04-06EG-1EE

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 4GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封装: -

库存6,480

Zynq UltraScale+ XCZU6EG-1FFVC900E

-

128MB

4GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

DC-VA-MPEG2-8B-60-1080-MD00C-A200T

System-On-Chip (SOC) Technologies Inc.

MOD MPEG2 DEC 60FPS 1080 SODIMM

Module/Board Type: FPGA Core
Core Processor: Artix-7 XC7A200T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 512MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

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Artix-7 XC7A200T

-

200MHz

32MB

512MB

-

TE0813-01-4DE11-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU4EV-1SFVC784E

-

128MB

2GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0741-05-B2C-1-AF

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FFG676C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

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Xilinx Kintex-7 FPGA XC7K160T-2FFG676C

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

TE0782-02-82I33MA

Trenz Electronic GmbH

IC MODULE CORTEX

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7035)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Zynq-7000 (Z-7035)

-

32MB

1GB

Board-to-Board (BTB) Socket

3.350" L x 3.350" W (85.00mm x 85.00mm)

-40°C ~ 85°C

TE0818-01-BBE21-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU15EG-1FFVC900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

CC-MX-ZC6D-Z1

Digi

CC 93 SOM SINGLE-CORE ETHERNET

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Co-Processor: -
Speed: 250MHz, 1.7GHz
Flash Size: 8GB
RAM Size: 512MB
Connector Type: -
Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A55, ARM® Cortex®-M33

-

250MHz, 1.7GHz

8GB

512MB

-

1.770" L x 1.570" W (45.00mm x 40.00mm)

-40°C ~ 85°C

FORLINX-FETA40I-C-121GSE8GEA12

Forlinx Embedded

Allwinner A40iSOM,1GB DDR3,8GB e

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A7
Co-Processor: -
Speed: 1.2GHz
Flash Size: 8GB eMMC
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) 4 x 80 Pin
Size / Dimension: 2.700" L x 1.772" W (68.00mm x 45.00mm)
Operating Temperature: -25°C ~ 85°C

封装: -

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ARM® Cortex®-A7

-

1.2GHz

8GB eMMC

1GB

Board-to-Board (BTB) 4 x 80 Pin

2.700" L x 1.772" W (68.00mm x 45.00mm)

-25°C ~ 85°C

TE0820-05-2BE21ML

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E

-

128MB

2GB

Pin(s)

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0808-04-9GI21-AS

Trenz Electronic GmbH

STARTER KIT ZYNQ USCALE+ ZU9 FPG

Module/Board Type: FPGA Core
Core Processor: Zynq UltraScale+ ZU9
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Zynq UltraScale+ ZU9

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

CC-WMX-FR6D-NN

Digi

CONNECTCORE 8M NANO, SOLOLITE, 8

Module/Board Type: MCU Core
Core Processor: ARM® Cortex®-A53
Co-Processor: ARM® Cortex®-M7
Speed: 600MHz, 1.4GHz
Flash Size: -
RAM Size: 512MB
Connector Type: USB
Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A53

ARM® Cortex®-M7

600MHz, 1.4GHz

-

512MB

USB

1.770" L x 1.570" W (45.00mm x 40.00mm)

-40°C ~ 85°C

TE0813-01-3BE11-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

2GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0712-02-100-2CA

Trenz Electronic GmbH

IC MOD ARTIX7 A100T 200MHZ 1GB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Artix-7 A100T

-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

S00005

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

TE0745-03-92I31-A

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7045-2I, 1 GBY

Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-2FBG676I
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Xilinx Zynq 7045 SoC XC7Z045-2FBG676I

-

64MB

1GB

Samtec ST5

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C