图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Digi International |
MODULE 9P 32MB SDRAM 32MB FLASH
|
封装: - |
库存7,632 |
|
- | - | - | - | - | - | - | - |
|
|
|
Digi International |
MPU MODULE RABBIT 4000 TWO PACK
|
封装: - |
库存6,448 |
|
- | - | - | - | - | - | - | - |
|
|
|
Logic |
SYSTEM ON MODULE LV OMAP3530
|
封装: - |
库存6,912 |
|
ARM? Cortex?-A8, OMAP3530 | TMS320C64x (DSP) | 600MHz | 256MB (NAND), 8MB (NOR) | 128MB | Board-to-Board (BTB) Socket - 240 | 1.23" x 3.01" (31.2mm x 76.5mm) | -20°C ~ 70°C |
|
|
|
Digi International |
MOD ME 8MB SDRAM 2MB FLASH 1PACK
|
封装: - |
库存7,008 |
|
ARM7TDMI, NS7520 | - | 55MHz | 2MB | 8MB | RJ45 | 1.45" x 0.75" (36.7mm x 19.1mm) | -40°C ~ 85°C |
|
|
Digi International |
MODULE POWERCORE 3800
|
封装: - |
库存6,352 |
|
Rabbit 3000 | - | 51.6MHz | 512KB (Internal), 1MB (External) | 1MB | IDC Header 2x25, 2x5, 1x3mm | 2.35" x 4" (60mm x 102mm) | -40°C ~ 70°C |
|
|
NetBurner Inc. |
PROCESSOR MODULE 512KB FLASH
|
封装: - |
库存6,752 |
|
ColdFire 5282 | - | 66MHz | 512KB | 8.064MB | RJ-45, 2x50 Header | 2.6" x 2" (66.04mm x 50.8mm) | 0°C ~ 70°C |
|
|
|
Digi International |
MODULE 9C 16MB SDRAM 4MB FLASH
|
封装: - |
库存4,464 |
|
ARM926EJ-S, NS9360 | - | 155MHz | 4MB | 16MB | SO-DIMM-144 | 3.59" x 2.06" (91.2mm x 52.2mm) | -40°C ~ 85°C |
|
|
|
Digi International |
EM 8MB SDRAM 4MB FLASH SINGLE
|
封装: - |
库存3,232 |
|
ARM7TDMI, NS7520 | - | 55MHz | 4MB | 8MB | Pin Header | 1.94" x 1.58" (49.2mm x 40.0mm) | -40°C ~ 85°C |
|
|
|
Zilog |
MODULE EZ80F91 512K 50MHZ
|
封装: - |
库存7,536 |
|
eZ80F91 | - | 50MHz | 256KB (Internal), 1MB (External) | 8KB (Internal), 512KB (External) | Header 2x30 | 2.5" x 3.1" (63.5mm x 78.7mm) | 0°C ~ 70°C |
|
|
|
Digi International |
MODULE I.MX51 256MB FLASH 25PK
|
封装: - |
库存6,000 |
|
- | - | - | - | - | - | - | - |
|
|
Trenz Electronic GmbH |
SOM SPARTAN-6 1GB DDR3
|
封装: - |
库存7,008 |
|
Spartan-6 LX-45 | Cypress EZ-USB FX2LP | 100MHz | 8MB | 128MB | B2B | 1.6" x 1.9" (40.5mm x 47.5mm) | -40°C ~ 85°C |
|
|
Trenz Electronic GmbH |
SOM ARDUZYNQ 7Z10 USBOTG MICROSD
|
封装: - |
库存6,512 |
|
ARM Cortex-A9 | Zynq-7000 (Z-7010) | 12MHz | 16MB | 512MB | B2B | - | 0°C ~ 70°C |
|
|
|
Wandboard.Org |
EDM1-IMX6S-MSD SOM 10PK
|
封装: - |
库存7,232 |
|
- | - | - | - | - | - | - | - |
|
|
Trenz Electronic GmbH |
SOM KINTEX-7 325T 32MB FLASH AES
|
封装: - |
库存7,456 |
|
Kintex-7 325T | - | 200MHz | 32MB | - | Samtec LSHM | 1.97" x 1.57" (50mm x 40mm) | -40°C ~ 85°C |
|
|
Logic |
SOM TORPEDO WIRELESS 800MHZ IND
|
封装: - |
库存5,184 |
|
ARM? Cortex?-A8, AM3703 | - | 800MHz | 512MB | 256MB | Board-to-Board (BTB) Socket - 200 | 0.59" x 1.34" (15mm x 34mm) | -40°C ~ 85°C |
|
|
Digi International |
MINICORE MODULE RCM6700
|
封装: - |
库存15,720 |
|
Rabbit 6000 | - | 162.5MHz | 1MB | 1.032MB | Edge Connector - 52 | 1.2" x 2" (30mm x 51mm) | -40°C ~ 85°C |
|
|
|
Digi International |
MODULE DIGI CONNECT ME
|
封装: - |
库存7,424 |
|
- | - | - | - | - | - | - | - |
|
|
|
Critical Link LLC |
MOD MITYSOM-1810F W/AM1810
|
封装: - |
Request a Quote |
|
Spartan-6, XC6SLX16 | Spartan-6, XC6SLX16 | 375MHz | 256MB (NAND), 8MB (NOR) | 8kB (Internal), 128MB (External) | SO-DIMM-200 | 2.660" L x 2.000" W (67.60mm x 50.80mm) | -40°C ~ 85°C |
|
|
|
Trenz Electronic GmbH |
IC MODULE GIGABEE
|
封装: - |
Request a Quote |
|
Xilinx Spartan™ 6 XC6SLX150-3FGG484I | - | 125MHz | 16MB | 512MB | B2B | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
|
|
|
iWave Systems |
Kintex UltraScale+FPGA KU19P SOM
|
封装: - |
Request a Quote |
|
ARM® Cortex®-A7 | - | 1.2GHz | - | 2GB | - | 4.330" L x 2.950" W (110.00mm x 75.00mm) | -40°C ~ 85°C |
|
|
|
Trenz Electronic GmbH |
SOM 1GB DDR3 XC7Z045-1FBG676C
|
封装: - |
Request a Quote |
|
Xilinx Zynq XC7Z045-1FBG676C | - | - | 64MB | 1GB | Samtec ST5 | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 70°C |
|
|
|
Trenz Electronic GmbH |
SOM WITH XILINX ZYNQ 7045-3E AND
|
封装: - |
Request a Quote |
|
Zynq™ 7045 SoC XC7Z045-3FFG676E | ARM Cortex-A9 | - | 64MB | 1GB | Board-to-Board (BTB) Socket | 2.990" L x 2.050" W (76.00mm x 52.00mm) | -40°C ~ 85°C |
|
|
|
Trenz Electronic GmbH |
MOD MPSOC ZU3EG-1E 2GB DDR4 IND
|
封装: - |
Request a Quote |
|
Zynq UltraScale+ XCZU3EG-1SFVC784E | - | - | 128MB | 2GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |
|
|
|
Digi |
IC CONNECT ME 9210 4/8-S 8MB
|
封装: - |
库存210 |
|
ARM926EJ-S, NS9210 | - | 75MHz | 4MB | 8MB | RJ45 | 1.450" L x 0.750" W (36.70mm x 19.10mm) | -40°C ~ 80°C |
|
|
|
Trenz Electronic GmbH |
IC MODULE GIGABEE
|
封装: - |
Request a Quote |
|
Spartan-6 LX-100 | - | 125MHz | 16MB | 256MB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 70°C |
|
|
|
Trenz Electronic GmbH |
MOD MPSOC ZU3CG-1E 2GB DDR4 IND
|
封装: - |
Request a Quote |
|
Zynq UltraScale+ XCZU3CG-1SFVC784E | - | - | 128MB | 2GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |
|
|
|
Forlinx Embedded |
Allwinner T507SOM, 2GB DDR3L, 8G
|
封装: - |
Request a Quote |
|
ARM® Cortex®-A53 | - | 1.5GHz | 8GB eMMC | 2GB | Board-to-Board (BTB) Socket - 240 | 2.760" L x 1.570" W (70.00mm x 40.00mm) | -40°C ~ 85°C |
|
|
|
Trenz Electronic GmbH |
ULTRASOM+ MPSOC-MODULE WITH ZYNQ
|
封装: - |
Request a Quote |
|
Zynq UltraScale+ XCZU9EG-2FFVC900I | - | - | 128MB | 4GB | 4 x 160 Pin | 2.990" L x 2.050" W (76.00mm x 52.00mm) | -40°C ~ 85°C |
|
|
|
Enclustra FPGA Solutions |
SOM ZYNQ XU1 US+ ZU15EG
|
封装: - |
Request a Quote |
|
ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 600MHz, 1.5GHz | 16GB | 4GB | 168 Pin | 2.910" L x 2.130" W (74.00mm x 54.00mm) | -40°C ~ 85°C |
|
|
|
MYIR Tech Limited |
ARM i.MX 8M Mini + Artix-7 FPGA
|
封装: - |
Request a Quote |
|
ARM® Cortex®-A53, ARM® Cortex®-M4 | Xilinx Artix-7 XC7A25T | 1.8GHz | 8GB eMMC, 32MB QSPI | 2GB | Pin(s) | 3.228" L x 1.772" W (82.00mm x 45.00mm) | -40°C ~ 105°C |
