图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU Q OR IQ 2.0GHZ 1295FCBGA
|
封装: 1295-BBGA, FCBGA |
库存7,668 |
|
1 Core, 64-Bit | 2.0GHz | - | DDR3, DDR3L | No | - | 1 Gbps (5), 10 Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | - | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) |
||
NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
|
封装: 783-BBGA, FCBGA |
库存7,008 |
|
1 Core, 32-Bit | 800MHz | Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 90°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 1.2GHZ 1023FCBGA
|
封装: 1023-BFBGA, FCBGA |
库存2,688 |
|
2 Core, 32-Bit | 1.2GHz | Signal Processing; SPE | DDR2, DDR3 | No | - | 10/100/1000 Mbps (4) | - | - | 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BFBGA, FCBGA | 1023-FCPBGA (33x33) |
||
NXP |
IC MPU MPC85XX 600MHZ 783FCBGA
|
封装: 783-BBGA, FCBGA |
库存5,824 |
|
1 Core, 32-Bit | 600MHz | Security; SEC | DDR2, DDR3 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (1) | USB 2.0 (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 833MHZ 783FCBGA
|
封装: 784-BBGA, FCBGA |
库存4,064 |
|
1 Core, 32-Bit | 833MHz | Communications; CPM | DDR, SDRAM | No | - | 10/100/1000 Mbps (2) | - | - | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 784-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC83XX 533MHZ 740TBGA
|
封装: 740-LBGA |
库存5,584 |
|
1 Core, 32-Bit | 533MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 740-LBGA | 740-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
封装: 357-BBGA |
库存4,896 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 66MHZ 256BGA
|
封装: 256-BBGA |
库存6,272 |
|
1 Core, 32-Bit | 66MHz | Communications; RISC CPM | DRAM | No | LCD, Video | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | -40°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC85XX 1.25GHZ 783FCBGA
|
封装: 783-BBGA, FCBGA |
库存3,360 |
|
1 Core, 32-Bit | 1.25GHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 (3) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC82XX 333MHZ 408TBGA
|
封装: 480-LBGA |
库存20,664 |
|
1 Core, 32-Bit | 333MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
Texas Instruments |
OMAP3503EZCBCS
|
封装: - |
库存2,224 |
|
1 Core, 32-Bit | 600MHz | Multimedia; NEON? SIMD | LPDDR | No | LCD | - | - | USB 1.x (3), USB 2.0 (1) | 1.8V, 3.0V | 0°C ~ 90°C (TJ) | - | - | - |
||
NXP |
IC MPU MPC82XX 400MHZ 516BGA
|
封装: 516-BBGA |
库存6,496 |
|
1 Core, 32-Bit | 400MHz | Communications; RISC CPM, Security; SEC | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 516-BBGA | 516-FPBGA (27x27) |
||
Texas Instruments |
IC MPU OMAP-35XX 600MHZ 515FCBGA
|
封装: 515-VFBGA, FCBGA |
库存4,192 |
|
1 Core, 32-Bit | 600MHz | Multimedia; NEON? SIMD | LPDDR | No | LCD | - | - | USB 1.x (3), USB 2.0 (1) | 1.8V, 3.0V | -45°C ~ 85°C (TA) | - | 515-VFBGA, FCBGA | 515-POP-FCBGA (14x14) |
||
NXP |
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
封装: 425-FBGA |
库存2,288 |
|
1 Core, 32-Bit | 1.0GHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | 0°C ~ 105°C (TA) | - | 425-FBGA | 425-TEPBGA I (19x19) |
||
NXP |
I.MX 7D 1.2 GHZ 12X12 MAPBGA
|
封装: 488-TFBGA |
库存7,888 |
|
2 Core, 32-Bit | 1.2GHz | Multimedia; NEON? MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 3.3V | 0°C ~ 85°C (TJ) | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | 488-TFBGA | 488-FBGA (12x12) |
||
NXP |
QORIQ 2XCPU 64-BIT PWR ARCH 1.
|
封装: - |
库存5,568 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
QORIQ 2XCPU 64-BIT PWR ARCH 1.
|
封装: - |
库存2,176 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
LAYERSCAPE 64-BIT ARM CORTEX-A72
|
封装: - |
Request a Quote |
|
2 Core, 64-Bit | 1.5GHz | - | DDR3L, DDR4 | Yes | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | USB 3.0 (2) | - | -40°C ~ 105°C (TA) | Secure Boot, TrustZone® | 448-BFBGA | 448-FBGA (17x17) |
||
NXP |
IC MPU QORIQ LX 2GHZ 1150FBGA
|
封装: - |
Request a Quote |
|
12 Core, 64-Bit | 2GHz | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | 5°C ~ 105°C (TA) | - | 1150-FBGA | 1150-FBGA (23x23) |
||
Renesas Electronics Corporation |
IC
|
封装: - |
Request a Quote |
|
2 Core, 32-Bit | 500MHz | ARM® Cortex®-M3 | DDR2, DDR3 | No | LCD | 10/100/1000Mbps | - | USB 2.0 (2) | 1.5V, 1.8V, 2.5V, 3.3V | -40°C ~ 110°C (TJ) | Boot Security, Secure JTAG | 400-LFBGA | 400-LFBGA (17x17) |
||
Intel |
IC MPU 2.8GHZ 1366FCLGA
|
封装: - |
Request a Quote |
|
4 Core, 64-Bit | 2.8GHz | - | DDR3 | - | - | - | - | - | 0.8V, 1.375V | 67.9°C (TC) | - | 1366-LGA | 1366-FCLGA (42.5x45) |
||
Texas Instruments |
IC MPU DRA72X CORTEX-A15 760BGA
|
封装: - |
Request a Quote |
|
1 Core, 32-Bit | 750MHz | ARM® Cortex®-M4, BB2D, C66x, GPU, IVA | DDR3, DDR3L | Yes | HDMI, LCD | 10/100Mbps (1), 10/100/1000Mbps (1) | SATA | USB 2.0 (2), USB 3.0 (1) | 1.35V, 1.5V, 1.8V, 3.3V | -40°C ~ 125°C (TJ) | Cryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection | 760-BFBGA, FCBGA | 760-FCBGA (23x23) |
||
National Semiconductor |
24 V, 20 MA, DUAL DOLBY B-TYPE N
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Intel |
IC MPU INTEL XEON 2.4GHZ 603PPGA
|
封装: - |
Request a Quote |
|
1 Core, 32-Bit | 2.4GHz | - | - | - | - | - | - | - | 1.475V | 74°C (TC) | - | 603-PGA | 603-PPGA |
||
Intel |
IC MPU 2 1.06GHZ PBGA479
|
封装: - |
Request a Quote |
|
1 Core, 32-Bit | 1.06GHz | - | - | - | - | - | - | - | 1.35V | 0°C ~ 100°C (TJ) | - | 479-BGA | 479-PBGA (35x35) |
||
Rochester Electronics, LLC |
PARALLEL I/O PORT, 16 I/O, NMOS,
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Texas Instruments |
IC MPU 2GHZ 1414FCBGA
|
封装: - |
Request a Quote |
|
8 Core, 64-Bit | 2GHz | ARM® Cortex®-R5F, Multimedia; GPU | LPDDR4 | Yes | eDP, MIPI-DSI | 10/100/1000Mbps (2), 2.5Gbps (8) | - | USB 3.1 (1) | 1.1V, 1.8V, 3.3V | -40°C ~ 105°C (TJ) | 3DES, AES, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA, SMS | 1414-BFBGA, FCBGA | 1414-FCBGA (31x31) |