页 130 - 嵌入式 - 片上系统 (SoC) | 集成电路(IC) | 黑森尔电子
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嵌入式 - 片上系统 (SoC)

记录 5,589
页  130/200
图片
零件编号
制造商
描述
封装
库存
数量
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
10AS027E1F27E1SG
Altera

IC SOC FPGA 240 I/O 672FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 270K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
封装: 672-BBGA, FCBGA
库存4,336
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 270K Logic Elements
0°C ~ 100°C (TJ)
672-BBGA, FCBGA
672-FBGA (27x27)
M2S050S-1FG484I
Microsemi Corporation

IC FPGA SOC 50K LUTS 484FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 50K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
封装: 484-BGA
库存7,232
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 50K Logic Modules
-40°C ~ 100°C (TJ)
484-BGA
484-FPBGA (23x23)
10AS066N2F40I2LG
Altera

IC SOC FPGA 588 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 660K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
封装: 1517-BBGA, FCBGA
库存5,040
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 660K Logic Elements
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
10AS066K2F40I2LG
Altera

IC SOC FPGA 696 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 660K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存5,040
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 660K Logic Elements
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FBGA (40x40)
10AS057K3F35I2SG
Altera

IC SOC FPGA 396 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 570K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
封装: 1152-BBGA, FCBGA
库存5,280
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 570K Logic Elements
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FCBGA (35x35)
5CSEMA6U23C7N
Altera

IC FPGA 145 I/O 672UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: FPGA - 110K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-FBGA
  • Supplier Device Package: 672-UBGA (23x23)
封装: 672-FBGA
库存5,376
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
64KB
DMA, POR, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
FPGA - 110K Logic Elements
0°C ~ 85°C (TJ)
672-FBGA
672-UBGA (23x23)
XCZU11EG-2FFVC1156I
Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
封装: 1156-BBGA, FCBGA
库存2,832
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 653K+ Logic Cells
-40°C ~ 100°C (TJ)
1156-BBGA, FCBGA
1156-FCBGA (35x35)
XCZU5EG-2SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
封装: 784-BBGA, FCBGA
库存5,136
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 256K+ Logic Cells
-40°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
M2S150T-FCS536I
Microsemi Corporation

IC FPGA SOC 150K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 536-LFBGA
  • Supplier Device Package: 536-BGA (16x16)
封装: 536-LFBGA
库存6,752
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 150K Logic Modules
-40°C ~ 100°C (TJ)
536-LFBGA
536-BGA (16x16)
M2S025-1VFG400I
Microsemi Corporation

IC FPGA SOC 25K LUTS 400VFBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-VFBGA (17x17)
封装: 400-LFBGA
库存7,344
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
-40°C ~ 100°C (TJ)
400-LFBGA
400-VFBGA (17x17)
M2S005S-1FGG484
Microsemi Corporation

IC FPGA SOC 5K LUTS 484FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 64KB
  • Peripherals: DDR
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 5K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
封装: 484-BGA
库存6,416
ARM? Cortex?-M3
128KB
64KB
DDR
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 5K Logic Modules
0°C ~ 85°C (TJ)
484-BGA
484-FPBGA (23x23)
M2S050-FGG896
Microsemi Corporation

IC FPGA SOC 896-FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 50K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 896-FBGA
  • Supplier Device Package: 896-FBGA (31x31)
封装: 896-FBGA
库存5,296
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 50K Logic Modules
0°C ~ 85°C (TJ)
896-FBGA
896-FBGA (31x31)
5ASXMB5E4F31I3N
Intel

IC FPGA 170 I/O 896FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: FPGA - 462K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
封装: 896-BBGA, FCBGA
库存2,160
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
FPGA - 462K Logic Elements
-40°C ~ 100°C (TJ)
896-BBGA, FCBGA
896-FBGA (31x31)
AGIB027R31B2E3E
Intel

IC FPGA AGILEX-I 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.7M Logic Elements
0°C ~ 100°C (TJ)
-
-
MIMX9322DVXXMAB
NXP

IC

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
AGFA023R31C3E3V
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
封装: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.3M Logic Elements
0°C ~ 100°C (TJ)
3184-BFBGA Exposed Pad
3184-BGA (56x45)
AGFA014R24B1I1V
Intel

IC FPGA AGILEX-F 2486FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.4M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 1.4M Logic Elements
-40°C ~ 100°C (TJ)
-
-
PLCHIP-P13-51220X1
Divelbiss Corporation

P13 PLC ON A CHIP SINGLE, LQFP-2

  • Architecture: MCU
  • Core Processor: PLC
  • Flash Size: 256KB
  • RAM Size: 32KB
  • Peripherals: LCD, PWM, WDT
  • Connectivity: CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART
  • Speed: 12MHz
  • Primary Attributes: -
  • Operating Temperature: -40°C ~ 85°C (TJ)
  • Package / Case: 208-LQFP
  • Supplier Device Package: 208-LQFP (28x28)
封装: -
Request a Quote
PLC
256KB
32KB
LCD, PWM, WDT
CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART
12MHz
-
-40°C ~ 85°C (TJ)
208-LQFP
208-LQFP (28x28)
PSB21653EV1-4-G
Infineon Technologies

INCA -IP2 SINGLE-CHIP IP PHONE W

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
1SX165HU1F50E2VG
Intel

IC FPGA STRATIX 10 2397FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 1650K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
封装: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 1650K Logic Elements
0°C ~ 100°C (TJ)
2397-BBGA, FCBGA
2397-FBGA, FC (50x50)
AGIB041R29B1E2VB
Intel

IC FPGA AGILEX-I 2957BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 4M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2957-BFBGA Exposed Pad
  • Supplier Device Package: 2957-BGA (56x45)
封装: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 4M Logic Elements
0°C ~ 100°C (TJ)
2957-BFBGA Exposed Pad
2957-BGA (56x45)
AGFA023R25A3E3E
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.3M Logic Elements
0°C ~ 100°C (TJ)
-
-
BCM33843EUKFSBGB0T
Broadcom Limited

CABLE MODEM

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: 2.4GHz, 5GHz
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
-
-
-
-
-
2.4GHz, 5GHz
-
-
-
-
XCVM1402-2MLENBVB1024
AMD

IC VERSALPRIME ACAP FPGA 1024BGA

  • Architecture: MPU, FPGA
  • Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size: -
  • RAM Size: -
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.4GHz
  • Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1024-BFBGA
  • Supplier Device Package: 1024-BGA (31x31)
封装: -
Request a Quote
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
-
-
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.4GHz
Versal™ Prime FPGA, 1.2M Logic Cells
0°C ~ 100°C (TJ)
1024-BFBGA
1024-BGA (31x31)
AGFB027R25A2I2V
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.7M Logic Elements
-40°C ~ 100°C (TJ)
-
-
XCVM1402-1MLINSVF1369
AMD

IC VERSALPRIME ACAP FPGA 1369BGA

  • Architecture: MPU, FPGA
  • Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size: -
  • RAM Size: -
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.3GHz
  • Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1369-BFBGA
  • Supplier Device Package: 1369-BGA (35x35)
封装: -
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
-
-
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.3GHz
Versal™ Prime FPGA, 1.2M Logic Cells
-40°C ~ 100°C (TJ)
1369-BFBGA
1369-BGA (35x35)
AGFA023R24C3E3V
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封装: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.3M Logic Elements
0°C ~ 100°C (TJ)
2340-BFBGA Exposed Pad
2340-BGA (45x42)
AGID019R18A2I3E
Intel

IC FPGA AGILEX-I 1805FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1805-BBGA Exposed Pad
  • Supplier Device Package: 1805-BGA (42.5x42.5)
封装: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 1.9M Logic Elements
-40°C ~ 100°C (TJ)
1805-BBGA Exposed Pad
1805-BGA (42.5x42.5)