页 30 - 嵌入式 - 片上系统 (SoC) | 集成电路(IC) | 黑森尔电子
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嵌入式 - 片上系统 (SoC)

记录 5,589
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图片
零件编号
制造商
描述
封装
库存
数量
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
10AS032E1F29I1SG
Altera

IC SOC FPGA 360 I/O 780FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 320K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封装: 780-BBGA, FCBGA
库存6,416
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 320K Logic Elements
-40°C ~ 100°C (TJ)
780-BBGA, FCBGA
780-FBGA (29x29)
5ASXFB5H6F40C6NES
Altera

IC FPGA 528 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 700MHz
  • Primary Attributes: FPGA - 462K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存3,728
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
700MHz
FPGA - 462K Logic Elements
0°C ~ 85°C (TJ)
1517-BBGA, FCBGA
1517-FBGA (40x40)
XA7Z030-1FBG484I
Xilinx Inc.

VIRTEX-7 FBGA BLOCK FBGA484

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (23x23)
封装: 484-BBGA, FCBGA
库存6,656
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
667MHz
Kintex?-7 FPGA, 125K Logic Cells
-40°C ~ 100°C (TJ)
484-BBGA, FCBGA
484-FCBGA (23x23)
A2F500M3G-PQG208
Microsemi Corporation

IC FPGA 500K GATES 512KB 208QFP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: Ethernet, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
封装: 208-BFQFP
库存3,952
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
Ethernet, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
0°C ~ 85°C (TJ)
208-BFQFP
208-PQFP (28x28)
10AS057K4F40I3LG
Altera

IC SOC FPGA 696 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 570K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
封装: 1517-BBGA, FCBGA
库存7,744
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 570K Logic Elements
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
10AS027E2F29I1HG
Altera

IC SOC FPGA 360 I/O 780FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 270K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封装: 780-BBGA, FCBGA
库存4,128
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 270K Logic Elements
-40°C ~ 100°C (TJ)
780-BBGA, FCBGA
780-FBGA (29x29)
XCZU5CG-L2SFVC784E
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
封装: 784-BBGA, FCBGA
库存3,856
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq?UltraScale+? FPGA, 256K+ Logic Cells
0°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
M2S060-FG676I
Microsemi Corporation

IC FPGA SOC 60K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 60K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
封装: 676-BGA
库存7,664
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 60K Logic Modules
-40°C ~ 100°C (TJ)
676-BGA
676-FBGA (27x27)
M2S060T-1VF400
Microsemi Corporation

IC FPGA SOC 60K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 60K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-VFBGA (17x17)
封装: 400-LFBGA
库存3,856
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 60K Logic Modules
0°C ~ 85°C (TJ)
400-LFBGA
400-VFBGA (17x17)
M2S060-1FCS325
Microsemi Corporation

IC FPGA SOC 60K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 60K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
封装: 325-TFBGA
库存5,808
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 60K Logic Modules
0°C ~ 85°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S050-FCS325I
Microsemi Corporation

IC FPGA SOC 50K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 50K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
封装: 325-TFBGA
库存4,480
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 50K Logic Modules
-40°C ~ 100°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S005S-1VF400I
Microsemi Corporation

IC FPGA SOC 5K LUTS 400VFBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 64KB
  • Peripherals: DDR
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 5K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-VFBGA (17x17)
封装: 400-LFBGA
库存4,496
ARM? Cortex?-M3
128KB
64KB
DDR
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 5K Logic Modules
-40°C ~ 100°C (TJ)
400-LFBGA
400-VFBGA (17x17)
M2S050T-VFG400
Microsemi Corporation

IC FPGA SOC 50K LUTS 400VFBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 50K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-VFBGA (17x17)
封装: 400-LFBGA
库存6,464
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 50K Logic Modules
0°C ~ 85°C (TJ)
400-LFBGA
400-VFBGA (17x17)
10AS057K2F40E1SG
Intel

IC SOC FPGA 696 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 570K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
封装: 1517-BBGA, FCBGA
库存4,320
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 570K Logic Elements
0°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
5ASTFD5K3F40I3NES
Intel

IC FPGA 528 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.05GHz
  • Primary Attributes: FPGA - 462K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存4,768
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.05GHz
FPGA - 462K Logic Elements
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FBGA (40x40)
1SX280LN3F43I2LG
Intel

1760-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2800K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存3,264
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 2800K Logic Elements
-40°C ~ 100°C (TJ)
-
-
G80SC-SM-501
GHI Electronics, LLC

IC SOC CORTEX-M4 180MHZ 100LQFP

  • Architecture: MPU
  • Core Processor: ARM® Cortex®-M4
  • Flash Size: 256KB
  • RAM Size: 156KB
  • Peripherals: PWM
  • Connectivity: CANbus, I²C, SPI, UART/USART
  • Speed: 180MHz
  • Primary Attributes: -
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
封装: 100-LQFP
库存3,872
ARM® Cortex®-M4
256KB
156KB
PWM
CANbus, I²C, SPI, UART/USART
180MHz
-
-40°C ~ 85°C
100-LQFP
100-LQFP (14x14)
AGFB006R24C2E3V
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 573K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 573K Logic Elements
0°C ~ 100°C (TJ)
-
-
CAB003M09DM3
Wolfspeed, Inc.

SIC, MODULE, 2.5M, 900V, 40.8MM,

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
TDA2SXBRQABCRQ1
Texas Instruments

PROTOTYPE

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
XCVM1502-1LLIVSVA2197
AMD

IC VERSALPRIME ACAP FPGA 2197BGA

  • Architecture: MPU, FPGA
  • Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 400MHz, 1GHz
  • Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
  • Operating Temperature: -40°C ~ 110°C (TJ)
  • Package / Case: 2197-BFBGA, FCBGA
  • Supplier Device Package: 2197-FCBGA (45x45)
封装: -
Request a Quote
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
-
256KB
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
400MHz, 1GHz
Versal™ Prime FPGA, 1M Logic Cells
-40°C ~ 110°C (TJ)
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
AGFB012R24D1I2V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.2M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封装: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 1.2M Logic Elements
-40°C ~ 100°C (TJ)
2340-BFBGA Exposed Pad
2340-BGA (45x42)
AGID023R31B2E1V
Intel

IC FPGA AGILEX-I 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
封装: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.3M Logic Elements
0°C ~ 100°C (TJ)
3184-BFBGA Exposed Pad
3184-BGA (56x45)
XAZU1EG-L1SBVA484I
AMD

ZUP MPSOC A53 FPGA Q LP 484BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BFBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (19x19)
封装: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
-
256KB
DMA, WDT
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 600MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 82K Logic Cells
-40°C ~ 100°C (TJ)
484-BFBGA, FCBGA
484-FCBGA (19x19)
5ASTMD3E3F31I5G
Intel

IC SOC CORTEX-A9 800MHZ 896FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: FPGA - 350K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
封装: -
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
FPGA - 350K Logic Elements
-40°C ~ 100°C (TJ)
896-BBGA, FCBGA
896-FBGA (31x31)
XCVM1302-2MLEVFVC1596
AMD

IC VERSALPRIME ACAP FPGA 1596BGA

  • Architecture: MPU, FPGA
  • Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size: -
  • RAM Size: -
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.4GHz
  • Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1596-BFBGA
  • Supplier Device Package: 1596-BGA (37.5x37.5)
封装: -
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
-
-
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.4GHz
Versal™ Prime FPGA, 70k Logic Cells
0°C ~ 100°C (TJ)
1596-BFBGA
1596-BGA (37.5x37.5)
AGFC023R25A2I3V
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.3M Logic Elements
-40°C ~ 100°C (TJ)
-
-
AGFD023R31C2E3E
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
封装: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.3M Logic Elements
0°C ~ 100°C (TJ)
3184-BFBGA Exposed Pad
3184-BGA (56x45)