图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC SOC FPGA 396 I/O 1152FBGA
|
封装: 1152-BBGA, FCBGA |
库存3,264 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 480K Logic Elements | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Altera |
IC SOC FPGA 360 I/O 780FBGA
|
封装: 780-BBGA, FCBGA |
库存2,064 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 270K Logic Elements | 0°C ~ 100°C (TJ) | 780-BBGA, FCBGA | 780-FBGA (29x29) |
||
Altera |
IC FPGA 528 I/O 1517FBGA
|
封装: 1517-BBGA, FCBGA |
库存6,544 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 462K Logic Elements | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
||
Microsemi Corporation |
IC FPGA SOC 60K LUTS
|
封装: 676-BGA |
库存2,640 |
|
ARM? Cortex?-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | 0°C ~ 85°C (TJ) | 676-BGA | 676-FBGA (27x27) |
||
Microsemi Corporation |
IC FPGA SOC 5K LUTS
|
封装: 256-LBGA |
库存5,904 |
|
ARM? Cortex?-M3 | 128KB | 64KB | DDR | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | -40°C ~ 100°C (TJ) | 256-LBGA | 256-FPBGA (17x17) |
||
Broadcom Limited |
CABLE MODEM
|
封装: - |
库存7,296 |
|
- | - | - | - | - | - | - | - | - | - |
||
Intel |
IC SOC FPGA 492 I/O 1152FBGA
|
封装: 1152-BBGA, FCBGA |
库存5,152 |
|
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 570K Logic Elements | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
1152-PIN FBGA
|
封装: - |
库存4,656 |
|
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 480K Logic Elements | -40°C ~ 100°C (TJ) | - | - |
||
Intel |
IC SOC FPGA 492 I/O 1152FBGA
|
封装: 1152-BBGA, FCBGA |
库存5,104 |
|
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 570K Logic Elements | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) |
||
Intel |
IC FPGA 66 I/O 484UBGA
|
封装: 484-FBGA |
库存6,672 |
|
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 85K Logic Elements | -40°C ~ 100°C (TJ) | 484-FBGA | 484-UBGA (19x19) |
||
Xilinx Inc. |
XAZU3EG-L1SFVA625I
|
封装: - |
库存4,400 |
|
- | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC SOC SH-4A 400MHZ 449BGA
|
封装: 449-BGA |
库存6,624 |
|
SH-4A | - | 16KB | DDR | CANbus, I²C, SCI, SD, SSI, USB | 400MHz | - | - | 449-BGA | 449-BGA (21x21) |
||
AMD |
IC ZUP RFSOC A53 FPGA 1156BGA
|
封装: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | - | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq® UltraScale+™ RFSoC | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) |
||
Texas Instruments |
PROTOTYPE
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - |
||
AMD |
IC ZUP MPSOC CG A53 FPGA 484BGA
|
封装: - |
库存72 |
|
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 533MHz, 1.333GHz | - | -40°C ~ 100°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) |
||
Microchip Technology |
IC SOC RISC-V 536LFBGA
|
封装: - |
Request a Quote |
|
RISC-V | 128kB | 1.4125MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 161K Logic Modules | -40°C ~ 100°C | 536-LFBGA, CSPBGA | 536-LFBGA |
||
Intel |
IC FPGA AGILEX-I 3184BGA
|
封装: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) |
||
Intel |
IC FPGA AGILEX-I 1805FBGA
|
封装: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - |
||
Microchip Technology |
IC SOC RISC-V 1152FCBGA
|
封装: - |
库存63 |
|
RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 100°C | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) |
||
AMD |
IC VERSAL AICORE FPGA 1760BGA
|
封装: - |
Request a Quote |
|
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ AI Core FPGA, 1.5M Logic Cells | 0°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) |
||
AMD |
IC VERSAL AI-CORE FPGA 2197BGA
|
封装: - |
Request a Quote |
|
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ AI Core FPGA, 800k Logic Cells | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) |
||
AMD |
IC ZUP RFSOC A53 FPGA 1156BGA
|
封装: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) |
||
Intel |
IC FPGA AGILEX-I 3184FBGA
|
封装: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | 0°C ~ 100°C (TJ) | - | - |
||
Intel |
IC FPGA AGILEX-F 3184FBGA
|
封装: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | -40°C ~ 100°C (TJ) | - | - |
||
Intel |
IC FPGA AGILEX-F 2340FBGA
|
封装: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.4M Logic Elements | -40°C ~ 100°C (TJ) | - | - |
||
Intel |
IC FPGA AGILEX-I 3184BGA
|
封装: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) |
||
Intel |
IC FPGA AGILEX-F 3184FBGA
|
封装: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) |
||
Intel |
IC FPGA AGILEX-F 2486FBGA
|
封装: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.4M Logic Elements | 0°C ~ 100°C (TJ) | - | - |