页 94 - 嵌入式 - 片上系统 (SoC) | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
A2F060M3E-1FG256	Microsemi Corporation	IC FPGA 60K GATES 128KB 256FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	封装: 256-LBGA	库存3,296	ARM? Cortex?-M3	128KB	16KB	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops	0°C ~ 85°C (TJ)	256-LBGA	256-FPBGA (17x17)
A2F500M3G-FGG256	Microsemi Corporation	IC FPGA 512K FLASH 256FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	封装: 256-LBGA	库存3,024	ARM? Cortex?-M3	512KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	80MHz	ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops	0°C ~ 85°C (TJ)	256-LBGA	256-FBGA (17x17)
10AS066K2F35E2LG	Altera	IC SOC FPGA 396 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存2,080	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 660K Logic Elements	0°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FBGA (35x35)
10AS066K4F35I3LG	Altera	IC SOC FPGA 396 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存2,848	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 660K Logic Elements	-40°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FBGA (35x35)
XCZU15EG-1FFVB1156I	Xilinx Inc.	IC FPGA 328 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封装: 1156-BBGA, FCBGA	库存2,496	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.5GHz	Zynq?UltraScale+? FPGA, 747K+ Logic Cells	-40°C ~ 100°C (TJ)	1156-BBGA, FCBGA	1156-FCBGA (35x35)
XCZU3CG-L1SBVA484I	Xilinx Inc.	IC FPGA 82 I/O 484FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	封装: 484-BBGA, FCBGA	库存4,576	Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 1.3GHz	Zynq?UltraScale+? FPGA, 154K+ Logic Cells	-40°C ~ 100°C (TJ)	484-BBGA, FCBGA	484-FCBGA (19x19)
M2S025TS-VFG256I	Microsemi Corporation	IC FPGA SOC 25K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	封装: 256-LBGA	库存4,896	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	256-LBGA	256-FPBGA (17x17)
M2S010-VF256	Microsemi Corporation	IC FPGA SOC 10K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-VFBGA Supplier Device Package: 256-BGA (17x17)	封装: 256-VFBGA	库存4,784	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 10K Logic Modules	0°C ~ 85°C (TJ)	256-VFBGA	256-BGA (17x17)
M2S005S-VFG256	Microsemi Corporation	IC FPGA SOC 5K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	封装: 256-LBGA	库存6,688	ARM? Cortex?-M3	128KB	64KB	DDR	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	0°C ~ 85°C (TJ)	256-LBGA	256-FPBGA (17x17)
10AS066K2F40E1SG	Intel	IC SOC FPGA 696 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA, FCBGA	库存4,256	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 660K Logic Elements	0°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FBGA (40x40)
BCM3384DUIFSBG	Broadcom Limited	CABLE MODEM Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封装: -	库存4,352	-	-	-	-	-	-	-	-	-	-
1SX250LH2F55E1VG	Intel	2912-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存3,248	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 2500K Logic Elements	0°C ~ 100°C (TJ)	-	-
10AS032E2F27E2SG	Intel	672-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存3,648	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 320K Logic Elements	0°C ~ 100°C (TJ)	-	-
10AS032E4F29I3SG	Intel	780-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存3,712	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 320K Logic Elements	-40°C ~ 100°C (TJ)	-	-
5CSXFC5C6U23I7N	Intel	IC FPGA 145 I/O 672UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 85K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	封装: 672-FBGA	库存4,912	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 85K Logic Elements	-40°C ~ 100°C (TJ)	672-FBGA	672-UBGA (23x23)
AMA3B2KK-KBR	Ambiq Micro, Inc.	MCU 96MHZ M4F 2MB FLSH 108BGA Architecture: MCU Core Processor: ARM® Cortex®-M4F Flash Size: 2MB RAM Size: 768KB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: GPIO, I2C, SPI, UART/USART, USB OTG Speed: 96MHz Primary Attributes: - Operating Temperature: -40°C ~ 85°C Package / Case: 108-BGA Supplier Device Package: 108-BGA (5.3x4.3)	封装: -	库存22,164	ARM® Cortex®-M4F	2MB	768KB	Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT	GPIO, I2C, SPI, UART/USART, USB OTG	96MHz	-	-40°C ~ 85°C	108-BGA	108-BGA (5.3x4.3)
XCVM1802-2HSIVSVA2197	AMD	IC VERSALPRIME ACAP FPGA 2197BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz, 1.65GHz Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2197-BFBGA, FCBGA Supplier Device Package: 2197-FCBGA (45x45)	封装: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz, 1.65GHz	Versal™ Prime FPGA, 1.9M Logic Cells	-40°C ~ 100°C (TJ)	2197-BFBGA, FCBGA	2197-FCBGA (45x45)
MPFS160T-1FCVG784E	Microchip Technology	IC SOC RISC-V 784FCBGA Architecture: MPU, FPGA Core Processor: RISC-V Flash Size: 128kB RAM Size: 1.4125MB Peripherals: DMA, PCI, PWM Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG Speed: - Primary Attributes: FPGA - 161K Logic Modules Operating Temperature: 0°C ~ 100°C Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封装: -	库存3	RISC-V	128kB	1.4125MB	DMA, PCI, PWM	CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG	-	FPGA - 161K Logic Modules	0°C ~ 100°C	784-BFBGA, FCBGA	784-FCBGA (23x23)
AGIB041R31B1E1VB	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 4M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封装: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 4M Logic Elements	0°C ~ 100°C (TJ)	3184-BFBGA Exposed Pad	3184-BGA (56x45)
AGIC035R39A1E1VB	Intel	IC FPGA AGILEX-I 3948FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 3.54M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3948-BFBGA Exposed Pad Supplier Device Package: 3948-BGA (56x56)	封装: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 3.54M Logic Elements	0°C ~ 100°C (TJ)	3948-BFBGA Exposed Pad	3948-BGA (56x56)
TCI6630K2LCMSA2	Texas Instruments	PROTOTYPE Architecture: DSP, MPU Core Processor: Dual ARM® Cortex®-A15 MPCore™ with CoreSight™ Flash Size: - RAM Size: - Peripherals: DDR, DMA, PCIe, POR, WDT Connectivity: Ethernet, I2C, PCIe, SPI, UART/USART, USB Speed: 1.2GHz Primary Attributes: - Operating Temperature: -40°C ~ 100°C Package / Case: 900-BFBGA, FCBGA Supplier Device Package: 900-FCBGA (25x25)	封装: -	Request a Quote	Dual ARM® Cortex®-A15 MPCore™ with CoreSight™	-	-	DDR, DMA, PCIe, POR, WDT	Ethernet, I2C, PCIe, SPI, UART/USART, USB	1.2GHz	-	-40°C ~ 100°C	900-BFBGA, FCBGA	900-FCBGA (25x25)
XCZU65DR-L2FSVE1156I	AMD	IC ZUP RFSOC A53 FPGA LP 1156BGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: - Connectivity: - Speed: 533MHz, 1.333GHz Primary Attributes: Zynq® UltraScale+™ RFSoC Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封装: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	-	-	533MHz, 1.333GHz	Zynq® UltraScale+™ RFSoC	-40°C ~ 100°C (TJ)	1156-BBGA, FCBGA	1156-FCBGA (35x35)
AGFA019R24C3E4X	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	封装: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 1.9M Logic Elements	0°C ~ 100°C (TJ)	2340-BFBGA Exposed Pad	2340-BGA (45x42)
MPFS250TS-1FCVG784I	Microchip Technology	IC SOC RISC-V 784FCBGA Architecture: MPU, FPGA Core Processor: RISC-V Flash Size: 128kB RAM Size: 2.2MB Peripherals: DMA, PCI, PWM Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG Speed: - Primary Attributes: FPGA - 254K Logic Modules Operating Temperature: -40°C ~ 100°C Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封装: -	库存6	RISC-V	128kB	2.2MB	DMA, PCI, PWM	CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG	-	FPGA - 254K Logic Modules	-40°C ~ 100°C	784-BFBGA, FCBGA	784-FCBGA (23x23)
AGFD023R24C2I3E	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	封装: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.3M Logic Elements	-40°C ~ 100°C (TJ)	2340-BFBGA Exposed Pad	2340-BGA (45x42)
1SX280HH3F55I3VG	Intel	IC FPGA STRATIX 10 2912FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	封装: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 2800K Logic Elements	-40°C ~ 100°C (TJ)	2912-BBGA, FCBGA	2912-FBGA, FC (55x55)
XCZU47DR-2FSVE1156E	AMD	IC ZUP RFSOC A53 FPGA 1156BGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.333GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封装: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 1.333GHz	Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	0°C ~ 100°C (TJ)	1156-BBGA, FCBGA	1156-FCBGA (35x35)
XCVM1802-2MSIVSVA2197	AMD	IC VERSAL AICORE FPGA 2197BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.4GHz Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2197-BFBGA, FCBGA Supplier Device Package: 2197-FCBGA (45x45)	封装: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.4GHz	Versal™ Prime FPGA, 1.9M Logic Cells	-40°C ~ 100°C (TJ)	2197-BFBGA, FCBGA	2197-FCBGA (45x45)

A2F060M3E-1FG256

Microsemi Corporation

IC FPGA 60K GATES 128KB 256FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)

封装: 256-LBGA

库存3,296

ARM? Cortex?-M3

128KB

16KB

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

100MHz

ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops

0°C ~ 85°C (TJ)

256-LBGA

256-FPBGA (17x17)

A2F500M3G-FGG256

Microsemi Corporation

IC FPGA 512K FLASH 256FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

封装: 256-LBGA

库存3,024

ARM? Cortex?-M3

512KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

80MHz

ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops

0°C ~ 85°C (TJ)

256-LBGA

256-FBGA (17x17)

10AS066K2F35E2LG

Altera

IC SOC FPGA 396 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 660K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存2,080

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 660K Logic Elements

0°C ~ 100°C (TJ)

1152-BBGA, FCBGA

1152-FBGA (35x35)

10AS066K4F35I3LG

Altera

IC SOC FPGA 396 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 660K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存2,848

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 660K Logic Elements

-40°C ~ 100°C (TJ)

1152-BBGA, FCBGA

1152-FBGA (35x35)

XCZU15EG-1FFVB1156I

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封装: 1156-BBGA, FCBGA

库存2,496

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?

-

256KB

DMA, WDT

CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

600MHz, 1.5GHz

Zynq?UltraScale+? FPGA, 747K+ Logic Cells

-40°C ~ 100°C (TJ)

1156-BBGA, FCBGA

1156-FCBGA (35x35)

XCZU3CG-L1SBVA484I

Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (19x19)

封装: 484-BBGA, FCBGA

库存4,576

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?

-

256KB

DMA, WDT

CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

533MHz, 1.3GHz

Zynq?UltraScale+? FPGA, 154K+ Logic Cells

-40°C ~ 100°C (TJ)

484-BBGA, FCBGA

484-FCBGA (19x19)

M2S025TS-VFG256I

Microsemi Corporation

IC FPGA SOC 25K LUTS

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 25K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)

封装: 256-LBGA

库存4,896

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 25K Logic Modules

-40°C ~ 100°C (TJ)

256-LBGA

256-FPBGA (17x17)

M2S010-VF256

Microsemi Corporation

IC FPGA SOC 10K LUTS

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-VFBGA
Supplier Device Package: 256-BGA (17x17)

封装: 256-VFBGA

库存4,784

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 10K Logic Modules

0°C ~ 85°C (TJ)

256-VFBGA

256-BGA (17x17)

M2S005S-VFG256

Microsemi Corporation

IC FPGA SOC 5K LUTS

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 128KB
RAM Size: 64KB
Peripherals: DDR
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 5K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)

封装: 256-LBGA

库存6,688

ARM? Cortex?-M3

128KB

64KB

DDR

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 5K Logic Modules

0°C ~ 85°C (TJ)

256-LBGA

256-FPBGA (17x17)

10AS066K2F40E1SG

Intel

IC SOC FPGA 696 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 660K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

库存4,256

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 660K Logic Elements

0°C ~ 100°C (TJ)

1517-BBGA, FCBGA

1517-FBGA (40x40)

BCM3384DUIFSBG

Broadcom Limited

CABLE MODEM

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封装: -

库存4,352

-

1SX250LH2F55E1VG

Intel

2912-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存3,248

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 2500K Logic Elements

0°C ~ 100°C (TJ)

-

10AS032E2F27E2SG

Intel

672-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存3,648

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 320K Logic Elements

0°C ~ 100°C (TJ)

-

10AS032E4F29I3SG

Intel

780-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存3,712

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 320K Logic Elements

-40°C ~ 100°C (TJ)

-

5CSXFC5C6U23I7N

Intel

IC FPGA 145 I/O 672UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 85K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)

封装: 672-FBGA

库存4,912

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

64KB

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

800MHz

FPGA - 85K Logic Elements

-40°C ~ 100°C (TJ)

672-FBGA

672-UBGA (23x23)

AMA3B2KK-KBR

Ambiq Micro, Inc.

MCU 96MHZ M4F 2MB FLSH 108BGA

Architecture: MCU
Core Processor: ARM® Cortex®-M4F
Flash Size: 2MB
RAM Size: 768KB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: GPIO, I2C, SPI, UART/USART, USB OTG
Speed: 96MHz
Primary Attributes: -
Operating Temperature: -40°C ~ 85°C
Package / Case: 108-BGA
Supplier Device Package: 108-BGA (5.3x4.3)

封装: -

库存22,164

ARM® Cortex®-M4F

2MB

768KB

Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

GPIO, I2C, SPI, UART/USART, USB OTG

96MHz

-

-40°C ~ 85°C

108-BGA

108-BGA (5.3x4.3)

XCVM1802-2HSIVSVA2197

AMD

IC VERSALPRIME ACAP FPGA 2197BGA

Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz, 1.65GHz
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2197-BFBGA, FCBGA
Supplier Device Package: 2197-FCBGA (45x45)

封装: -

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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

-

256KB

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

800MHz, 1.65GHz

Versal™ Prime FPGA, 1.9M Logic Cells

-40°C ~ 100°C (TJ)

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

MPFS160T-1FCVG784E

Microchip Technology

IC SOC RISC-V 784FCBGA

Architecture: MPU, FPGA
Core Processor: RISC-V
Flash Size: 128kB
RAM Size: 1.4125MB
Peripherals: DMA, PCI, PWM
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed: -
Primary Attributes: FPGA - 161K Logic Modules
Operating Temperature: 0°C ~ 100°C
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封装: -

库存3

RISC-V

128kB

1.4125MB

DMA, PCI, PWM

CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

-

FPGA - 161K Logic Modules

0°C ~ 100°C

784-BFBGA, FCBGA

784-FCBGA (23x23)

AGIB041R31B1E1VB

Intel

IC

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 4M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封装: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 4M Logic Elements

0°C ~ 100°C (TJ)

3184-BFBGA Exposed Pad

3184-BGA (56x45)

AGIC035R39A1E1VB

Intel

IC FPGA AGILEX-I 3948FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 3.54M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 3948-BFBGA Exposed Pad
Supplier Device Package: 3948-BGA (56x56)

封装: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 3.54M Logic Elements

0°C ~ 100°C (TJ)

3948-BFBGA Exposed Pad

3948-BGA (56x56)

TCI6630K2LCMSA2

Texas Instruments

PROTOTYPE

Architecture: DSP, MPU
Core Processor: Dual ARM® Cortex®-A15 MPCore™ with CoreSight™
Flash Size: -
RAM Size: -
Peripherals: DDR, DMA, PCIe, POR, WDT
Connectivity: Ethernet, I2C, PCIe, SPI, UART/USART, USB
Speed: 1.2GHz
Primary Attributes: -
Operating Temperature: -40°C ~ 100°C
Package / Case: 900-BFBGA, FCBGA
Supplier Device Package: 900-FCBGA (25x25)

封装: -

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Dual ARM® Cortex®-A15 MPCore™ with CoreSight™

-

DDR, DMA, PCIe, POR, WDT

Ethernet, I2C, PCIe, SPI, UART/USART, USB

1.2GHz

-

-40°C ~ 100°C

900-BFBGA, FCBGA

900-FCBGA (25x25)

XCZU65DR-L2FSVE1156I

AMD

IC ZUP RFSOC A53 FPGA LP 1156BGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: -
Connectivity: -
Speed: 533MHz, 1.333GHz
Primary Attributes: Zynq® UltraScale+™ RFSoC
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封装: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

-

256KB

-

533MHz, 1.333GHz

Zynq® UltraScale+™ RFSoC

-40°C ~ 100°C (TJ)

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AGFA019R24C3E4X

Intel

IC FPGA AGILEX-F 2340BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

封装: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 1.9M Logic Elements

0°C ~ 100°C (TJ)

2340-BFBGA Exposed Pad

2340-BGA (45x42)

MPFS250TS-1FCVG784I

Microchip Technology

IC SOC RISC-V 784FCBGA

Architecture: MPU, FPGA
Core Processor: RISC-V
Flash Size: 128kB
RAM Size: 2.2MB
Peripherals: DMA, PCI, PWM
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed: -
Primary Attributes: FPGA - 254K Logic Modules
Operating Temperature: -40°C ~ 100°C
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封装: -

库存6

RISC-V

128kB

2.2MB

DMA, PCI, PWM

CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

-

FPGA - 254K Logic Modules

-40°C ~ 100°C

784-BFBGA, FCBGA

784-FCBGA (23x23)

AGFD023R24C2I3E

Intel

IC FPGA AGILEX-F 2340BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

封装: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 2.3M Logic Elements

-40°C ~ 100°C (TJ)

2340-BFBGA Exposed Pad

2340-BGA (45x42)

1SX280HH3F55I3VG

Intel

IC FPGA STRATIX 10 2912FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2912-BBGA, FCBGA
Supplier Device Package: 2912-FBGA, FC (55x55)

封装: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 2800K Logic Elements

-40°C ~ 100°C (TJ)

2912-BBGA, FCBGA

2912-FBGA, FC (55x55)

XCZU47DR-2FSVE1156E

AMD

IC ZUP RFSOC A53 FPGA 1156BGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.333GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封装: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

-

256KB

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

533MHz, 1.333GHz

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

0°C ~ 100°C (TJ)

1156-BBGA, FCBGA

1156-FCBGA (35x35)

XCVM1802-2MSIVSVA2197

AMD

IC VERSAL AICORE FPGA 2197BGA

Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.4GHz
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2197-BFBGA, FCBGA
Supplier Device Package: 2197-FCBGA (45x45)

封装: -

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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

-

256KB

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

600MHz, 1.4GHz

Versal™ Prime FPGA, 1.9M Logic Cells

-40°C ~ 100°C (TJ)

2197-BFBGA, FCBGA

2197-FCBGA (45x45)