图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CONTROLLER PCM 100TQFP
|
封装: 100-LQFP |
库存3,632 |
|
ISDN | - | - | - | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | P-TQFP-100 |
||
Infineon Technologies |
IC LINE CARD CTRLR DSP TQFP-100
|
封装: 100-LQFP |
库存6,000 |
|
ISDN | - | 3.13 V ~ 3.47 V | 272.6mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | P-TQFP-100 |
||
Silicon Labs |
IC PROSLIC FXS DTMF -110V 42QFN
|
封装: 42-WFQFN Exposed Pad |
库存6,896 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC PROSLIC LINE FEED 135V 40QFN
|
封装: 40-VFQFN Exposed Pad |
库存3,232 |
|
PCM | 2 | - | - | - | - | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144-CSBGA
|
封装: 144-BGA, CSPBGA |
库存5,008 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 220mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
IDT, Integrated Device Technology Inc |
IC FRAMER T1/J1/E1 8CH 128QFP
|
封装: 128-BFQFP |
库存6,416 |
|
Parallel | 8 | 2.97 V ~ 3.63 V | 160mA | - | -40°C ~ 85°C | Surface Mount | 128-BFQFP | 128-PQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC LIU E1 8CH SHORT HAUL 160-BGA
|
封装: 160-BGA |
库存4,368 |
|
- | - | 3.13 V ~ 3.47 V | - | - | - | Surface Mount | 160-BGA | 160-PBGA (15x15) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II QUAD 256LBGA
|
封装: 256-LBGA Exposed Pad |
库存4,816 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 830mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
封装: 144-BGA, CSPBGA |
库存4,256 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC 12CH DS3/E3/STS1 LIU 484-BGA
|
封装: 484-BGA |
库存5,072 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 28SOIC
|
封装: 28-SOIC (0.295", 7.50mm Width) |
库存4,432 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Exar Corporation |
IC LIU/FRAMER 28CHAN 568BGA
|
封装: - |
库存18,108 |
|
- | - | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Maxim Integrated |
IC TXRX T1/E1/J1 1 CHIP 100CSBGA
|
封装: 100-LFBGA, CSPBGA |
库存5,856 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Silicon Labs |
IC PROSLIC FXS DTMF -106V 36QFN
|
封装: - |
库存6,784 |
|
3-Wire | 1 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 20-SOIC
|
封装: 20-SOIC (0.295", 7.50mm Width) |
库存3,536 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Solutions Sdn Bhd. |
IC ETHERNET RGMII/RMII 48-QFN
|
封装: - |
库存8,736 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | - | 48-QFN (6x6) |
||
Microsemi Corporation |
84/63 CHAN T1/E1 VT1.5/VT2 MAPPE
|
封装: - |
库存2,528 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL2/ADSL2 R
|
封装: - |
库存9,480 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DIGITAL SWITCH 16K CH 256BGA
|
封装: 256-BGA |
库存6,240 |
|
- | 1 | 1.71V ~ 1.89V | 240mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC TDM/TSI SWITCH 512X256 44MQFP
|
封装: 44-QFP |
库存3,312 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | 44-QFP | 44-MQFP (10x10) |
||
Microchip Technology |
IC SLIC 2CH RINGING MTRG 44TQFP
|
封装: 44-TQFP |
库存2,720 |
|
2-Wire | 1 | - | - | - | - | Surface Mount | 44-TQFP | 44-TQFP |
||
Microchip Technology |
IC SLIC 2CH UNIV 100V 48QFN
|
封装: - |
库存7,088 |
|
Parallel | 2 | 3.3V | 40mA | - | - | Surface Mount | - | 48-QFN |
||
Broadcom Limited |
STRATAXGS MULTI-LAYER SWITCH W
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
TELECOM IC
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
SERIAL 10-GIGABIT ETHERNET/FIBRE
|
封装: - |
Request a Quote |
|
Serial, XAUI | 1 | - | - | - | - | Surface Mount | 256-BGA | 256-FBGA |
||
Intersil |
TELECOM CIRCUIT, 1-FUNC, BIMOS
|
封装: - |
Request a Quote |
|
- | 1 | 4.5V ~ 5.5V | - | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Broadcom Limited |
10G XPON HGU WITH 2XHSGMII
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
ETH SWITCH 24FE 4X2.5G MULTILAYE
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
FLEXISLIC SLIC
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
EIA/ITU PABX SLIC WITH 30MILLI A
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |