图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC LIU E1/T1/J1 144TQFP
|
封装: 144-LQFP |
库存2,944 |
|
E1, J1, SCI, SPI, T1 | 2 | 1.8V, 3.3V | - | 150mW | -40°C ~ 85°C | Surface Mount | 144-LQFP | PG-TQFP-144 |
||
Maxim Integrated |
IC FRAMER OCTAL T1/E1 CSBGA
|
封装: 256-LBGA, CSBGA |
库存20,568 |
|
WAN | 8 | 3.135 V ~ 3.465 V | 275mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Maxim Integrated |
IC TXRX FRONT-END 50MSPS 64LQFP
|
封装: 64-LQFP |
库存4,160 |
|
Serial | 1 | 3 V ~ 3.6 V | 150mA, 220mA | 2W | -40°C ~ 105°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
||
Silicon Labs |
IC SLIC/CODEC PROG 1CH 38TSSOP
|
封装: 38-TFSOP (0.173", 4.40mm Width) |
库存37,164 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 170MA 8FLTPK
|
封装: 8-SMD, Gull Wing |
库存5,792 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-Flatpack |
||
Microsemi Corporation |
IC DGTL SWITCH 2048X2048 100MQFP
|
封装: 100-BQFP |
库存3,408 |
|
- | 1 | 3 V ~ 3.6 V | 45mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | 100-MQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 1CH 44-TQFP
|
封装: 44-LQFP |
库存4,864 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP |
||
Texas Instruments |
IC SOURCE RINGER CTRLR 28SOIC
|
封装: 28-SOIC (0.295", 7.50mm Width) |
库存13,116 |
|
- | 1 | 5V | 500µA | - | 0°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8FLPK
|
封装: 8-SMD, Gull Wing |
库存2,064 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-Flatpack |
||
Texas Instruments |
IC LINE DRIVE AMP DIFF 24VQFN
|
封装: - |
库存5,168 |
|
- | 1 | 10 V ~ 28 V | 21mA | - | -40°C ~ 85°C | - | - | - |
||
Microsemi Solutions Sdn Bhd. |
52-PORT L2/L3 STACKABLE GIGABIT
|
封装: - |
库存4,816 |
|
PCI | 1 | - | - | - | -40°C ~ 110°C | Surface Mount | - | 672-FCBGA (27x27) |
||
Maxim Integrated |
IC TXRX E1 1-CHIP 5V 100-LQFP
|
封装: 100-LQFP |
库存4,112 |
|
E1, HDLC, J1, T1 | 1 | 4.75 V ~ 5.25 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microsemi Solutions Sdn Bhd. |
DUAL PORT GIGABIT DUAL MEDIA R/S
|
封装: - |
库存5,056 |
|
- | 1 | 1V | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
Texas Instruments |
IC SOURCE RINGER CONTR 28-SOIC
|
封装: 28-SOIC (0.295", 7.50mm Width) |
库存16,188 |
|
- | 1 | 5V | 500µA | - | 0°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Maxim Integrated |
IC TXRX E1 1-CHIP 3.3V 100-LQFP
|
封装: 100-LQFP |
库存41,388 |
|
E1, HDLC | 1 | 3.14 V ~ 3.47 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
NXP |
CABLE FST DEMOD 4TS DAC
|
封装: - |
库存5,680 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
ETH SWITCH 24GE 4X10GE
|
封装: - |
库存5,472 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SINGLE 10G (R)XAUI PHY WITH PREM
|
封装: - |
库存7,728 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
4P 10G WAN/LAN XFI-SFI 1588 PHY
|
封装: 256-BBGA |
库存3,312 |
|
SPI | 4 | 1V, 1.2V | - | - | - | Surface Mount | 256-BBGA | 256-FCBGA (17x17) |
||
Microchip Technology |
TQFP48, GREEN, IND, MRLB, NO FLA
|
封装: 48-TQFP |
库存26,100 |
|
SPI | 1 | 3 V ~ 3.6 V | - | - | -40°C ~ 85°C | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
Broadcom Limited |
MULTI LAYER SWITCH--1588 DISABLE
|
封装: - |
库存3,424 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
4X10GE + 4X10GE/HG2 L3 SWITCH
|
封装: - |
库存7,744 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SINGLE-CHIP SONET/SDH TRANSPORT
|
封装: - |
库存4,944 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TDM SWITCH 2K-CH ENH 256BGA
|
封装: 256-BGA |
库存5,088 |
|
- | 1 | 1.71V ~ 1.89V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Infineon Technologies |
SWITI MTSI-L SWITCHING IC
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
PMC-Sierra |
PHY 4-CH 1.0625GBPS/2.125GBPS 32
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
EPON/GPON 1XGE, 1XFE PROCESSOR (
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
FEATURE/COST REDUCTION VERION OF
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |