图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC LINE INTERFACE SLIC PDSO-24
|
封装: 24-SOIC (0.295", 7.50mm Width) |
库存5,232 |
|
- | 1 | 5V | 2.8mA | 290mW | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | PG-DSO-24 |
||
Microsemi Corporation |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
封装: 80-LQFP |
库存3,136 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microsemi Corporation |
IC SLIC 1CH UNIV 10V 28PLCC
|
封装: - |
库存116,580 |
|
Parallel | 1 | 3.3V | 40mA | - | - | Surface Mount | - | 28-PLCC |
||
Maxim Integrated |
IC TXRX QUAD T1/E1/J1 256CSBGA
|
封装: 256-LBGA, CSBGA |
库存2,672 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 260mA | - | - | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 4CH 176LQFP
|
封装: 176-LQFP |
库存6,800 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 450mA | - | -40°C ~ 85°C | Surface Mount | 176-LQFP | 176-TQFP (24x24) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II DUAL 196LBGA
|
封装: 196-LBGA |
库存3,280 |
|
LVTTL | 2 | 3.135 V ~ 3.465 V | 570mA | - | 0°C ~ 70°C | Surface Mount | 196-LBGA | 196-FBGA (15x15) |
||
Maxim Integrated |
IC ELASTIC STORE T1/CEPT 16-SOIC
|
封装: 16-SOIC (0.295", 7.50mm Width) |
库存4,736 |
|
PCM | 1 | 4.5 V ~ 5.5 V | 9mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC TXRX T1 1-CHIP 3.3V 100-BGA
|
封装: 100-LFBGA, CSPBGA |
库存5,584 |
|
HDLC, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Microsemi Corporation |
IC DGTL SWITCH IDX 64X64 68PLCC
|
封装: 68-LCC (J-Lead) |
库存5,456 |
|
- | 1 | 4.5 V ~ 5.5 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC |
||
Maxim Integrated |
IC CHIPSET ETH OVER COAX CSBGA
|
封装: - |
库存6,944 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
封装: 80-LQFP |
库存9,060 |
|
PCM | 2 | 4.75 V ~ 35 V | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
封装: - |
库存14,100 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Rohm Semiconductor |
IC SOUND GENERATOR LSI QFN28V TR
|
封装: 28-VFQFN |
库存6,224 |
|
- | 1 | 2.7 V ~ 3.6 V | - | 370mW | -40°C ~ 85°C | Surface Mount | 28-VFQFN | 28-VQFN |
||
Microsemi Corporation |
SONET/SDH TRANSPORT FRAMER/AGGRE
|
封装: 1292-BGA, FCBGA |
库存4,912 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | 1292-BGA, FCBGA | 1292-FCBGA |
||
Microsemi Corporation |
SONET/SDH INTERFACE FOR 622 & 15
|
封装: 196-BGA |
库存7,840 |
|
Serial | - | - | - | - | - | Surface Mount | 196-BGA | 196-CABGA (15x15) |
||
Microsemi Corporation |
TEMAP 84FDL GREEN DUAL PASSIVATI
|
封装: - |
库存7,360 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
32 CHANNEL T1/E1 FRAMER
|
封装: - |
库存7,408 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DIGITAL SWITCH 32K CH 484BGA
|
封装: 484-BGA |
库存6,240 |
|
- | 1 | 1.71V ~ 1.89V | 500mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-PBGA (23x23) |
||
Microchip Technology |
IC DGTL SWITCH 4K X 2K 220BGA
|
封装: 220-BGA |
库存3,712 |
|
- | 1 | 3V ~ 3.6V | 480mA | - | -40°C ~ 85°C | Surface Mount | 220-BGA | 220-BGA (17x17) |
||
Microchip Technology |
IC TDM SWITCH 1K-CH ENH 256BGA
|
封装: 256-BGA |
库存5,792 |
|
- | 1 | 1.71V ~ 1.89V | 150mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (17x17) |
||
Microchip Technology |
ARROW 2XGE
|
封装: 896-BGA |
库存2,528 |
|
GMII, SerDes | 2 | 1.8V | - | - | -40°C ~ 85°C | Surface Mount | 896-BGA | 896-FCBGA |
||
Microchip Technology |
IC ECHO CANCELLER DUAL 28PLCC
|
封装: 28-LCC (J-Lead) |
库存6,736 |
|
Serial | 2 | 4.5V ~ 5.5V | 70mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC VOICE LINE VCP 32CH 128TQFP
|
封装: - |
库存5,456 |
|
2-Wire | 32 | 3.3V | - | - | - | Surface Mount | - | 128-TQFP |
||
Infineon Technologies |
LANTIQ PEF22553 TELECOMS IC
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Zarlink |
ZARLINK PLD
|
封装: - |
Request a Quote |
|
- | - | 3.75V | 3.5mA | - | -40°C ~ 85°C | Surface Mount | 100-QFP | 100-QFP |
||
Infineon Technologies |
DUSLIC DUAL CHANNEL SLIC
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
PEF3452 - LINE INTERFACE UNIT FO
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
IP PHONE CHIP
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
SDFE-2 SYMMETRIC DSL FRONT END,
|
封装: - |
Request a Quote |
|
HDLC, Serial, TDM | 2 | - | - | 500 mW | -40°C ~ 85°C | Surface Mount | 324-LBGA | P-LBGA-324 |
||
Harris Corporation |
3 REN RINGING SLIC FOR ISDN MODE
|
封装: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | 4.75V ~ 5.25V | 6mA | 300 mW | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |