专用 IC

8440258AKI-45LFT

IDT, Integrated Device Technology Inc

IC SWITCH RIO

• Type: -
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-VFQFPN (5x5)

封装: 32-VFQFN Exposed Pad

IDT72P51569L6BBI

IDT, Integrated Device Technology Inc

IC FLOW CTRL 36BIT 256-BGA

• Type: Multi-Queue Flow-Control
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 256-BBGA
• Supplier Device Package: 256-BGA (17x17)

封装: 256-BBGA

IDT72P51559L6BBI8

IDT, Integrated Device Technology Inc

IC FLOW CTRL 36BIT 256-BGA

• Type: Multi-Queue Flow-Control
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 256-BBGA
• Supplier Device Package: 256-BGA (17x17)

封装: 256-BBGA

MAX4507CWN+T

Maxim Integrated

IC SIGNAL LINE PROTECTOR 18-SOIC

• Type: Overvoltage Protection
• Applications: Control Systems
• Mounting Type: Surface Mount
• Package / Case: 18-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 18-SOIC

封装: 18-SOIC (0.295", 7.50mm Width)

NM95HS02N

Fairchild/ON Semiconductor

IC GEN SECURE CODE XT OSC 8-DIP

• Type: Encoder
• Applications: RF, IR
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-DIP

封装: 8-DIP (0.300", 7.62mm)

XCMECH-FF665

Xilinx Inc.

FF665 MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

GS9001-CQME3

Semtech Corporation

EDH CO-PROCESSER

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

AD8196ACPZ-RL

Analog Devices Inc.

IC SWITCH DVI/HDMI 2:1 56-LFCSP

• Type: HDMI/DVI Switch
• Applications: DVI, HDMI Signal Switching
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad, CSP
• Supplier Device Package: 56-LFCSP-VQ (8x8)

封装: 56-VFQFN Exposed Pad, CSP

BU7875GLS-E2

Rohm Semiconductor

IC DATA FORMATTER LSI

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

HCS365/SM

Microchip Technology

IC CODE HOPPING ENCODER 8-SOIJ

• Type: Code Hopping Encoder
• Applications: Remote Secure Access, Keyless Entry
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.209", 5.30mm Width)
• Supplier Device Package: 8-SOIJ

封装: 8-SOIC (0.209", 5.30mm Width)

CAP006DG-TL

Power Integrations

IC CAPZERO 825V 2000NF 8-SOIC

• Type: Capacitor Discharge
• Applications: Converter, ACDC
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

封装: 8-SOIC (0.154", 3.90mm Width)

AD5560JSVUZ

Analog Devices Inc.

1.2A PROGRAMMABLE DPS

• Type: Power Supply
• Applications: Automatic Test Equipment
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-TQFP-EP (10x10)

封装: 64-TQFP Exposed Pad

DLPC4422ZPC

Texas Instruments

IC DIGITAL CONTROLLER 516BGA

• Type: Digital Controller
• Applications: Image Processing and Control
• Mounting Type: Surface Mount
• Package / Case: 516-BGA
• Supplier Device Package: 516-BGA (27x27)

封装: 516-BGA

DCF0256WB3

Intel

IC DAISY CHAIN SAMPLE

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

ATECC608A-SSHCZ-B

Microchip Technology

IC AUTHENTICATION CHIP 8SOIC

• Type: Authentication Chip
• Applications: Networking and Communications
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

封装: 8-SOIC (0.154", 3.90mm Width)

ATTPM20P-G3MA1-10-B

Microchip Technology

COMMERCIAL-PRE-GEN EK 8-UDFN SPI

• Type: -
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 8-UFDFN Exposed Pad
• Supplier Device Package: 8-UDFN (2x3)

封装: 8-UFDFN Exposed Pad

DS28S60Q

Analog Devices Inc./Maxim Integrated

IC DEEPCOVER SEC COPROC 12TDFN

• Type: DeepCover Secure Coprocessor
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 12-WFDFN Exposed Pad
• Supplier Device Package: 12-TDFN (3x3)

封装: -

M62722ML-CF0J

Renesas Electronics Corporation

SYSTEM RESET IC

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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HV53001-E-KWX

Microchip Technology

16-CH +/- PUSH PULL WITH CURRENT

• Type: Driver
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 105-TFBGA
• Supplier Device Package: 105-TFBGA (9x9)

封装: -

STPAYTP16IH40D54

STMicroelectronics

Linear IC's

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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MAX1888EUA

Analog Devices Inc./Maxim Integrated

IC POWER SUPPLY 8UMAX

• Type: Power Supply
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-µMAX

封装: -

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LX256B-5F484C

Lattice Semiconductor Corporation

CROSSBAR SWITCH, CMOS, PBGA484

• Type: Crosspoint Switch
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FPBGA (23x23)

封装: -

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DLP3030AFYJQ1

Texas Instruments

DLP AUTOMOTIVE 0.3-INCH DIGITAL

• Type: Digital Micromirror Device (DMD)
• Applications: -
• Mounting Type: Through Hole
• Package / Case: 149-BFCPGA
• Supplier Device Package: 149-CPGA (22.3x32.2)

封装: -

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S-US5591

ABLIC Inc.

ULTRASOUND DIGITAL TRANSMIT PULS

• Type: Programmable Ultrasound Transmit Beamformer
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 314-LFBGA
• Supplier Device Package: 314-BGA (13x13)

封装: -

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DSRB1X-C51-U

Analog Devices Inc./Maxim Integrated

DSRB1X-C51+U

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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DP8340N

National Semiconductor

IC ENCODER TRANSMITTER 24DIP

• Type: Encoder, Transmitter
• Applications: -
• Mounting Type: Through Hole
• Package / Case: 24-DIP (0.600", 15.24mm)
• Supplier Device Package: 24-DIP

封装: -

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5406-BCA

Rochester Electronics, LLC

5406/BCA - DUAL MARKED (M38510/0

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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QE101I

QST

1.0x1.0 EMI SUPPRESSION IC 1.8~3

• Type: EMI Management IC
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 4-UDFN Exposed Pad
• Supplier Device Package: 4-µDFN (1x1)

封装: -

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