专用 IC

841402DKILF

IDT, Integrated Device Technology Inc

IC SWITCH RIO

• Type: -
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-VFQFN (5x5)

封装: 32-VFQFN Exposed Pad

DS34T108GN

Maxim Integrated

IC TDM/PACKET CHIP 484-BGA

• Type: TDM (Time Division Multiplexing)
• Applications: Data Transport
• Mounting Type: Surface Mount
• Package / Case: 484-BGA Exposed Pad
• Supplier Device Package: 484-HSBGA (23x23)

封装: 484-BGA Exposed Pad

MAX9951FCCB+T

Maxim Integrated

IC PMU DUAL 64TQFP

• Type: Parametric Measurement Unit
• Applications: Automatic Test Equipment
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-TQFP-EP (10x10)

封装: 64-TQFP Exposed Pad

IDT72P51559L6BB8

IDT, Integrated Device Technology Inc

IC FLOW CTRL 36BIT 256-BGA

• Type: Multi-Queue Flow-Control
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 256-BBGA
• Supplier Device Package: 256-BGA (17x17)

封装: 256-BBGA

MC44BS374T1EFR2

NXP

IC AUDIO/VIDEO MODULATOR 16-SOIC

• Type: NTSC/PAL Modulator
• Applications: Audio/Video, VCR's, Set-Top Boxes
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SOIC

封装: 16-SOIC (0.154", 3.90mm Width)

KS8695P

Microchip Technology

IC SWITCH 10/100 3PORT 289BGA

• Type: 10/100 Integrated Switch
• Applications: Networking and Communications
• Mounting Type: Surface Mount
• Package / Case: 289-PBGA
• Supplier Device Package: 289-PBGA (19x19)

封装: 289-PBGA

DS2401X1

Maxim Integrated

IC SILICON SERIAL NUMBER 2-CSP

• Type: Silicon Serial Number
• Applications: PCB, Network Node, Equipment Identification/Registration
• Mounting Type: Surface Mount
• Package / Case: 2-UFBGA, CSPBGA
• Supplier Device Package: 2-CSP

封装: 2-UFBGA, CSPBGA

XCMECH-FFG1760

Xilinx Inc.

FFG1760 MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

XCMECH-FFG1738

Xilinx Inc.

FFG1738 MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

DLP3000FQBDH

Texas Instruments

IC DLP 0.3 WVGA DMD 50LCCC

• Type: Digital Micromirror Device (DMD)
• Applications: 3D, Medical Imaging
• Mounting Type: Surface Mount
• Package / Case: -
• Supplier Device Package: 50-LCCC

封装: -

72V51443L6BB8

IDT, Integrated Device Technology Inc

IC FLOW CTRL MULTI QUEUE 256-BGA

• Type: Multi-Queue Flow-Control
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 256-BBGA
• Supplier Device Package: 256-BGA (17x17)

封装: 256-BBGA

XCMECH-FF1513

Xilinx Inc.

FF1513 MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

72V51446L7-5BB8

IDT, Integrated Device Technology Inc

IC FLOW CTRL MULTI QUEUE 256-BGA

• Type: Multi-Queue Flow-Control
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 256-BBGA
• Supplier Device Package: 256-BGA (17x17)

封装: 256-BBGA

XCMECH-FF676

Xilinx Inc.

FF676 MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

L9708

STMicroelectronics

IC AED SMARTPOWER

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

HCS410T-I/SN

Microchip Technology

IC CODE HOP ENCOD/TRNSPOND 8SOIC

• Type: Code Hopping Encoder and Transponder
• Applications: Access Control Systems
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

封装: 8-SOIC (0.154", 3.90mm Width)

DLP660TEAAFYG

Texas Instruments

IC DLP 4K UHD DMD 257CLGA

• Type: Digital Micromirror Device (DMD)
• Applications: -
• Mounting Type: Through Hole
• Package / Case: 350-BFCPGA
• Supplier Device Package: 350-CPGA (35x32.2)

封装: 350-BFCPGA

ATECC608C-MAHCZ-T

Microchip Technology

ECC/ECDH, SWI, 15K REEL UDFN

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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41374K

IDT, Integrated Device Technology Inc

DUAL MARKED (5962-9221802MSA)

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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JM38510-23801BVA

Intel

JM38510/23801BVA

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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BCM53016A1IFEBLG

Broadcom Limited

IC CPU 5-PORT ETHERNET SWITCH

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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ATECC608B-TNGLORAS-B

Microchip Technology

IC AUTHENTICATION CHIP 8SOIC

• Type: Authentication Chip
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

封装: -

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PCA2001U-AC-1-026

NXP

IC WATCH CIRCUIT WAFER

• Type: Watch Circuit
• Applications: Wrist Watches
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Wafer

封装: -

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CYWB0226ABSX-FDXI

Cypress Semiconductor Corp

IC USB/MASS STORAGE PERIPH 81CSP

• Type: USB/Mass Storage Peripheral Controller
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 81-UFBGA, WLCSP
• Supplier Device Package: 81-WLCSP (3.91x3.91)

封装: -

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ATECC608B-TNGTLSS-C

Microchip Technology

IC AUTHENTICATION CHIP 8SOIC

• Type: Authentication Chip
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

封装: -

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AWT1921S11CTR

Anadigics

INTEGRATED HIGH POWER AMP 1610 M

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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DS24L65Q-T

Analog Devices Inc./Maxim Integrated

IC AUTHENTICATION CHIP 6TDFN

• Type: Authentication Chip
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 6-WDFN Exposed Pad
• Supplier Device Package: 6-TDFN (3x3)

封装: -

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HDL6M06531B

ABLIC Inc.

IC ANALOG SWITCHES 64QFN

• Type: Analog Switches
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9.2x9.2)

封装: -

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