页 313 - Intel 产品 | 黑森尔电子
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Intel 产品

记录 9,824
页  313/351
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hot GE28F320C3BC90
Intel

IC FLASH 32MBIT 90NS 48VFBGA

  • Memory Type: Non-Volatile
  • Memory Format: FLASH
  • Technology: FLASH - Boot Block
  • Memory Size: 32Mb (2M x 16)
  • Memory Interface: Parallel
  • Clock Frequency: -
  • Write Cycle Time - Word, Page: 90ns
  • Access Time: 90ns
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFBGA
  • Supplier Device Package: 48-VFBGA
封装: 48-VFBGA
库存23,208
KC80524KX366128SL3C7
Intel

IC MPU MOB CELERON 366MHZ 615BGA

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: 366MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Security Features: -
  • Package / Case: 615-BBGA
  • Supplier Device Package: 615-BGA (35.15x31.15)
封装: 615-BBGA
库存4,848
5CSEBA6U23I7NTS
Intel

672-PIN UBGA

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存6,928
10AX032E2F29E1SG
Intel

IC FPGA 360 I/O 780FBGA

  • Number of LABs/CLBs: 119900
  • Number of Logic Elements/Cells: 320000
  • Total RAM Bits: 21040128
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封装: 780-BBGA, FCBGA
库存7,248
MPF8820AQC208AB
Intel

IC FPGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: Surface Mount
  • Operating Temperature: -
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
封装: 208-BFQFP
库存5,728
EP20K600EFC672-1N
Intel

IC FPGA 508 I/O 672FBGA

  • Number of LABs/CLBs: 2432
  • Number of Logic Elements/Cells: 24320
  • Total RAM Bits: 311296
  • Number of I/O: 508
  • Number of Gates: 1537000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA
  • Supplier Device Package: 672-FBGA (27x27)
封装: 672-BBGA
库存5,040
hot EP20K200EBC356-1X
Intel

IC FPGA 271 I/O 356BGA

  • Number of LABs/CLBs: 832
  • Number of Logic Elements/Cells: 8320
  • Total RAM Bits: 106496
  • Number of I/O: 271
  • Number of Gates: 526000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 356-LBGA
  • Supplier Device Package: 356-BGA (35x35)
封装: 356-LBGA
库存5,024
EP20K100EQC208-1
Intel

IC FPGA 151 I/O 208QFP

  • Number of LABs/CLBs: 416
  • Number of Logic Elements/Cells: 4160
  • Total RAM Bits: 53248
  • Number of I/O: 151
  • Number of Gates: 263000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
封装: 208-BFQFP
库存3,888
EP4S100G5H40I1N
Intel

IC FPGA 654 I/O 1517HBGA

  • Number of LABs/CLBs: 21248
  • Number of Logic Elements/Cells: 531200
  • Total RAM Bits: 28033024
  • Number of I/O: 654
  • Number of Gates: -
  • Voltage - Supply: 0.92 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (42.5x42.5)
封装: 1517-BBGA, FCBGA
库存2,832
5SGSMD8N2F45I2LN
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 60968960
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: 1932-BBGA, FCBGA
库存5,216
5SGSMD5H1F35I2N
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 172600
  • Number of Logic Elements/Cells: 457000
  • Total RAM Bits: 46769152
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA
库存3,696
EP3SE110F780I4LN
Intel

IC FPGA 488 I/O 780FBGA

  • Number of LABs/CLBs: 4300
  • Number of Logic Elements/Cells: 107500
  • Total RAM Bits: 8936448
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封装: 780-BBGA, FCBGA
库存5,520
EP1SGX25CF672C7
Intel

IC FPGA 455 I/O 672FBGA

  • Number of LABs/CLBs: 2566
  • Number of Logic Elements/Cells: 25660
  • Total RAM Bits: 1944576
  • Number of I/O: 455
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
封装: 672-BBGA, FCBGA
库存2,416
EP3C80F780C6
Intel

IC FPGA 429 I/O 780FBGA

  • Number of LABs/CLBs: 5079
  • Number of Logic Elements/Cells: 81264
  • Total RAM Bits: 2810880
  • Number of I/O: 429
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BGA
  • Supplier Device Package: 780-FBGA (29x29)
封装: 780-BGA
库存2,736
5CEFA7F23C6N
Intel

IC FPGA 240 I/O 484FBGA

  • Number of LABs/CLBs: 56480
  • Number of Logic Elements/Cells: 149500
  • Total RAM Bits: 7880704
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封装: 484-BGA
库存2,208
EPM7128SQC100-7YY
Intel

IC CPLD 128MC 7.5NS 100QFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 2500
  • Number of I/O: 84
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-BQFP
  • Supplier Device Package: 100-PQFP (20x14)
封装: 100-BQFP
库存6,960
hot EPM9560RC304-15
Intel

IC CPLD 560MC 15NS 304RQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 35
  • Number of Macrocells: 560
  • Number of Gates: 12000
  • Number of I/O: 216
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 304-BFQFP
  • Supplier Device Package: 304-RQFP (40x40)
封装: 304-BFQFP
库存5,040
AGFA022R31C3E4X
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.2M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
EP3SE110F780C3G
Intel

IC FPGA 488 I/O 780FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
5SGXMA5K3F35I3WN
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: -
Request a Quote
AGFB019R31C2I2V
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
封装: -
Request a Quote
1ST280EY2F55E2VG
Intel

IC FPGA 296 I/O 2912BGA

  • Number of LABs/CLBs: 350000
  • Number of Logic Elements/Cells: 2800000
  • Total RAM Bits: -
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2912-BBGA, FCBGA
  • Supplier Device Package: 2912-FBGA, FC (55x55)
封装: -
Request a Quote
5SGXMA5K3F40I3NCV
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: -
Request a Quote
5SGXMA7N1F40C2WN
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: -
Request a Quote
AGFD023R24C2I2VB
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封装: -
Request a Quote
1SG085HN3F43E2VG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 106250
  • Number of Logic Elements/Cells: 850000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
封装: -
Request a Quote
EP4SGX230KF40C2G
Intel

IC FPGA 744 I/O 1517FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
1SX250HH1F55E2LG
Intel

IC FPGA STRATIX 10 2912FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2500K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2912-BBGA, FCBGA
  • Supplier Device Package: 2912-FBGA, FC (55x55)
封装: -
Request a Quote