Microchip Technology 产品

DSC8002DI2

Microchip Technology

OSC MEMS BLANK 2.5X2.0 CMOS

• Type: MEMS (Silicon)
• Programmable Type: Blank (User Must Program)
• Available Frequency Range: 1MHz ~ 150MHz
• Function: Standby
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: -
• Frequency Stability (Total): ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Spread Spectrum Bandwidth: -
• Current - Supply (Max): 10mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height: 0.035" (0.90mm)

封装: 4-SMD, No Lead

DSC1001CI2-035.4689T

Microchip Technology

OSC MEMS 35.4689MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 35.4689MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

封装: 4-SMD, No Lead

DSC1001CE2-008.0000T

Microchip Technology

OSC MEMS 8.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 8MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

封装: 4-SMD, No Lead

DSC1001BI1-032.0000

Microchip Technology

OSC MEMS 32.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 32MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

封装: 4-SMD, No Lead

MIC5305-1.5YML-TR

Microchip Technology

IC REG LINEAR 1.5V 150MA 6MLF

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.5V
• Voltage - Output (Max): -
• Voltage Dropout (Max): -
• Current - Output: 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 150µA
• PSRR: 85dB ~ 65dB (1kHz ~ 10kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 6-VQFN Exposed Pad, 6-MLF?
• Supplier Device Package: 6-MLF? (2x2)

封装: 6-VQFN Exposed Pad, 6-MLF?

LAN9355T/PT

Microchip Technology

IC ETHERNET SWITCH 3PORT 80TQFP

• Protocol: Ethernet
• Function: Switch
• Interface: I2C
• Standards: 10/100 Base-T/TX PHY
• Voltage - Supply: 1.8 V ~ 3.3 V
• Current - Supply: -
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 80-TQFP Exposed Pad
• Supplier Device Package: 80-TQFP-EP (12x12)

封装: 80-TQFP Exposed Pad

DSPIC33EP128MU202-I/MM

Microchip Technology

IC DSC 16BIT 128KB FLASH

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

DSPIC33FJ64MC510AT-I/PF

Microchip Technology

IC MCU 16BIT 64KB FLASH 100TQFP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 24x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

封装: 100-TQFP

PIC16LC717-E/P

Microchip Technology

IC MCU 8BIT 3.5KB OTP 18DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 15
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 18-DIP (0.300", 7.62mm)
• Supplier Device Package: 18-PDIP

封装: 18-DIP (0.300", 7.62mm)

PIC18LF442-I/ML

Microchip Technology

IC MCU 8BIT 16KB FLASH 44QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-VQFN Exposed Pad
• Supplier Device Package: 44-QFN (8x8)

封装: 44-VQFN Exposed Pad

PIC32MX350F256L-I/TL

Microchip Technology

IC MCU 32BIT 256KB FLASH 124VTLA

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 124-VFTLA Dual Row Exposed Pad
• Supplier Device Package: 124-VTLA (9x9)

封装: 124-VFTLA Dual Row Exposed Pad

PIC18LF4550T-I/PT

Microchip Technology

IC MCU 8BIT 32KB FLASH 44TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

封装: 44-TQFP

PIC16LF15355-E/SP

Microchip Technology

IC MCU 8BIT 14KB FLASH 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 224 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 24x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SDIP

封装: 28-DIP (0.300", 7.62mm)

PIC32MZ1024EFE100-I/PF

Microchip Technology

IC MCU 32BIT 1MB FLASH 100TQFP

• Core Processor: MIPS32? M-Class
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 78
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 2.1 V ~ 3.6 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

封装: 100-TQFP

AT97SC3205T-G3M46-20

Microchip Technology

FF COM I2C TPM 4X4 32VQFN SEK -

• Applications: Trusted Platform Module (TPM)
• Core Processor: AVR
• Program Memory Type: -
• Controller Series: -
• RAM Size: -
• Interface: I2C
• Number of I/O: 4
• Voltage - Supply: 3.3V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-VQFN (4x4)

封装: 32-VFQFN Exposed Pad

ATA5575M233A-DBB

Microchip Technology

IC RFID 128BIT 330PF ANIMAL BUMP

• Type: RFID Transponder
• Frequency: 100kHz ~ 150kHz
• Standards: ISO 11784, ISO 11785
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Die
• Supplier Device Package: Die

封装: Die

24LC08B-I/MS16KVAO

Microchip Technology

8K 1KX8 2.5V SERIAL EE IND

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 8Kb (1K x 8)
• Memory Interface: I²C
• Clock Frequency: 400kHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: 900ns
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

封装: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

ZL40209LDF1

Microchip Technology

IC CLK BUFF MUX 2:6 750MHZ 32QFN

• Type: Fanout Buffer (Distribution), Multiplexer
• Number of Circuits: 1
• Ratio - Input:Output: 2:6
• Differential - Input:Output: Yes/Yes
• Input: CML, HCSL, LVCMOS, LVDS, LVPECL
• Output: LVPECL
• Frequency - Max: 750MHz
• Voltage - Supply: 2.375V ~ 3.465V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

封装: 32-VFQFN Exposed Pad

MCP6404T-H/SLVAO

Microchip Technology

QUAD 1.8V 1MHZ OP H TEMP

• Amplifier Type: -
• Number of Circuits: -
• Output Type: -
• Slew Rate: -
• Gain Bandwidth Product: -
• -3db Bandwidth: -
• Current - Input Bias: -
• Voltage - Input Offset: -
• Current - Supply: -
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

MCP37D11-200E-TE

Microchip Technology

IC ADC 12BIT PIPELINED 121TFBGA

• Number of Bits: 12
• Sampling Rate (Per Second): 200M
• Number of Inputs: 1, 2, 4, 8
• Input Type: Differential
• Data Interface: LVDS - Parallel, Parallel
• Configuration: MUX-S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: Pipelined
• Reference Type: Internal
• Voltage - Supply, Analog: 1.14V ~ 1.89V
• Voltage - Supply, Digital: 1.14V ~ 1.89V
• Features: -
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-TFBGA (8x8)
• Mounting Type: Surface Mount

封装: -

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MCP47CMB24T-20E-ST

Microchip Technology

IC DAC 12BIT V-OUT 20TSSOP

• Number of Bits: 12
• Number of D/A Converters: 4
• Settling Time: 16µs (Typ)
• Output Type: Voltage - Buffered
• Differential Output: No
• Data Interface: I2C
• Reference Type: External, Internal, Supply
• Voltage - Supply, Analog: 1.8V ~ 5.5V
• Voltage - Supply, Digital: 1.8V ~ 5.5V
• INL/DNL (LSB): -, ±1 (Max)
• Architecture: R-2R
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP
• Mounting Type: Surface Mount

封装: -

1N5232A-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 5.6 V
• Tolerance: ±10%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 11 Ohms
• Current - Reverse Leakage @ Vr: 5 µA @ 2.9 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TA)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

封装: -

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MX1N3332RD

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): -
• Tolerance: -
• Power - Max: -
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: -
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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JANTX1N4464US-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 9.1 V
• Tolerance: ±5%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 4 Ohms
• Current - Reverse Leakage @ Vr: 300 nA @ 5.46 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, A
• Supplier Device Package: D-5A

封装: -

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1N6012B-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 33 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 88 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 25 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-35

封装: -

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CDLL6012B

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 33 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 88 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 25 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

封装: -

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JAN1N6769R

Microchip Technology

DIODE GEN PURP 100V 8A TO257

• Diode Type: Standard, Reverse Polarity
• Voltage - DC Reverse (Vr) (Max): 100 V
• Current - Average Rectified (Io): 8A
• Voltage - Forward (Vf) (Max) @ If: 1.06 V @ 8 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 35 ns
• Current - Reverse Leakage @ Vr: 10 µA @ 80 V
• Capacitance @ Vr, F: 150pF @ 5V, 1MHz
• Mounting Type: Through Hole
• Package / Case: TO-257-3
• Supplier Device Package: TO-257
• Operating Temperature - Junction: -

封装: -

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JANTXV1N3824CUR-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 4.3 V
• Tolerance: ±2%
• Power - Max: 1 W
• Impedance (Max) (Zzt): 9 Ohms
• Current - Reverse Leakage @ Vr: 5 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AB, MELF (Glass)
• Supplier Device Package: DO-213AB (MELF, LL41)

封装: -

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