NXP 产品

MRF8S18120HSR5

NXP

FET RF 65V 1.81GHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 1.81GHz
• Gain: 18.2dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 800mA
• Power - Output: 72W
• Voltage - Rated: 65V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

封装: NI-780S

BF861B,235

NXP

JFET N-CH 25V 15MA SOT23

• Transistor Type: N-Channel JFET
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: 15mA
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: 25V
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

封装: TO-236-3, SC-59, SOT-23-3

BFU550WX

NXP

TRANS RF NPN 12V 50MA SOT-323

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 12V
• Frequency - Transition: 11GHz
• Noise Figure (dB Typ @ f): 0.6dB @ 900MHz
• Gain: 18dB
• Power - Max: 450mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
• Current - Collector (Ic) (Max): 50mA
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-70, SOT-323
• Supplier Device Package: SOT-323-3

封装: SC-70, SOT-323

BZX84-C11/LF1R

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 11V
• Tolerance: ±5%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 20 Ohms
• Current - Reverse Leakage @ Vr: 100nA @ 8V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

封装: TO-236-3, SC-59, SOT-23-3

UBA2211CT/N1,518

NXP

IC CFL DRIVER 14SO

• Type: CFL/TL Driver
• Frequency: 40.05kHz ~ 42.68kHz
• Voltage - Supply: 10.7 V ~ 13.8 V
• Current - Supply: -
• Current - Output Source/Sink: 1.85A
• Dimming: No
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

封装: 14-SOIC (0.154", 3.90mm Width)

TEA1751AT/N1,518

NXP

IC CTRL SMPS SO16

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: -
• Topology: Flyback
• Voltage - Start Up: 15V
• Voltage - Supply (Vcc/Vdd): 8 V ~ 38 V
• Duty Cycle: -
• Frequency - Switching: 100kHz ~ 150kHz
• Power (Watts): 250W
• Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
• Control Features: -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO
• Mounting Type: Surface Mount

封装: 16-SOIC (0.154", 3.90mm Width)

74LVT10DB,118

NXP

IC GATE NAND 3CH 3-INP 14-SSOP

• Logic Type: NAND Gate
• Number of Circuits: 3
• Number of Inputs: 3
• Features: -
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Max): -
• Current - Output High, Low: 20mA, 32mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 3.8ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SSOP
• Package / Case: 14-SSOP (0.209", 5.30mm Width)

封装: 14-SSOP (0.209", 5.30mm Width)

TDA8933BTW/N2,518

NXP

IC AMP AUDIO 20.6W STER 32TSSOP

• Type: Class D
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 20.6W x 1 @ 16 Ohm; 10.3W x 2 @ 8 Ohm
• Voltage - Supply: 10 V ~ 36 V, ±5 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 32-HTSSOP
• Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

封装: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

SC16C554BIB64,151

NXP

IC UART QUAD W/FIFO 64-LQFP

• Features: -
• Number of Channels: 4, QUART
• FIFO's: 16 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

TDA8026ET/C2,518

NXP

IC SMART CARD SLOT 64TFBGA

• Applications: -
• Interface: I2C
• Voltage - Supply: 2.7 V ~ 5.5 V
• Package / Case: 64-TFBGA
• Supplier Device Package: 64-TFBGA
• Mounting Type: Surface Mount

封装: 64-TFBGA

MC33978AES

NXP

IC INTERFACE SW DETECT 32QFN

• Applications: Multiple Switch Detection
• Interface: SPI
• Voltage - Supply: 3 V ~ 5.25 V
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)
• Mounting Type: Surface Mount

封装: 32-VFQFN Exposed Pad

XC68HC58EIA

NXP

IC MCU 28PLCC

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (12.45x12.45)

封装: 28-LCC (J-Lead)

P87C52UBAA,512

NXP

IC MCU 8BIT 8KB OTP 44PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: POR
• Number of I/O: 32
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

封装: 44-LCC (J-Lead)

MK10DN512VLL10

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 37x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

封装: 100-LQFP

LPC3130FET180,551

NXP

IC MCU 32BIT ROMLESS 180TFBGA

• Core Processor: ARM9?
• Core Size: 16/32-Bit
• Speed: 180MHz
• Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
• Peripherals: DMA, I2S, LCD, PWM, WDT
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.1 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 180-TFBGA
• Supplier Device Package: 180-TFBGA (12x12)

封装: 180-TFBGA

MM912G634DC1AER2

NXP

IC MCU 48KB LS/HS SWITCH 48LQFP

• Applications: Automotive
• Core Processor: S12
• Program Memory Type: FLASH (48 kB)
• Controller Series: HCS12
• RAM Size: 2K x 8
• Interface: LIN, SCI
• Number of I/O: 9
• Voltage - Supply: 2.25 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

封装: 48-LQFP Exposed Pad

DSP56301PW100

NXP

IC DSP 24BIT FIXED-POINT 208LQFP

• Type: Fixed Point
• Interface: Host Interface, SSI, SCI
• Clock Rate: 100MHz
• Non-Volatile Memory: ROM (9 kB)
• On-Chip RAM: 24kB
• Voltage - I/O: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 100°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 208-LQFP
• Supplier Device Package: 208-LQFP (28x28)

封装: 208-LQFP

MPXA4250A6U

NXP

PRESSURE SENS 36.3PSI MAX 8-SOP

• Pressure Type: Absolute
• Operating Pressure: 2.9 PSI ~ 36.26 PSI (20 kPa ~ 250 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.9 V
• Accuracy: ±1.5%
• Voltage - Supply: 4.85 V ~ 5.35 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 145.04 PSI (1000 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD Module
• Supplier Device Package: -

封装: 8-SMD Module

MCZ33903DP5EKR2

NXP

SYSTEM BASIS CHIP 2X 5.0 V/400M

• Applications: System Basis Chip
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

封装: -

TDA8034HN/C2J

NXP

LOW POWER SMART CARD INTERFACE

• Applications: -
• Interface: Analog
• Voltage - Supply: 1.8V, 3V, 5V
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)
• Mounting Type: Surface Mount

封装: 24-VFQFN Exposed Pad

MCIMX6L7DVN10AC

NXP

I.MX6 SL ROM ENHANCE

• Core Processor: ARM® Cortex®-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (3)
• Voltage - I/O: 1.2V, 1.8V, 3.0V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 432-TFBGA
• Supplier Device Package: 432-MAPBGA (13x13)

封装: 432-TFBGA

S9S12G128AVLH

NXP

16BIT 128K FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

TEF5100EL-V1-S20K

NXP

IC

• Type: -
• Protocol: -
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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SAF4000EL-101Z574K

NXP

SAF4000EL

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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MC20XS4200BDFKR2

NXP

HIGH-SIDE SWITCH, 24V, DUAL 20MO

• Switch Type: General Purpose
• Number of Outputs: 2
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 8V ~ 36V
• Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
• Current - Output (Max): 4.4A
• Rds On (Typ): 20mOhm (Max)
• Input Type: Non-Inverting
• Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
• Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 23-PowerQFN
• Supplier Device Package: 23-PQFN (12x12)

封装: -

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A2G35S160-01SR3

NXP

RF MOSFET GAN 48V NI400

• Transistor Type: GaN
• Frequency: 3.4GHz ~ 3.6GHz
• Gain: 15.7dB
• Voltage - Test: 48 V
• Current Rating: -
• Noise Figure: -
• Current - Test: 190 mA
• Power - Output: 51dBm
• Voltage - Rated: 125 V
• Package / Case: NI-400S-2S
• Supplier Device Package: NI-400S-2S

封装: -

MC33FS8430G2ESR2

NXP

SYSTEM BASIS CHIP FS8430

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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FS32K148UAT0VLLR

NXP

IC MCU 32BIT 2MB FLASH 100LQFP

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 112MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
• Number of I/O: 156
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 32x12b SAR; D/A 1x8b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

封装: -

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