图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
---|---|---|---|---|---|---|
NXP |
IC MOSFET DRIVER 6TSOP
|
封装: SC-74, SOT-457 |
库存2,512 |
|
||
NXP |
MOSFET N-CH 55V 40A TO220AB
|
封装: TO-220-3 |
库存2,656 |
|
||
NXP |
TRANS PNP 60V 0.6A TO92
|
封装: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
库存4,272 |
|
||
NXP |
IC REG LINEAR 2.1V 200MA 6-XSON
|
封装: 6-XFDFN |
库存4,720 |
|
||
NXP |
IC SHIFT REGISTER 8BIT 16SOIC
|
封装: 16-SOIC (0.154", 3.90mm Width) |
库存5,584 |
|
||
NXP |
IC IF PROCESSOR HYBRID 48-HVQFN
|
封装: 48-VFQFN Exposed Pad |
库存3,936 |
|
||
NXP |
IC DGTL CABLE SIL TUNER 48HVQFN
|
封装: 48-VFQFN Exposed Pad |
库存98,568 |
|
||
NXP |
IC SBC CAN HS 3.3V 32SOIC
|
封装: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
库存4,352 |
|
||
NXP |
IC I2C EEPROM DIP SWITCH 20TSSOP
|
封装: 20-TSSOP (0.173", 4.40mm Width) |
库存5,920 |
|
||
NXP |
IC I/O EXPANDER 16BIT 24UFBGA
|
封装: 24-UFBGA |
库存3,952 |
|
||
NXP |
IC PROCESSOR DUAL CORE
|
封装: 448-FBGA Exposed Pad |
库存7,904 |
|
||
NXP |
IC MPU MPC86XX 1.067GHZ 994BGA
|
封装: 994-BCBGA, FCCBGA |
库存5,792 |
|
||
NXP |
IC MPU MPC83XX 533MHZ 689TEBGA
|
封装: 689-BBGA Exposed Pad |
库存7,920 |
|
||
NXP |
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
封装: 561-FBGA |
库存3,472 |
|
||
NXP |
IC MPU MPC82XX 266MHZ 516BGA
|
封装: 516-BBGA |
库存15,540 |
|
||
NXP |
IC MPU MPC82XX 400MHZ 516BGA
|
封装: 516-BBGA |
库存10,932 |
|
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: - |
库存5,776 |
|
||
NXP |
IC MCU 16BIT 128KB FLASH 100LQFP
|
封装: 100-LQFP |
库存4,912 |
|
||
NXP |
IC MCU 8BIT 60KB FLASH 32LQFP
|
封装: 32-LQFP |
库存5,872 |
|
||
NXP |
IC MCU 16BIT 128KB FLASH 128LQFP
|
封装: 128-LQFP |
库存16,800 |
|
||
NXP |
IC MCU 32BIT 64KB FLASH 48QFN
|
封装: 48-VFQFN Exposed Pad |
库存6,288 |
|
||
NXP |
IC CLK BUFFER 1:4 533MHZ 8TSSOP
|
封装: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
库存4,736 |
|
||
NXP |
SENSOR DIFF PRESS 11.6PSI MAX
|
封装: 6-SIP Module |
库存2,988 |
|
||
NXP |
IC RF TXRX+MCU 802.15.4 56-VFQFN
|
封装: 56-VFQFN Exposed Pad |
库存2,214 |
|
||
NXP |
KIT DEVELOPMENT MC13237CHT
|
封装: - |
库存8,964 |
|
||
NXP |
IC MMIC 2STAGE 2-CDMA 16HSOPF
|
封装: SOT834-1 |
库存7,956 |
|
||
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
|
封装: 48-LQFP Exposed Pad |
库存7,168 |
|
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
封装: 208-LQFP |
库存7,824 |
|
||
NXP |
32 BIT, 4MB FLASH, 512K
|
封装: 176-LQFP Exposed Pad |
库存6,224 |
|
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 100-LQFP |
库存5,472 |
|