NXP 产品

MRF8P23080HSR5

NXP

FET RF 2CH 65V 2.3GHZ NI780S-4

• Transistor Type: LDMOS (Dual)
• Frequency: 2.3GHz
• Gain: 14.6dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 280mA
• Power - Output: 16W
• Voltage - Rated: 65V
• Package / Case: NI-780S-4
• Supplier Device Package: NI-780S-4

封装: NI-780S-4

BFU610F,115

NXP

TRANSISTOR NPN SOT343F

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 5.5V
• Frequency - Transition: 15GHz
• Noise Figure (dB Typ @ f): 0.9dB ~ 1.7dB @ 1.5GHz ~ 5.8GHz
• Gain: 13.5dB ~ 23.5dB
• Power - Max: 136mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 1mA, 2V
• Current - Collector (Ic) (Max): 10mA
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SOT-343F
• Supplier Device Package: 4-DFP

封装: SOT-343F

TFA9812HN/N1,557

NXP

IC AMP AUDIO 15W STER D 48HVQFN

• Type: Class D
• Output Type: 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 15W x 2 @ 8 Ohm
• Voltage - Supply: 8 V ~ 20 V
• Features: Depop, Digital Inputs, I2C, I2S, Mute, Short-Circuit and Thermal Protection, Volume Control
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 48-HVQFN (7x7)
• Package / Case: 48-VFQFN Exposed Pad

封装: 48-VFQFN Exposed Pad

TJA1054AT/S900,512

NXP

IC CAN TXRX FAULT-TOL 14-SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

封装: 14-SOIC (0.154", 3.90mm Width)

TJA1043T/1J

NXP

IC CAN TRANSEIVER HS 14SO

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 120mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

封装: 14-SOIC (0.154", 3.90mm Width)

NX3L1G384GM,132

NXP

IC SWITCH SPST 6XSON

• Switch Circuit: SPST - NC
• Multiplexer/Demultiplexer Circuit: 1:1
• Number of Circuits: 1
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): -
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 24ns, 7ns
• -3db Bandwidth: 60MHz
• Charge Injection: 6pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT886 (1.45x1)

封装: 6-XFDFN

NX3L1G66GW-Q100H

NXP

IC ANALOG SWITCH SPST UMT5

• Switch Circuit: SPST - NO
• Multiplexer/Demultiplexer Circuit: 1:1
• Number of Circuits: 1
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): -
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 23ns, 8ns
• -3db Bandwidth: 60MHz
• Charge Injection: 6pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 5-TSSOP, SC-70-5, SOT-353
• Supplier Device Package: 5-TSSOP

封装: 5-TSSOP, SC-70-5, SOT-353

P2041NSE1MMB

NXP

IC MPU Q OR IQ 1.2GHZ 780FCBGA

• Core Processor: PowerPC e500mc
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Security; SEC 4.2
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FCPBGA (23x23)

封装: 780-BBGA, FCBGA

P1010NXE5DFA

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Security; SEC 4.4
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
• Package / Case: 425-FBGA
• Supplier Device Package: 425-TEPBGA I (19x19)

封装: 425-FBGA

MC7448VU600NC

NXP

IC MPU MPC74XX 600MHZ 360FCCBGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 600MHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-CBGA, FCCBGA
• Supplier Device Package: 360-FCCBGA (25x25)

封装: 360-CBGA, FCCBGA

MPC860DEVR66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

封装: 357-BBGA

MPC855TCVR66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

封装: 357-BBGA

MPC880CVR66

NXP

IC MPU MPC8XX 66MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (2), 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 100°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

封装: 357-BBGA

MC908LJ24CPBE

NXP

IC MCU 8BIT 24KB FLASH 64LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I2C, IRSCI, SPI
• Peripherals: LCD, LVD, POR, PWM
• Number of I/O: 40
• Program Memory Size: 24KB (24K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

MC68376BGCFT20

NXP

IC MCU 32BIT ROMLESS 160QFP

• Core Processor: CPU32
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 7.5K x 8
• Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 160-BQFP
• Supplier Device Package: 160-QFP (28x28)

封装: 160-BQFP

S9S08SL16F1MTJ

NXP

IC MCU 8BIT 16KB FLASH 20TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

封装: 20-TSSOP (0.173", 4.40mm Width)

LPC1788FET180,551

NXP

IC MCU 32BIT 512KB FLASH 180BGA

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 141
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 180-TFBGA
• Supplier Device Package: 180-TFBGA (12x12)

封装: 180-TFBGA

TEA6853HN/V102Y

NXP

IC TUNER CAR RADIO 32QFN

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: -
• Applications: -
• Current - Receiving: -
• Data Interface: -
• Memory Size: -
• Antenna Connector: -
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封装: -

A7102CHTK2/T0BC2AJ

NXP

SECURE AUTHENTICATION

• Applications: Authentication
• Core Processor: MX51
• Program Memory Type: -
• Controller Series: -
• RAM Size: -
• Interface: I²C
• Number of I/O: -
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 90°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-HVSON (4x4)

封装: 8-VDFN Exposed Pad

T1023NXN7PQA

NXP

QORIQ 2XCPU 64-BIT PWR ARCH 1.

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

封装: -

TJA1462ATK-S3J

NXP

IC

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 100 mV
• Data Rate: 8Mbps
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-HVSON (3x3)

封装: -

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FD32K146HAT0MLHR

NXP

IC

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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LPC55S16JEV59Y

NXP

IC MCU 32BIT 256KB FLASH 59BGA

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 37
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 10x16b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 59-VFBGA
• Supplier Device Package: 59-VFBGA (4x4)

封装: -

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FG32K142HFT0VLHT

NXP

S32K142 32-BIT MCU, ARM CORTEX-M

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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MPB5170VLH

NXP

NEVIS2 64LQFP

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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MFS8601BMDA0ESR2

NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

• Applications: Camera
• Current - Supply: -
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

封装: -

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MC35FS6506CAER2

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

封装: -

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UJA1169ATKZ

NXP

IC MINI-CAN SYSTEM BASIS CHIP

• Applications: System Basis Chip
• Interface: CAN, SPI
• Voltage - Supply: 3V ~ 28V
• Package / Case: 20-VFDFN Exposed Pad
• Supplier Device Package: 20-HVSON (3.5x5.5)
• Mounting Type: Surface Mount

封装: -