页 313 - TE Connectivity Passive Product 产品 - 芯片电阻 - 表面安装 | 黑森尔电子
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TE Connectivity Passive Product 产品 - 芯片电阻 - 表面安装

记录 15,287
页  313/546
图片
零件编号
制造商
描述
封装
库存
数量
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
CRGV2010F1M69
TE Connectivity Passive Product

RES SMD 1.69M OHM 1% 1/2W 2010

  • Resistance: 1.69 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存8,640
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M65
TE Connectivity Passive Product

RES SMD 1.65M OHM 1% 1/2W 2010

  • Resistance: 1.65 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存8,442
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M62
TE Connectivity Passive Product

RES SMD 1.62M OHM 1% 1/2W 2010

  • Resistance: 1.62 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存3,456
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M58
TE Connectivity Passive Product

RES SMD 1.58M OHM 1% 1/2W 2010

  • Resistance: 1.58 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存7,488
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M54
TE Connectivity Passive Product

RES SMD 1.54M OHM 1% 1/2W 2010

  • Resistance: 1.54 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存5,400
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M5
TE Connectivity Passive Product

RES SMD 1.5M OHM 1% 1/2W 2010

  • Resistance: 1.5 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存3,240
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M47
TE Connectivity Passive Product

RES SMD 1.47M OHM 1% 1/2W 2010

  • Resistance: 1.47 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存5,058
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M43
TE Connectivity Passive Product

RES SMD 1.43M OHM 1% 1/2W 2010

  • Resistance: 1.43 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存7,272
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M4
TE Connectivity Passive Product

RES SMD 1.4M OHM 1% 1/2W 2010

  • Resistance: 1.4 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存3,438
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M37
TE Connectivity Passive Product

RES SMD 1.37M OHM 1% 1/2W 2010

  • Resistance: 1.37 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存3,312
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M33
TE Connectivity Passive Product

RES SMD 1.33M OHM 1% 1/2W 2010

  • Resistance: 1.33 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存5,616
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M3
TE Connectivity Passive Product

RES SMD 1.3M OHM 1% 1/2W 2010

  • Resistance: 1.3 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存3,780
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M27
TE Connectivity Passive Product

RES SMD 1.27M OHM 1% 1/2W 2010

  • Resistance: 1.27 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存6,120
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M24
TE Connectivity Passive Product

RES SMD 1.24M OHM 1% 1/2W 2010

  • Resistance: 1.24 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存2,628
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M21
TE Connectivity Passive Product

RES SMD 1.21M OHM 1% 1/2W 2010

  • Resistance: 1.21 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存4,068
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M18
TE Connectivity Passive Product

RES SMD 1.18M OHM 1% 1/2W 2010

  • Resistance: 1.18 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存6,552
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M15
TE Connectivity Passive Product

RES SMD 1.15M OHM 1% 1/2W 2010

  • Resistance: 1.15 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存7,002
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M13
TE Connectivity Passive Product

RES SMD 1.13M OHM 1% 1/2W 2010

  • Resistance: 1.13 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存3,150
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M1
TE Connectivity Passive Product

RES SMD 1.1M OHM 1% 1/2W 2010

  • Resistance: 1.1 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存8,154
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M07
TE Connectivity Passive Product

RES SMD 1.07M OHM 1% 1/2W 2010

  • Resistance: 1.07 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存4,302
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M05
TE Connectivity Passive Product

RES SMD 1.05M OHM 1% 1/2W 2010

  • Resistance: 1.05 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存5,076
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M02
TE Connectivity Passive Product

RES SMD 1.02M OHM 1% 1/2W 2010

  • Resistance: 1.02 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存3,600
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M0
TE Connectivity Passive Product

RES SMD 1M OHM 1% 1/2W 2010

  • Resistance: 1 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存3,544
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F976K
TE Connectivity Passive Product

RES SMD 976K OHM 1% 1/2W 2010

  • Resistance: 976 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存7,794
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F953K
TE Connectivity Passive Product

RES SMD 953K OHM 1% 1/2W 2010

  • Resistance: 953 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存5,670
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F931K
TE Connectivity Passive Product

RES SMD 931K OHM 1% 1/2W 2010

  • Resistance: 931 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存3,544
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F909K
TE Connectivity Passive Product

RES SMD 909K OHM 1% 1/2W 2010

  • Resistance: 909 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存6,534
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F887K
TE Connectivity Passive Product

RES SMD 887K OHM 1% 1/2W 2010

  • Resistance: 887 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封装: 2010 (5025 Metric)
库存3,330
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-