页 80 - Intel 产品 | 黑森尔电子
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Intel 产品

记录 9,824
页  80/351
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数量
hot MPM7128STC100AC
Intel

IC FPGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存19,068
10AX066H1F34E1SG
Intel

IC FPGA 492 I/O 1152FCBGA

  • Number of LABs/CLBs: 250540
  • Number of Logic Elements/Cells: 660000
  • Total RAM Bits: 49610752
  • Number of I/O: 492
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
封装: 1152-BBGA, FCBGA
库存3,936
EP2AGX95EF35C5ES
Intel

IC FPGA 452 I/O 1152FBGA

  • Number of LABs/CLBs: 3747
  • Number of Logic Elements/Cells: 89178
  • Total RAM Bits: 6839296
  • Number of I/O: 452
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA
库存7,936
EP3SL340H1152C4LN
Intel

IC FPGA 744 I/O 1152HBGA

  • Number of LABs/CLBs: 13500
  • Number of Logic Elements/Cells: 337500
  • Total RAM Bits: 18822144
  • Number of I/O: 744
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-HBGA (40x40)
封装: 1152-BBGA, FCBGA
库存7,840
EP4SGX290NF45C2
Intel

IC FPGA 920 I/O 1932FBGA

  • Number of LABs/CLBs: 11648
  • Number of Logic Elements/Cells: 291200
  • Total RAM Bits: 17661952
  • Number of I/O: 920
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: 1932-BBGA, FCBGA
库存3,840
5SGSED6N2F45I3L
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 220000
  • Number of Logic Elements/Cells: 583000
  • Total RAM Bits: 54553600
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: 1932-BBGA, FCBGA
库存3,200
EP4SE820F43C4
Intel

IC FPGA 1120 I/O 1760FBGA

  • Number of LABs/CLBs: 32522
  • Number of Logic Elements/Cells: 813050
  • Total RAM Bits: 34093056
  • Number of I/O: 1120
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
封装: 1760-BBGA, FCBGA
库存4,896
5SGXEA5N2F40C1N
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 53105664
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存5,984
5SGXEA7H2F35C2L
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA
库存5,328
10AX090N2F45E2LG
Intel

IC FPGA 768 I/O 1932FCBGA

  • Number of LABs/CLBs: 339620
  • Number of Logic Elements/Cells: 900000
  • Total RAM Bits: 59234304
  • Number of I/O: 768
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: 1932-BBGA, FCBGA
库存5,504
5SGSMD4H2F35I2N
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 135840
  • Number of Logic Elements/Cells: 360000
  • Total RAM Bits: 23946240
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA
库存5,776
5SGXMA3E3H29I3N
Intel

IC FPGA 360 I/O 780HBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 23704576
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
封装: 780-BBGA, FCBGA
库存3,824
5AGXMB1G4F35C4N
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 14151
  • Number of Logic Elements/Cells: 300000
  • Total RAM Bits: 17358848
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA Exposed Pad
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA Exposed Pad
库存3,632
10CX085YF672E6G
Intel

672-PIN FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存3,984
EPM7256ERC208-20YY
Intel

IC CPLD 256MC 20NS 208RQFP

  • Programmable Type: EE PLD
  • Delay Time tpd(1) Max: 20.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 5000
  • Number of I/O: 164
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP Exposed Pad
  • Supplier Device Package: 208-RQFP (28x28)
封装: 208-BFQFP Exposed Pad
库存3,952
hot EPM7512AEBI256-7
Intel

IC CPLD 512MC 7.5NS 256FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 32
  • Number of Macrocells: 512
  • Number of Gates: 10000
  • Number of I/O: 212
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封装: 256-BGA
库存3,840
EPM570T144I5
Intel

IC CPLD 440MC 5.4NS 144TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 5.4ns
  • Voltage Supply - Internal: 2.5V, 3.3V
  • Number of Logic Elements/Blocks: 570
  • Number of Macrocells: 440
  • Number of Gates: -
  • Number of I/O: 116
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封装: 144-LQFP
库存3,008
F28F020-150
Intel

FLASH NOR 2MB TSOP REVERSE 150ns

  • Memory Type: Non-Volatile
  • Memory Format: FLASH
  • Technology: FLASH - NOR
  • Memory Size: 2Mbit
  • Memory Interface: Parallel
  • Clock Frequency: -
  • Write Cycle Time - Word, Page: -
  • Access Time: 70 ns
  • Voltage - Supply: 12V
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: -
  • Supplier Device Package: 32-TSOP REVERSE
封装: -
Request a Quote
AGIB022R29A1I1VB
Intel

IC FPGA AGILEX-I 2957BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.2M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2957-BFBGA Exposed Pad
  • Supplier Device Package: 2957-BGA (56x45)
封装: -
Request a Quote
5SGXMA3E3H29I4WN
Intel

IC FPGA 600 I/O 780HBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 19456000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
封装: -
Request a Quote
5SGXMA4K2F40I3WN
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 37888000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: -
Request a Quote
5SGXMA7K1F40C1G
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: -
Request a Quote
5SEEBF45C2LG
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 359250
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 53248000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: -
Request a Quote
5SGXEA4H2F35C2G
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 37888000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: -
Request a Quote
5ASXBB5D6F35C6G
Intel

IC SOC CORTEX-A9 700MHZ 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 700MHz
  • Primary Attributes: FPGA - 462K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA, FC (35x35)
封装: -
Request a Quote
RJ80530MY650256
Intel

IC MPU INTEL 650MHZ PBGA479

  • Core Processor: Mobile Intel® Celeron® Processor M LV
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 650MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.1V
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Security Features: -
  • Package / Case: 479-BGA
  • Supplier Device Package: 479-PBGA (35x35)
封装: -
Request a Quote
EP4SGX230HF35C4G
Intel

IC FPGA 564 I/O 1152FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
5SGXMA3H3F35C2G
Intel

IC FPGA 600 I/O 1152FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 19456000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: -
Request a Quote