图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Main Purpose | Input | Output | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
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Microchip Technology |
2-OUTPUT AUTOMTIVE GRADE MEMS PC
|
封装: - |
Request a Quote |
|
PCI Express (PCIe) | - | HCSL, LVCMOS, LVDS | 1 | 1:2 | No/Yes | 100MHz | 2.25V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount | 14-VFQFN Exposed Pad | 14-QFN (2.5x3.2) |
||
Microchip Technology |
2-OUTPUT AUTOMOTIVE GRADE MEMS P
|
封装: - |
Request a Quote |
|
PCI Express (PCIe) | - | HCSL | 1 | 1:2 | No/Yes | 100MHz | 2.25V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount | 14-VFQFN Exposed Pad | 14-QFN (2.5x3.2) |
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Microchip Technology |
2-OUTPUT AUTO GRADE MEMS PCIE CL
|
封装: - |
Request a Quote |
|
PCI Express (PCIe) | - | HCSL, LVCMOS, LVDS | 1 | 1:2 | No/Yes | 100MHz | 2.25V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount | 14-VFQFN Exposed Pad | 14-QFN (2.5x3.2) |
||
Microchip Technology |
TRIPLE CHANNEL SYNCE TIMING CARD
|
封装: - |
Request a Quote |
|
Ethernet, SONET/SDH, Wireless Base Stations | CMOS | CMOS, HCSL, HSTL, LVDS, LVPECL | 3 | 5:10 | Yes/Yes | 1.045GHz | 1.8V, 3.3V | -40°C ~ 85°C | Surface Mount | 80-VFLGA | 80-LGA (11x11) |
||
Microchip Technology |
3-CHANNEL, 10-OUTPUT 1588 TIMING
|
封装: - |
Request a Quote |
|
Memory | - | CMOS | 1 | 5:10 | Yes/Yes | 750MHz | 1.8V, 3.3V | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-VQFN (9x9) |
||
Microchip Technology |
3-CHANNEL, 10-OUTPUT SYNCE TIMIN
|
封装: - |
Request a Quote |
|
Ethernet | - | CMOS | 1 | 5:10 | Yes/Yes | 500MHz | 1.8V, 3.3V | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-VQFN (9x9) |
||
Microchip Technology |
2-OUTPUT AUTOMTIVE GRADE MEMS PC
|
封装: - |
Request a Quote |
|
PCI Express (PCIe) | - | HCSL, LVCMOS, LVDS | 1 | 1:2 | No/Yes | 100MHz | 2.25V ~ 3.63V | -40°C ~ 85°C (TA) | Surface Mount | 14-VFQFN Exposed Pad | 14-QFN (2.5x3.2) |
||
Microchip Technology |
FOUR CHANNEL 10 OUTPUT 1588 TIMI
|
封装: - |
Request a Quote |
|
- | - | CMOS | 7 | 10:10 | Yes/Yes | 750MHz | 1.8V, 3.3V | - | Surface Mount | 64-VFQFN Exposed Pad | 64-VQFN (9x9) |
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Microchip Technology |
MEMS PCIE CLOCK GENERATOR, -40C
|
封装: - |
Request a Quote |
|
PCI Express (PCIe) | - | HCSL | 1 | 1:4 | No/Yes | 100MHz | 2.25V ~ 3.63V | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | 20-VQFN (5x3.2) |
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Microchip Technology |
3-CHANNEL, 10-OUTPUT LINE CARD
|
封装: - |
Request a Quote |
|
Ethernet, SONET/SDH, Wireless Base Stations | CMOS | CMOS, LVDS, LVPECL | 3 | 5:10 | Yes/Yes | 750MHz | 1.8V, 3.3V | - | Surface Mount | 64-VFQFN Exposed Pad | 64-VQFN (9x9) |
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Microchip Technology |
19 OUTPUT HCSL GEN 1-5 PCIE & PL
|
封装: - |
Request a Quote |
|
PCI Express (PCIe) | - | HCSL | 1 | 1:19 | No/No | - | - | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
19 OUTPUT HCSL GEN 1-5 PCIE & PL
|
封装: - |
Request a Quote |
|
PCI Express (PCIe) | - | HCSL | 1 | 1:19 | No/No | - | - | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
DUAL CHANNEL 1588 TIMING CARD
|
封装: - |
Request a Quote |
|
Ethernet, SONET/SDH | CMOS | CMOS, HCSL, HSTL, LVDS, LVPECL | 2 | 5:10 | Yes/Yes | 1.045GHz | 1.8V, 3.3V | -40°C ~ 85°C | Surface Mount | 80-VFLGA | 80-LGA (11x11) |
||
Microchip Technology |
156.25 LVPECL X 4
|
封装: - |
Request a Quote |
|
Ethernet, Fiber Channel | Crystal | LVPECL | 1 | 1:4 | No/Yes | 625MHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (7x7) |
||
Microchip Technology |
SINGLE CHANNEL SYNCE TIMING CARD
|
封装: - |
Request a Quote |
|
Ethernet, SONET/SDH, Wireless Base Stations | CMOS | CMOS, HCSL, HSTL, LVDS, LVPECL | 1 | 5:10 | Yes/Yes | 1.045GHz | 1.8V, 3.3V | -40°C ~ 85°C | Surface Mount | 80-VFLGA | 80-LGA (11x11) |
||
Microchip Technology |
2-CHANNEL, 10-OUTPUT 1588 TIMING
|
封装: - |
库存798 |
|
- | - | CMOS | 5 | 10:10 | Yes/Yes | 750MHz | 1.8V, 3.3V | - | Surface Mount | 64-VFQFN Exposed Pad | 64-VQFN (9x9) |
||
Microchip Technology |
ZL30271LDG1Q0BK
|
封装: - |
Request a Quote |
|
Memory, PCI Express (PCIe), SONET/SDH | CMOS, Crystal | CMOS, LVDS, LVPECL | 1 | 3:10 | No/Yes | 750MHz | 1.71V ~ 1.89V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microchip Technology |
1-CHANNEL, 10-OUTPUT LINE CARD
|
封装: - |
Request a Quote |
|
Ethernet, SONET/SDH, Wireless Base Stations | CMOS | CMOS, LVDS, LVPECL | 1 | 5:10 | Yes/Yes | 750MHz | 1.8V, 3.3V | - | Surface Mount | 64-VFQFN Exposed Pad | 64-VQFN (9x9) |
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Microchip Technology |
TRIPLE CHANNEL 1588 TIMING CARD
|
封装: - |
库存528 |
|
Ethernet, SONET/SDH, Wireless Base Stations | CMOS | CMOS, HCSL, HSTL, LVDS, LVPECL | 3 | 5:10 | Yes/Yes | 1.045GHz | 1.8V, 3.3V | -40°C ~ 85°C | Surface Mount | 80-VFLGA | 80-LGA (11x11) |
||
Microchip Technology |
MEMS OSC XO 100.0000MHZ LVDS SMD
|
封装: - |
Request a Quote |
|
PCI Express (PCIe) | - | LVDS | 1 | 0:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 105°C | Surface Mount | 14-VFQFN Exposed Pad | - |
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Microchip Technology |
2-OUTPUT MEMS PCIE GEN1/2/3/4 CL
|
封装: - |
库存354 |
|
PCI Express (PCIe) | - | HCSL, LVCMOS, LVDS | 1 | 1:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 14-VFQFN Exposed Pad | 14-QFN (2.5x3.2) |
||
Microchip Technology |
MEMS OSC XO 100.0000MHZ LVDS SMD
|
封装: - |
Request a Quote |
|
PCI Express (PCIe) | - | LVDS | 1 | 0:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 105°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | - |
||
Microchip Technology |
MEMS PCIE CLOCK GENETATOT -40C-1
|
封装: - |
Request a Quote |
|
PCI Express (PCIe) | - | HCSL | 1 | 0:03 | No/Yes | 460MHz | 2.25V ~ 3.6V | -40°C ~ 105°C | Surface Mount | 20-VFQFN Exposed Pad | - |
||
Microchip Technology |
DUAL CHANNEL SYNCE LINE CARD
|
封装: - |
Request a Quote |
|
Ethernet, SONET/SDH, Wireless Base Stations | CMOS | CMOS, HCSL, HSTL, LVDS, LVPECL | 2 | 5:10 | Yes/Yes | 1.045GHz | 1.8V, 3.3V | -40°C ~ 85°C | Surface Mount | 80-VFLGA | 80-LGA (11x11) |
||
Microchip Technology |
20-OUTPUT TIMEBUFFER WITH ETOD I
|
封装: - |
Request a Quote |
|
SONET/SDH | CMOS | CMOS, LVDS, LVPECL | 1 | 5:10 | Yes/Yes | 500MHz | 1.8V, 3.3V | - | Surface Mount | 64-VFQFN Exposed Pad | 64-VQFN (9x9) |
||
Microchip Technology |
2-OUTPUT AUTO GRADE MEMS PCIE CL
|
封装: - |
库存3,000 |
|
PCI Express (PCIe) | - | HCSL, LVCMOS, LVDS | 1 | 1:2 | No/Yes | 100MHz | 2.25V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount | 14-VFQFN Exposed Pad | 14-QFN (2.5x3.2) |
||
Microchip Technology |
5-CHANNEL, 10-OUTPUT SYNCE TIMIN
|
封装: - |
库存762 |
|
Ethernet, SONET/SDH, Wireless Base Stations | CMOS | CMOS, LVDS, LVPECL | 1 | 5:10 | Yes/Yes | 750MHz | 1.8V, 3.3V | - | Surface Mount | 64-VFQFN Exposed Pad | 64-VQFN (9x9) |
||
Microchip Technology |
TRIPLE CHANNEL SYNCE TIMING CARD
|
封装: - |
Request a Quote |
|
Ethernet, SONET/SDH, Wireless Base Stations | CMOS | CMOS, HCSL, HSTL, LVDS, LVPECL | 3 | 5:10 | Yes/Yes | 1.045GHz | 1.8V, 3.3V | -40°C ~ 85°C | Surface Mount | 80-VFLGA | 80-LGA (11x11) |