图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
CITRINE ZL40260 ES4 ENGCBA ETQFP
|
封装: 32-TQFP Exposed Pad |
库存8,964 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVPECL | 1.6GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 32-TQFP Exposed Pad | 32-eTQFP (7x7) |
||
Microchip Technology |
DB2000Q BUFFER WITH ULTRA LOW JI
|
封装: 72-VFQFN Exposed Pad |
库存6,600 |
|
1 | 1:20 | Yes/Yes | Clock | HCSL | 250MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Microchip Technology |
BUFFER W/ULTRA LOW ADDITIVE JITT
|
封装: 72-VFQFN Exposed Pad |
库存7,584 |
|
1 | 1:20 | Yes/Yes | Clock | HCSL | 250MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Microchip Technology |
DB2000Q BUFFER WITH ULTRA LOW JI
|
封装: 72-VFQFN Exposed Pad |
库存19,740 |
|
1 | 1:20 | Yes/Yes | Clock | HCSL | 250MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Microchip Technology |
SINGLE APLL 6-OUTPUT SYNTHESIZER
|
封装: 20-VFQFN Exposed Pad |
库存17,088 |
|
1 | 1:4 | Yes/Yes | Clock | HCSL | 400MHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (4x4) |
||
Microchip Technology |
10 OUTPUT PROGRAMMABLE FANOUT BU
|
封装: 56-VFQFN Exposed Pad |
库存6,360 |
|
1 | 4:10 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
6 OUTPUT PROGRAMMABLE FANOUT BUF
|
封装: 56-VFQFN Exposed Pad |
库存6,336 |
|
1 | 4:6 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 3
|
封装: 48-VFQFN Exposed Pad |
库存7,568 |
|
1 | 3:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | HCSL, LVCMOS, LVDS, LVPECL | 1.6GHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microchip Technology |
6 OUTPUT PROGRAMMABLE FANOUT BUF
|
封装: - |
库存7,776 |
|
1 | 4:6 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71V ~ 3.465V | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 2
|
封装: 32-VFQFN Exposed Pad |
库存9,396 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVPECL | 1.6GHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 4:3 32QFN
|
封装: 32-VFQFN Exposed Pad |
库存8,100 |
|
1 | 4:3 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 2
|
封装: 40-VFQFN Exposed Pad |
库存8,688 |
|
1 | 3:5 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | HCSL, LVCMOS, LVDS, LVPECL | 1.6GHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Microchip Technology |
TEN LVCMOS OUTPUT LOW ADDITIVE J
|
封装: 32-VFQFN Exposed Pad |
库存8,460 |
|
1 | 3:10 | Yes/No | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVCMOS | 250MHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 3
|
封装: 32-VFQFN Exposed Pad |
库存6,972 |
|
1 | 3:5 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | HCSL, LVCMOS, LVDS, LVPECL | 1.6GHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
封装: 16-VFQFN Exposed Pad |
库存8,856 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
TEN LVCMOS OUTPUT LOW ADDITIVE J
|
封装: 32-VFQFN Exposed Pad |
库存6,416 |
|
1 | 3:10 | Yes/No | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVCMOS | 200MHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
封装: 16-VFQFN Exposed Pad |
库存10,848 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
OS81082AH-C2A-010500
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 2:12 250MHZ 56VQFN
|
封装: - |
Request a Quote |
|
1 | 2:12 | Yes/Yes | CML, HCSL, LVDS, PECL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-VQFN (8x8) |
||
Microchip Technology |
IC CLK BUFFER 1:2 250MHZ 16VQFN
|
封装: - |
库存16,425 |
|
1 | 1:2 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 250MHZ 16VQFN
|
封装: - |
库存38,526 |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 250MHZ 16VQFN
|
封装: - |
Request a Quote |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 250MHZ 8VDFN
|
封装: - |
库存10,659 |
|
1 | 1:2 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 8-VFDFN | 8-VDFN (1.6x1.4) |
||
Microchip Technology |
IC CLK BUFFER 1:2 250MHZ 16VQFN
|
封装: - |
库存360 |
|
1 | 1:2 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 250MHZ 16VQFN
|
封装: - |
库存1,998 |
|
1 | 1:2 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 250MHZ 16VQFN
|
封装: - |
库存14,880 |
|
1 | 1:2 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 250MHZ 16VQFN
|
封装: - |
Request a Quote |
|
1 | 1:2 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 250MHZ 16VQFN
|
封装: - |
库存27,723 |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |