图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC INTERFACE CONTROLLER
|
封装: - |
库存7,392 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
封装: 244-BBGA, FCBGA |
库存5,328 |
|
- | - | - | - | - | - | Surface Mount | 244-BBGA, FCBGA | 244-FCBGA (17x17) |
||
Microchip Technology |
MODULE SONET/SDH
|
封装: - |
库存2,032 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
MODULE SONET/SDH
|
封装: - |
库存4,448 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
MODULE SONET/SDH
|
封装: - |
库存7,600 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
MODULE SONET/SDH
|
封装: - |
库存6,176 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
84/63 CHAN T1/E1 VT1.5/VT2 MAPPE
|
封装: - |
库存6,992 |
|
E1, T1 | - | - | - | - | - | - | - | - |
||
Microchip Technology |
TEMUX 336NG, PB FREE BUMP
|
封装: - |
库存2,576 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
33 LINK, 672 HDLC CHANNEL FRAME
|
封装: - |
库存2,144 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
32 LINK, 672 HDLC CHANNEL FRAME
|
封装: - |
库存5,088 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
20G VT/TU SWITCHING ELEMENT
|
封装: - |
库存5,184 |
|
Serial | 1 | - | - | - | - | Surface Mount | - | 672-FCBGA (27x27) |
||
Microchip Technology |
155 MBIT/S ATM AND PACKET-OVER-S
|
封装: - |
库存3,680 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
96-PORT (240G) STS-1 CROSS-CONNE
|
封装: - |
库存7,152 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
96-PORT (240G) STS-1 CROSS-CONNE
|
封装: - |
库存6,784 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
PM5376 TSE-NX160
|
封装: - |
库存4,464 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
40G VT/TU SWITCHING ELEMENT
|
封装: - |
库存6,640 |
|
Serial | - | 1.2V | - | - | - | Surface Mount | - | 672-FCBGA (27x27) |
||
Microchip Technology |
40G VT/TU SWITCHING ELEMENT
|
封装: - |
库存6,288 |
|
Serial | - | 1.2V | - | - | - | Surface Mount | - | 672-FCBGA (27x27) |
||
Microchip Technology |
HIGH CAPACITY SINGLE-CHIP ADD/DR
|
封装: - |
库存3,472 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SINGLE-CHIP SONET/SDH TRANSPORT
|
封装: - |
库存4,720 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SONET/SDH TRANSPORT FRAMER/AGGRE
|
封装: - |
库存2,960 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | - | 1292-FCBGA |
||
Microchip Technology |
SONET/SDH TRANSPORT FRAMER/AGGRE
|
封装: - |
库存6,048 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | - | 1292-FCBGA |
||
Microchip Technology |
SONET/SDH TRANSPORT FRAMER/AGGRE
|
封装: - |
库存4,352 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | - | 1292-FCBGA |
||
Microchip Technology |
SONET/SDH INTERFACE FOR 622 & 15
|
封装: 196-LBGA |
库存5,664 |
|
Serial | - | - | - | - | - | Surface Mount | 196-LBGA | 196-CABGA (15x15) |
||
Microchip Technology |
SONET/SDH INTERFACE FOR 622 & 15
|
封装: 196-LBGA |
库存3,744 |
|
Serial | - | - | - | - | - | Surface Mount | 196-LBGA | 196-CABGA (15x15) |
||
Microchip Technology |
74-PORT (185G) STS-1 CROSS-CONNE
|
封装: - |
库存4,304 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
FOUR CHANNEL COMBINED T1/E1/J1 T
|
封装: - |
库存2,304 |
|
E1, J1, SPI, T1 | 4 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | - | 256-CABGA (17x17) |
||
Microchip Technology |
EIGHT CHANNEL COMBINED T1/E1/J1
|
封装: - |
库存5,936 |
|
E1, J1, SPI, T1 | 8 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | - | 256-CABGA (17x17) |
||
Microchip Technology |
32 CHANNEL SHORT HAUL T1/E1 LIU
|
封装: - |
库存7,184 |
|
- | - | - | - | - | - | - | - | - |