图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 1MBIT 120NS 32CLCC
|
封装: 32-CLCC |
库存2,944 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 32FLATPACK
|
封装: - |
库存4,416 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 32FLATPACK
|
封装: 32-CFlatpack |
库存5,328 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 1MBIT 200NS 30CPGA
|
封装: 30-BCPGA |
库存6,288 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 30-BCPGA | 30-CPGA |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32FLATPACK
|
封装: 32-CFlatpack |
库存5,888 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 32CLCC
|
封装: 32-CLCC |
库存10,728 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32CLCC
|
封装: 32-CLCC |
库存5,616 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 1MBIT 250NS 32FLATPACK
|
封装: 32-CFlatpack |
库存4,784 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 1MBIT 200NS 32CLCC
|
封装: 32-CLCC |
库存3,568 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 1MBIT 200NS 32FLATPACK
|
封装: 32-CFlatpack |
库存3,792 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28CPGA
|
封装: 28-BCPGA |
库存7,424 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28CPGA
|
封装: 28-BCPGA |
库存5,856 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 28CPGA
|
封装: 28-BCPGA |
库存6,624 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 28CPGA
|
封装: 28-BCPGA |
库存3,728 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28FLATPK
|
封装: 28-CFlatPack |
库存3,312 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28FLATPK
|
封装: 28-CFlatPack |
库存4,720 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28PIN
|
封装: 28-BCPGA |
库存6,928 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28CPGA
|
封装: 28-BCPGA |
库存7,248 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28CPGA
|
封装: 28-BCPGA |
库存5,712 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 28FLATPK
|
封装: 28-CFlatPack |
库存7,024 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 28FLATPK
|
封装: 28-CFlatPack |
库存2,080 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 28CPGA
|
封装: 28-BCPGA |
库存4,464 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28CPGA
|
封装: 28-BCPGA |
库存2,912 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28CPGA
|
封装: 28-BCPGA |
库存5,152 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28CPGA
|
封装: - |
库存2,832 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28PIN
|
封装: 28-BCPGA |
库存2,112 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28CPGA
|
封装: 28-BCPGA |
库存6,992 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28PIN
|
封装: 28-BCPGA |
库存2,832 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |