图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Contact Type | Pitch - Mating | Style | Shrouding | Number of Positions | Number of Positions Loaded | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Length - Mating | Contact Length - Post | Overall Contact Length | Insulation Height | Contact Shape | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material | Insulation Material | Features | Operating Temperature | Ingress Protection | Material Flammability Rating | Insulation Color |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex, LLC |
SLIM-GRID HEADER, 10 CIRCUITS, S
|
封装: - |
库存7,398 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 10 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, SU
|
封装: - |
库存6,354 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 8 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, SU
|
封装: - |
库存3,024 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 6 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 4 CIRCUITS, SU
|
封装: - |
库存8,856 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 4 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 22 CIRCUITS, S
|
封装: - |
库存8,784 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 22 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 20 CIRCUITS, S
|
封装: - |
库存4,158 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 20 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 18 CIRCUITS, S
|
封装: - |
库存3,580 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 18 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 16 CIRCUITS, S
|
封装: - |
库存5,328 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 16 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, S
|
封装: - |
库存4,050 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 14 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 10 CIRCUITS, S
|
封装: - |
库存3,528 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 10 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, SU
|
封装: - |
库存3,276 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 8 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, SU
|
封装: - |
库存2,862 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 6 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 4 CIRCUITS, SU
|
封装: - |
库存6,300 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 4 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 24 CIRCUITS, S
|
封装: - |
库存5,796 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 24 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 24 CIRCUITS, S
|
封装: - |
库存8,766 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 24 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 24 CIRCUITS, S
|
封装: - |
库存7,002 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 24 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 24 CIRCUITS, S
|
封装: - |
库存6,570 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 24 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 22 CIRCUITS, S
|
封装: - |
库存6,570 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 22 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 22 CIRCUITS, S
|
封装: - |
库存2,880 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 22 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 22 CIRCUITS, S
|
封装: - |
库存5,616 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 22 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 22 CIRCUITS, S
|
封装: - |
库存4,734 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 22 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 22 CIRCUITS, S
|
封装: - |
库存5,148 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 22 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Gold | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 18 CIRCUITS, S
|
封装: - |
库存4,140 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 18 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 18 CIRCUITS, S
|
封装: - |
库存6,912 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 18 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 18 CIRCUITS, S
|
封装: - |
库存4,464 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 18 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 18 CIRCUITS, S
|
封装: - |
库存8,514 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 18 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 18 CIRCUITS, S
|
封装: - |
库存2,484 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 18 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Gold | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 16 CIRCUITS, S
|
封装: - |
库存5,778 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 16 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |