NXP 产品

BUK7E4R0-80E,127

NXP

MOSFET N-CH 80V 120A I2PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 80V
• Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 169nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 12030pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 349W (Tc)
• Rds On (Max) @ Id, Vgs: 4 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: I2PAK
• Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA

封装: TO-262-3 Long Leads, I2Pak, TO-262AA

PHP119NQ06T,127

NXP

MOSFET N-CH 55V 75A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 53nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 2820pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 200W (Tc)
• Rds On (Max) @ Id, Vgs: 7.1 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

封装: TO-220-3

MMRF1005HSR5

NXP

FET RF 120V 1.3GHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 1.3GHz
• Gain: 22.7dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 250W
• Voltage - Rated: 120V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

封装: NI-780S

A2T18S160W31GSR3

NXP

IC TRANS RF LDMOS

• Transistor Type: LDMOS
• Frequency: 1.88GHz
• Gain: 19.9dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1A
• Power - Output: 32W
• Voltage - Rated: 65V
• Package / Case: NI-780GS-2L2LA
• Supplier Device Package: NI-780GS-2L2LA

封装: NI-780GS-2L2LA

MRF8P20100HSR3

NXP

FET RF 2CH 65V 2.03GHZ NI780H-4

• Transistor Type: LDMOS (Dual)
• Frequency: 2.03GHz
• Gain: 16dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 400mA
• Power - Output: 20W
• Voltage - Rated: 65V
• Package / Case: NI-780S-4
• Supplier Device Package: NI-780S-4

封装: NI-780S-4

MRFE6VS25LR5

NXP

FET RF 133V 512MHZ NI360L

• Transistor Type: LDMOS
• Frequency: 512MHz
• Gain: 25.9dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 10mA
• Power - Output: 25W
• Voltage - Rated: 133V
• Package / Case: NI-360
• Supplier Device Package: NI-360

封装: NI-360

BZX84-B9V1/LF1R

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 9.1V
• Tolerance: ±2%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 15 Ohms
• Current - Reverse Leakage @ Vr: 500nA @ 6V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

封装: TO-236-3, SC-59, SOT-23-3

MC33909Q5AD

NXP

SBC 5V 1CAN 4LIN 6SG HLQFP48

• Applications: System Basis Chip
• Current - Supply: 7mA
• Voltage - Supply: 3.5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

MCZ33812AEKR2

NXP

IC DVR IGNITION/INJECTOR 32SOIC

• Applications: Automotive
• Current - Supply: 10mA
• Voltage - Supply: 4.7 V ~ 36 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

封装: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

SSL4120T/1,518

NXP

IC LED DRIVER OFFL SWITCHER 24SO

• Type: AC DC Offline Switcher
• Topology: Step-Up (Boost)
• Internal Switch(s): No
• Number of Outputs: 1
• Voltage - Supply (Min): 70V
• Voltage - Supply (Max): 276V
• Voltage - Output: -
• Current - Output / Channel: -
• Frequency: 500kHz
• Dimming: -
• Applications: -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

封装: 24-SOIC (0.295", 7.50mm Width)

CBTD16212DL,112

NXP

IC FET BUS EXCH SWCH 56-SSOP

• Type: Bus FET Exchange Switch
• Circuit: 12 x 2:2
• Independent Circuits: 1
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 56-SSOP

封装: 56-BSSOP (0.295", 7.50mm Width)

PCA9554ADB,112

NXP

IC I/O EXPANDER I2C 8B 16SSOP

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 16-SSOP

封装: 16-SSOP (0.209", 5.30mm Width)

MPC8548CVJAQGD

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

封装: 783-BBGA, FCBGA

PCF52258AG80

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 96
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

MKM14Z128ACHH5

NXP

IC MCU 32BIT 128KB FLASH 44LGA

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number of I/O: 20
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 5x16b, 4x24b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-VFLGA
• Supplier Device Package: 44-MAPLGA (5x5)

封装: 44-VFLGA

S9KEAZN16ACLH

NXP

IC MCU 32BIT 16KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 57
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

ADC1003S040TS/C1:1

NXP

IC ADC 10BIT PAR 40MHZ 28-SSOP

• Number of Bits: 10
• Sampling Rate (Per Second): 40M
• Number of Inputs: 1
• Input Type: Single Ended
• Data Interface: Parallel
• Configuration: ADC
• Ratio - S/H:ADC: -
• Number of A/D Converters: 1
• Architecture: -
• Reference Type: Internal
• Voltage - Supply, Analog: 5V
• Voltage - Supply, Digital: 5V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP
• Mounting Type: -

封装: 28-SSOP (0.209", 5.30mm Width)

MPC9331AC

NXP

IC PLL CLK GENERATOR 1:6 32-LQFP

• Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer
• PLL: Yes with Bypass
• Input: LVCMOS, LVPECL
• Output: LVCMOS
• Number of Circuits: 1
• Ratio - Input:Output: 2:6
• Differential - Input:Output: Yes/No
• Frequency - Max: 240MHz
• Divider/Multiplier: Yes/Yes
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

MC100ES6011D

NXP

IC CLK BUFFER 1:2 3GHZ 8SOIC

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 1
• Ratio - Input:Output: 1:2
• Differential - Input:Output: Yes/Yes
• Input: ECL
• Output: ECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 3.8 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

封装: 8-SOIC (0.154", 3.90mm Width)

J3A128GX0/T0AG2051

NXP

IC RF MODULE PLLCC8

• Function: -
• Frequency: -
• RF Type: -
• Secondary Attributes: -
• Package / Case: -
• Supplier Device Package: -

封装: -

BGA2802,115

NXP

MMIC AMPLIFIER 6TSSOP

• Frequency: 0Hz ~ 2.2GHz
• P1dB: 7dBm (5mW)
• Gain: 31dB
• Noise Figure: 5.1dB
• RF Type: General Purpose
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 12.5mA
• Test Frequency: 2.15GHz
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

封装: 6-TSSOP, SC-88, SOT-363

MKE15Z32VLF4

NXP

IC MCU 5V CM0+ TOUCH 48LQFP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 42
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 12x12b; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

MCIMX534AVP8C2R2

NXP

IC MPU I.MX53 800MHZ 529FBGA

• Core Processor: ARM® Cortex®-A8
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: DDR2, DDR3, LPDDR2
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100Mbps (1)
• SATA: SATA 1.5Gbps (1)
• USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
• Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 529-FBGA
• Supplier Device Package: 529-FBGA (19x19)

封装: -

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JN5189HN-001Y

NXP

WIRELESS MICROCONTROLLER

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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LS1028AXN7NQA

NXP

IC MPU QORIQ 1.3GHZ 448FBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 1.3GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: 1Gbps (1), 2.5Gbps (5)
• SATA: SATA 6Gbps (1)
• USB: -
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 448-BFBGA
• Supplier Device Package: 448-FBGA (17x17)

封装: -

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MC33FS6505CAER2

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

封装: -

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MC33PT2001MAE

NXP

SOLENOID CONTROLLER 6 64LQFP

• Applications: Solenoid Controller
• Current - Supply: -
• Voltage - Supply: 0V ~ 72V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-HLQFP (10x10)

封装: -

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FX32K146UAT0VLLT

NXP

S32K146 ARM CORTEX-M4F, 112 MHZ,

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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