页 274 - NXP 产品 | 黑森尔电子

零件编号	制造商	描述	封装	库存
MRF7S16150HSR5	NXP	FET RF 65V 1.66GHZ NI-780S Transistor Type: LDMOS Frequency: 1.6GHz ~ 1.66GHz Gain: 19.7dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.5A Power - Output: 32W Voltage - Rated: 65V Package / Case: NI-780S Supplier Device Package: NI-780S	封装: NI-780S	库存7,744
BZX284-B18,115	NXP	DIODE ZENER 18V 400MW SOD2 Voltage - Zener (Nom) (Vz): 18V Tolerance: ±2% Power - Max: 400mW Impedance (Max) (Zzt): 20 Ohms Current - Reverse Leakage @ Vr: 50nA @ 12.6V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	封装: SOD-110	库存2,304
MC22XS4200BEK	NXP	IC SWITCH HISD 24V DUAL 32SOIC Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:2 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 8 V ~ 36 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 3A Rds On (Typ): - Input Type: - Features: Slew Rate Controlled Fault Protection: Open Load Detect, Over Temperature Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	封装: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	库存3,616
74HCT4075PW-Q100J	NXP	IC GATE OR 3CH 3-INP 14-TSSOP Logic Type: OR Gate Number of Circuits: 3 Number of Inputs: 3 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): 2µA Current - Output High, Low: 4mA, - Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Supplier Device Package: 14-TSSOP Package / Case: 14-TSSOP (0.173", 4.40mm Width)	封装: 14-TSSOP (0.173", 4.40mm Width)	库存4,960
TJA1041T/CM,118	NXP	IC TRANSCEIVER CAN 14SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 70mV Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: - Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	封装: 14-SOIC (0.154", 3.90mm Width)	库存90,426
MPC8544CVTAQGA	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封装: 783-BBGA, FCBGA	库存2,992
MC68360ZQ25VLR2	NXP	IC MPU M683XX 25MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封装: 357-BBGA	库存5,760
P3041NSN7NNC	NXP	IC MPU Q OR IQ 1.333GHZ 1295BGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	封装: 1295-BBGA, FCBGA	库存6,864
MCIMX6S1AVM08ACR	NXP	IC MPU I.MX6S 800MHZ 624MAPBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	封装: 624-LFBGA	库存3,744
MCIMX6DP6AVT8AA	NXP	IC MPU I.MX6DP 852MHZ 624FCBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 852MHZ Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	封装: 624-FBGA, FCBGA	库存7,616
MC9S12C128MPBE	NXP	IC MCU 16BIT 128KB FLASH 52LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 35 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 52-LQFP Supplier Device Package: 52-LQFP (10x10)	封装: 52-LQFP	库存6,592
MC908JL3ECDWER	NXP	IC MCU 8BIT 4KB FLASH 28SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LED, LVD, POR, PWM Number of I/O: 23 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V Data Converters: A/D 12x8b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	封装: 28-SOIC (0.295", 7.50mm Width)	库存3,824
S9S12GN32F0MLFR	NXP	IC MCU 16BIT 32KB FLASH 48LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封装: 48-LQFP	库存4,768
MC9S08PT32AVLC	NXP	IC MCU 8BIT 32KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封装: 32-LQFP	库存7,968
MKL25Z128VFM4	NXP	IC MCU 32BIT 128KB FLASH 32QFN Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 23 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 7x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	封装: 32-VFQFN Exposed Pad	库存15,888
PCF2123U/12HA/1,00	NXP	IC RTC CLK/CALENDAR SPI DIE Type: Clock/Calendar Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer Memory Size: - Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD-dd Interface: SPI Voltage - Supply: 1.6 V ~ 5.5 V Voltage - Supply, Battery: - Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: Die Supplier Device Package: Die	封装: Die	库存5,712
TJF1052IT/1Y	NXP	DGTL ISOLATOR 1KV 2CH CAN 16SO Technology: Capacitive Coupling Type: CAN Isolated Power: No Number of Channels: 2 Inputs - Side 1/Side 2: 1/1 Channel Type: Unidirectional Voltage - Isolation: 1000Vrms Common Mode Transient Immunity (Min): 20kV/µs Data Rate: 2Mbps Propagation Delay tpLH / tpHL (Max): - Pulse Width Distortion (Max): - Rise / Fall Time (Typ): - Voltage - Supply: 3 V ~ 5.25 V Operating Temperature: -40°C ~ 105°C Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SO	封装: 16-SOIC (0.295", 7.50mm Width)	库存5,904
MCIMX6DP5EVT2AA	NXP	I.MX 6DUALPLUS MPU 2X ARM CORTE Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	封装: 624-FBGA, FCBGA	库存3,904
LS1020ASN7HNB	NXP	LS1 32BIT ARM SOC 800MHZ DDR3/ Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (3) SATA: SATA 3Gbps (1) USB: USB 2.0 (1), USB 3.0 + PHY Voltage - I/O: - Operating Temperature: 0°C ~ 105°C Security Features: - Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	封装: 525-FBGA, FCBGA	库存6,480
SPC5605BF1MLQ6	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 121 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 15x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封装: 144-LQFP	库存4,960
SPC5602BF2VLQ4R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 123 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 36x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封装: 144-LQFP	库存4,256
SPC5777CSK3MME4	NXP	POWER ARCH CORES, 8MB FLASH, 300 Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 300MHz Connectivity: CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 10x16b Sigma-Delta, eQADC Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	封装: -	Request a Quote
FS32K146HAT0VLLT	NXP	IC MCU 32BIT 1MB FLASH 100LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 89 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封装: -	Request a Quote
MPF5300AMBA0ESR2	NXP	IC REG BUCK ADJ 12A 24HWQFN Function: Step-Down Output Configuration: Positive Topology: Buck Output Type: Adjustable Number of Outputs: 1 Voltage - Input (Min): 2.7V Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 0.5V Voltage - Output (Max): 1.2V Current - Output: 12A Frequency - Switching: 2MHz ~ 3MHz Synchronous Rectifier: No Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 24-PowerWFQFN Supplier Device Package: 24-HWQFN (4.5x3.5)	封装: -	Request a Quote
TEA2376DT-1Y	NXP	IC Mode: Discontinuous (Transition) Frequency - Switching: 25kHz ~ 300kHz Current - Startup: - Voltage - Supply: 0V ~ 22V Operating Temperature: -25°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	封装: -	Request a Quote
MCXA143VFT	NXP	IC MCX 48MHZ SGL CR 128KB QFN48 Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	库存780
S32G233AABK0CUCR	NXP	S32G233A ARM CORTEX-M7 AND -A53 Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (4) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	封装: -	Request a Quote
LPC1115FET48-303EL	NXP	IC MCU 32BIT 64KB FLASH 48TFBGA Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-TFBGA Supplier Device Package: 48-TFBGA (4.5x4.5)	封装: -	库存7,350

MRF7S16150HSR5

NXP

FET RF 65V 1.66GHZ NI-780S

Transistor Type: LDMOS
Frequency: 1.6GHz ~ 1.66GHz
Gain: 19.7dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.5A
Power - Output: 32W
Voltage - Rated: 65V
Package / Case: NI-780S
Supplier Device Package: NI-780S

封装: NI-780S

库存7,744

BZX284-B18,115

NXP

DIODE ZENER 18V 400MW SOD2

Voltage - Zener (Nom) (Vz): 18V
Tolerance: ±2%
Power - Max: 400mW
Impedance (Max) (Zzt): 20 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 12.6V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

封装: SOD-110

库存2,304

MC22XS4200BEK

NXP

IC SWITCH HISD 24V DUAL 32SOIC

Switch Type: General Purpose
Number of Outputs: 2
Ratio - Input:Output: 1:2
Output Configuration: High Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 8 V ~ 36 V
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Current - Output (Max): 3A
Rds On (Typ): -
Input Type: -
Features: Slew Rate Controlled
Fault Protection: Open Load Detect, Over Temperature
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP

封装: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

库存3,616

74HCT4075PW-Q100J

NXP

IC GATE OR 3CH 3-INP 14-TSSOP

Logic Type: OR Gate
Number of Circuits: 3
Number of Inputs: 3
Features: -
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): 2µA
Current - Output High, Low: 4mA, -
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Supplier Device Package: 14-TSSOP
Package / Case: 14-TSSOP (0.173", 4.40mm Width)

封装: 14-TSSOP (0.173", 4.40mm Width)

库存4,960

TJA1041T/CM,118

NXP

IC TRANSCEIVER CAN 14SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 70mV
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

封装: 14-SOIC (0.154", 3.90mm Width)

库存90,426

MPC8544CVTAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封装: 783-BBGA, FCBGA

库存2,992

MC68360ZQ25VLR2

NXP

IC MPU M683XX 25MHZ 357BGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封装: 357-BBGA

库存5,760

P3041NSN7NNC

NXP

IC MPU Q OR IQ 1.333GHZ 1295BGA

Core Processor: PowerPC e500mc
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

封装: 1295-BBGA, FCBGA

库存6,864

MCIMX6S1AVM08ACR

NXP

IC MPU I.MX6S 800MHZ 624MAPBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-LFBGA
Supplier Device Package: 624-MAPBGA (21x21)

封装: 624-LFBGA

库存3,744

MCIMX6DP6AVT8AA

NXP

IC MPU I.MX6DP 852MHZ 624FCBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 852MHZ
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

封装: 624-FBGA, FCBGA

库存7,616

MC9S12C128MPBE

NXP

IC MCU 16BIT 128KB FLASH 52LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 35
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 52-LQFP
Supplier Device Package: 52-LQFP (10x10)

封装: 52-LQFP

库存6,592

MC908JL3ECDWER

NXP

IC MCU 8BIT 4KB FLASH 28SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LED, LVD, POR, PWM
Number of I/O: 23
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
Data Converters: A/D 12x8b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

封装: 28-SOIC (0.295", 7.50mm Width)

库存3,824

S9S12GN32F0MLFR

NXP

IC MCU 16BIT 32KB FLASH 48LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

库存4,768

MC9S08PT32AVLC

NXP

IC MCU 8BIT 32KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 28
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

库存7,968

MKL25Z128VFM4

NXP

IC MCU 32BIT 128KB FLASH 32QFN

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O: 23
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 7x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN (5x5)

封装: 32-VFQFN Exposed Pad

库存15,888

PCF2123U/12HA/1,00

NXP

IC RTC CLK/CALENDAR SPI DIE

Type: Clock/Calendar
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Memory Size: -
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Interface: SPI
Voltage - Supply: 1.6 V ~ 5.5 V
Voltage - Supply, Battery: -
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: -
Package / Case: Die
Supplier Device Package: Die

封装: Die

库存5,712

TJF1052IT/1Y

NXP

DGTL ISOLATOR 1KV 2CH CAN 16SO

Technology: Capacitive Coupling
Type: CAN
Isolated Power: No
Number of Channels: 2
Inputs - Side 1/Side 2: 1/1
Channel Type: Unidirectional
Voltage - Isolation: 1000Vrms
Common Mode Transient Immunity (Min): 20kV/µs
Data Rate: 2Mbps
Propagation Delay tpLH / tpHL (Max): -
Pulse Width Distortion (Max): -
Rise / Fall Time (Typ): -
Voltage - Supply: 3 V ~ 5.25 V
Operating Temperature: -40°C ~ 105°C
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SO

封装: 16-SOIC (0.295", 7.50mm Width)

库存5,904

MCIMX6DP5EVT2AA

NXP

I.MX 6DUALPLUS MPU 2X ARM CORTE

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -20°C ~ 105°C (TJ)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

封装: 624-FBGA, FCBGA

库存3,904

LS1020ASN7HNB

NXP

LS1 32BIT ARM SOC 800MHZ DDR3/

Core Processor: ARM® Cortex®-A7
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: GbE (3)
SATA: SATA 3Gbps (1)
USB: USB 2.0 (1), USB 3.0 + PHY
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C
Security Features: -
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

封装: 525-FBGA, FCBGA

库存6,480

SPC5605BF1MLQ6

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 121
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 15x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

库存4,960

SPC5602BF2VLQ4R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 123
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 36x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

库存4,256

SPC5777CSK3MME4

NXP

POWER ARCH CORES, 8MB FLASH, 300

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 300MHz
Connectivity: CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Data Converters: A/D 10x16b Sigma-Delta, eQADC
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

封装: -

Request a Quote

FS32K146HAT0VLLT

NXP

IC MCU 32BIT 1MB FLASH 100LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 89
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封装: -

Request a Quote

MPF5300AMBA0ESR2

NXP

IC REG BUCK ADJ 12A 24HWQFN

Function: Step-Down
Output Configuration: Positive
Topology: Buck
Output Type: Adjustable
Number of Outputs: 1
Voltage - Input (Min): 2.7V
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 0.5V
Voltage - Output (Max): 1.2V
Current - Output: 12A
Frequency - Switching: 2MHz ~ 3MHz
Synchronous Rectifier: No
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 24-PowerWFQFN
Supplier Device Package: 24-HWQFN (4.5x3.5)

封装: -

Request a Quote

TEA2376DT-1Y

NXP

IC

Mode: Discontinuous (Transition)
Frequency - Switching: 25kHz ~ 300kHz
Current - Startup: -
Voltage - Supply: 0V ~ 22V
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

封装: -

Request a Quote

MCXA143VFT

NXP

IC MCX 48MHZ SGL CR 128KB QFN48

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

库存780

S32G233AABK0CUCR

NXP

S32G233A ARM CORTEX-M7 AND -A53

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
Speed: 400MHz, 1GHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: GbE (4)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

封装: -

Request a Quote

LPC1115FET48-303EL

NXP

IC MCU 32BIT 64KB FLASH 48TFBGA

Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit Single-Core
Speed: 50MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 8x10b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TFBGA
Supplier Device Package: 48-TFBGA (4.5x4.5)

封装: -

库存7,350