NXP 产品

MRFE6S9201HR3

NXP

FET RF 66V 880MHZ NI-780

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 20.8dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.4A
• Power - Output: 40W
• Voltage - Rated: 66V
• Package / Case: NI-780
• Supplier Device Package: NI-780

封装: NI-780

PMGD8000LN,115

NXP

MOSFET 2N-CH 30V 0.125A 6TSSOP

• FET Type: 2 N-Channel (Dual)
• FET Feature: Logic Level Gate
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 125mA
• Rds On (Max) @ Id, Vgs: 8 Ohm @ 10mA, 4V
• Vgs(th) (Max) @ Id: 1.5V @ 100µA
• Gate Charge (Qg) (Max) @ Vgs: 0.35nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 18.5pF @ 5V
• Power - Max: 200mW
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

封装: 6-TSSOP, SC-88, SOT-363

BB174X

NXP

DIODE VHF VAR CAP 30V SOD523

• Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
• Capacitance Ratio: 10.9
• Capacitance Ratio Condition: C1/C28
• Voltage - Peak Reverse (Max): 30V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

封装: SC-79, SOD-523

BY359X-1500,127

NXP

DIODE GEN PURP 1.5KV 10A TO220F

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 1500V
• Current - Average Rectified (Io): 10A (DC)
• Voltage - Forward (Vf) (Max) @ If: 1.8V @ 20A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 600ns
• Current - Reverse Leakage @ Vr: 100µA @ 1300V
• Capacitance @ Vr, F: -
• Mounting Type: Through Hole
• Package / Case: TO-220-2 Full Pack, Isolated Tab
• Supplier Device Package: TO-220FP
• Operating Temperature - Junction: 150°C (Max)

封装: TO-220-2 Full Pack, Isolated Tab

LD6806F/29H,115

NXP

IC REG LINEAR 2.9V 200MA 6-XSON

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.9V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.13V @ 200mA
• Current - Output: 200mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT886 (1.45x1)

封装: 6-XFDFN

MC13892CJVLR2

NXP

IC PWR MGMT I.MX35/51 186BGA

• Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 186-LFBGA
• Supplier Device Package: 186-PBGA (12x12)

封装: 186-LFBGA

N74F3038N,602

NXP

IC GATE NAND 4CH 2-INP 16-DIP

• Logic Type: NAND Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: Open Collector
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): -
• Current - Output High, Low: -, 160mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 11.5ns @ 5V, 50pF
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Supplier Device Package: 16-DIP
• Package / Case: 16-DIP (0.300", 7.62mm)

封装: 16-DIP (0.300", 7.62mm)

74HC652DB,112

NXP

IC TXRX NON-INV 3-ST 8BIT 24SSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 7.8mA, 7.8mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

封装: 24-SSOP (0.209", 5.30mm Width)

NCX2220GT,115

NXP

IC COMPARATOR DUAL LV 8XSON

• Type: General Purpose
• Number of Elements: 2
• Output Type: Rail-to-Rail
• Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V
• Voltage - Input Offset (Max): 30mV @ 5.5V
• Current - Input Bias (Max): 1pA
• Current - Output (Typ): 68mA
• Current - Quiescent (Max): 5µA
• CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
• Propagation Delay (Max): 0.8µs
• Hysteresis: 9mV
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-XFDFN
• Mounting Type: Surface Mount
• Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)

封装: 8-XFDFN

SC16IS850LIPW,118

NXP

IC UART I2C/SPI 24TSSOP

• Features: -
• Number of Channels: 1, UART
• FIFO's: 128 Byte
• Protocol: RS232, RS485
• Data Rate (Max): 5Mbps
• Voltage - Supply: 1.65 V ~ 1.95 V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: -
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

封装: 24-TSSOP (0.173", 4.40mm Width)

UJA1078ATW/3V3WD,1

NXP

IC SBC CAN/LIN 3.3V HS 32HTSSOP

• Applications: Automotive
• Interface: CAN, LIN
• Voltage - Supply: 4.5 V ~ 28 V
• Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
• Supplier Device Package: 32-HTSSOP
• Mounting Type: Surface Mount

封装: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

SAA7103E/V4,557

NXP

IC DIGITAL VIDEO ENCODER 156LBGA

• Type: Video Encoder
• Applications: Graphics, Laptops
• Voltage - Supply, Analog: 3.15 V ~ 3.45 V
• Voltage - Supply, Digital: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Package / Case: 156-LBGA
• Supplier Device Package: 156-LBGA (15x15)

封装: 156-LBGA

UDA1341TS/N1,518

NXP

IC AUDIO CODEC 20BIT 28SSOP

• Type: Stereo Audio
• Data Interface: Serial
• Resolution (Bits): 20 b
• Number of ADCs / DACs: 4 / 2
• Sigma Delta: Yes
• S/N Ratio, ADCs / DACs (db) Typ: 100 / 100
• Dynamic Range, ADCs / DACs (db) Typ: -
• Voltage - Supply, Analog: 2.4 V ~ 3.6 V
• Voltage - Supply, Digital: 2.4 V ~ 3.6 V
• Operating Temperature: -20°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

封装: 28-SSOP (0.209", 5.30mm Width)

P2041NXE1MMB

NXP

IC MPU Q OR IQ 1.2GHZ 780FCBGA

• Core Processor: PowerPC e500mc
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Security; SEC 4.2
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FCPBGA (23x23)

封装: 780-BBGA, FCBGA

SC5554MVR132

NXP

IC MCU 32BIT 2MB FLASH 416BGA

• Core Processor: e200z6
• Core Size: 32-Bit
• Speed: 132MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 256
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
• Data Converters: A/D 40x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BBGA
• Supplier Device Package: 416-PBGA (27x27)

封装: 416-BBGA

P87C51RC+4N,112

NXP

IC MCU 8BIT 32KB OTP 40DIP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-DIP

封装: 40-DIP (0.600", 15.24mm)

LPC2194JBD64,151

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: CAN, I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 46
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

MCF5307FT90B

NXP

IC MCU 32BIT ROMLESS 208FQFP

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 90MHz
• Connectivity: EBI/EMI, I2C, UART/USART
• Peripherals: DMA, POR, WDT
• Number of I/O: 16
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-FQFP (28x28)

封装: 208-BFQFP

S912ZVLA12F0MLCR

NXP

IC MCU 16BIT 128KB FLASH 32LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 19
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

MC9S08QG8MFFE

NXP

IC MCU 8BIT 8KB FLASH 16QFN

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 16-VQFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (5x5)

封装: 16-VQFN Exposed Pad

MCF5274LVM166

NXP

IC MCU 32BIT ROMLESS 196MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 166MHz
• Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number of I/O: 61
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

封装: 196-LBGA

MKE02Z64VLH2

NXP

IC MCU 32BIT 64KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: LVD, PWM, WDT
• Number of I/O: 57
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 2x6b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

JN5168-001-M06Z

NXP

RF TXRX MODULE 802.15.4 U.FL ANT

• RF Family/Standard: 802.15.4
• Protocol: Zigbee?
• Modulation: O-QPSK
• Frequency: 2.4GHz
• Data Rate: -
• Power - Output: 22dBm
• Sensitivity: -100dBm
• Serial Interfaces: I2C, SPI, UART
• Antenna Type: Not Included, U.FL
• Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
• Voltage - Supply: 2 V ~ 3.6 V
• Current - Receiving: 22mA
• Current - Transmitting: 175mA
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 27-SMD Module

封装: 27-SMD Module

TEA19031AQT/1J

NXP

SMART CHARGING PROTOCOL CONTR US

• Output Isolation: -
• Internal Switch(s): -
• Voltage - Breakdown: -
• Topology: -
• Voltage - Start Up: -
• Voltage - Supply (Vcc/Vdd): -
• Duty Cycle: -
• Frequency - Switching: -
• Power (Watts): -
• Fault Protection: -
• Control Features: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

封装: -

SPC5777CSK3MME3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

• Core Processor: e200z7
• Core Size: 32-Bit Tri-Core
• Speed: 264MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
• Peripherals: DMA, LVD, POR, Zipwire
• Number of I/O: -
• Program Memory Size: 8MB (8M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16b Sigma-Delta, eQADC
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BGA
• Supplier Device Package: 416-MAPBGA (27x27)

封装: 416-BGA

S908EY16AE0CFJER

NXP

8-BIT MCU HC08 CORE 16KB FLASH

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: LINbus, SCI, SPI
• Peripherals: POR, PWM
• Number of I/O: 24
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

S912ZVL64AMLC

NXP

S12Z CPU, 64K FLASH

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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LPC1225FBD48-301EL

NXP

IC MCU 32BIT 64KB FLASH 48LQFP

• Core Processor: ARM® Cortex®-M0
• Core Size: 32-Bit Single-Core
• Speed: 45MHz
• Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
• Number of I/O: 39
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: A/D 8x10b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

封装: -