NXP 产品

2N5401,116

NXP

TRANS PNP 150V 0.3A TO-92

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 300mA
• Voltage - Collector Emitter Breakdown (Max): 150V
• Vce Saturation (Max) @ Ib, Ic: 500mV @ 5mA, 50mA
• Current - Collector Cutoff (Max): 50nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 5V
• Power - Max: 630mW
• Frequency - Transition: 300MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

封装: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

MMPF0100F2EPR2

NXP

IC PWR MGMT I.MX6 56QFN

• Applications: Converter, i.MX6
• Voltage - Input: 2.8 V ~ 4.5 V
• Number of Outputs: 12
• Voltage - Output: Multiple
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN (8x8)

封装: 56-VFQFN Exposed Pad

LD6815TD/21H,125

NXP

IC REG LINEAR 2.1V 150MA 5TSOP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.1V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.25V @ 150mA (Typ)
• Current - Output: 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 35µA ~ 150µA
• PSRR: 75dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Transient Voltage
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: 5-TSOP

封装: SC-74A, SOT-753

TEA1832TS/1X

NXP

IC REG CTRLR FLYBACK PWM 6TSOP

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: -
• Topology: Flyback
• Voltage - Start Up: 22V
• Voltage - Supply (Vcc/Vdd): 10.5 V ~ 36 V
• Duty Cycle: 90%
• Frequency - Switching: 36kHz ~ 130kHz
• Power (Watts): -
• Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
• Control Features: -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: SC-74, SOT-457
• Supplier Device Package: 6-TSOP
• Mounting Type: Surface Mount

封装: SC-74, SOT-457

74LVU04BQ,115

NXP

IC HEX INVERTER 14-DHVQFN

• Logic Type: Inverter
• Number of Circuits: 6
• Number of Inputs: 6
• Features: -
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Max): 40µA
• Current - Output High, Low: 12mA, 12mA
• Logic Level - Low: 0.2 V ~ 0.5 V
• Logic Level - High: 1 V ~ 2.4 V
• Max Propagation Delay @ V, Max CL: 7ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-DHVQFN (2.5x3)
• Package / Case: 14-VFQFN Exposed Pad

封装: 14-VFQFN Exposed Pad

MHW8242AN

NXP

IC CATV AMP MOD 860MHZ 7-CATV

• Applications: CATV
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 318mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Mounting Type: Surface Mount
• Package / Case: Module
• Supplier Device Package: 7-CATV Module

封装: Module

MCZ33780EGR2

NXP

IC MASTER DUAL DBUS DIFF 16-SOIC

• Applications: -
• Interface: SPI
• Voltage - Supply: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC
• Mounting Type: Surface Mount

封装: 16-SOIC (0.295", 7.50mm Width)

MPC8548PXAQGB

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

封装: 783-BBGA, FCBGA

MC8641DHX1333JB

NXP

IC MPU MPC86XX 1.333GHZ 1023BGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BCBGA, FCCBGA
• Supplier Device Package: 1023-FCCBGA (33x33)

封装: 1023-BCBGA, FCCBGA

MCIMX6S5EVM10AB

NXP

IC MPU I.MX6S 1.0GHZ 624MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -20°C ~ 105°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

封装: 624-LFBGA

PC56F84786VLK

NXP

IC MCU 32BIT 256KB FLASH 80LQFP

• Core Processor: 56800EX
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 68
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x12b, 10x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

封装: 80-LQFP

PPC5121VY400

NXP

IC MCU 32BIT ROMLESS 516FPBGA

• Core Processor: e300
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, USB OTG
• Peripherals: DMA, WDT
• Number of I/O: 147
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

封装: 516-BBGA

MC68HC11K1VFNE4

NXP

IC MCU 8BIT ROMLESS 84PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 37
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: 640 x 8
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.21x29.21)

封装: 84-LCC (J-Lead)

MC9S08DZ32MLF

NXP

IC MCU 8BIT 32KB FLASH 48LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

MC68HC711K4CFN4

NXP

IC MCU 8BIT 24KB OTP 84PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 62
• Program Memory Size: 24KB (24K x 8)
• Program Memory Type: OTP
• EEPROM Size: 640 x 8
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.21x29.21)

封装: 84-LCC (J-Lead)

S9S12HZ128J3VAL

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

封装: 112-LQFP

LPC1857JET256,551

NXP

IC MCU 32BIT 1MB FLASH 256LBGA

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 164
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 16K x 8
• RAM Size: 136K x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-LBGA (17x17)

封装: 256-LBGA

MC9S08AC60CFJE

NXP

IC MCU 8BIT 60KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

MKL02Z32VFK4

NXP

IC MCU 32BIT 32KB FLASH 24QFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-QFN (4x4)

封装: 24-VFQFN Exposed Pad

MC9S08QD2MSC

NXP

IC MCU 8BIT 2KB FLASH 8SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 4
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

封装: 8-SOIC (0.154", 3.90mm Width)

MPC9992FA

NXP

IC PLL CLOCK GENERATOR 32-LQFP

• Type: Clock Generator, Fanout Distribution, Multiplexer
• PLL: Yes with Bypass
• Input: PECL, Crystal
• Output: PECL
• Number of Circuits: 1
• Ratio - Input:Output: 2:7
• Differential - Input:Output: Yes/Yes
• Frequency - Max: 400MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

MPXV7007GP

NXP

PRESSURE SENSOR SIDE PORT 8-SOP

• Pressure Type: Compound
• Operating Pressure: ±1.02 PSI (±7 kPa)
• Output Type: Analog Voltage
• Output: 0.5 V ~ 4.5 V
• Accuracy: ±5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: Male - 0.13" (3.17mm) Tube
• Port Style: Barbed
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: ±10.88 PSI (±75 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD, Gull Wing, Side Port
• Supplier Device Package: 8-SOP

封装: 8-SMD, Gull Wing, Side Port

MMA1631IKWR2

NXP

ACCELEROMETER DSI2.5 16QFN

• Type: Digital
• Axis: Z
• Acceleration Range: ±312g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: 12V
• Features: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (6x6)

封装: 16-QFN Exposed Pad

MW7IC915NT1

NXP

IC PWR AMP HV7 900MHZ 15W 24PQFN

• Frequency: 728MHz ~ 960MHz
• P1dB: 15.5W
• Gain: 38dB
• Noise Figure: -
• RF Type: W-CDMA
• Voltage - Supply: 28V
• Current - Supply: -
• Test Frequency: -
• Package / Case: 24-PowerQFN
• Supplier Device Package: 24-PQFN (8x8)

封装: 24-PowerQFN

MIMXRT1021CAF4A

NXP

I.MXRT1020 100LQFP

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

封装: -

S9S08RNA60W1VLHR

NXP

8-BIT MCU S08 CORE 60KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 55
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

FS32K144HFT0MLFR

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
• Number of I/O: 89
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 16x12b SAR; D/A 1x8b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

封装: -

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SAF7755HV-N205W-BY

NXP

CAR DISP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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