TE Connectivity Passive Product 产品

NTC0805J1K0

TE Connectivity Passive Product

NTC THERMISTOR 1K OHM 5% 0805

• Resistance in Ohms @ 25°C: 1k
• Resistance Tolerance: ±5%
• B Value Tolerance: ±5%
• B0/50: -
• B25/50: -
• B25/75: -
• B25/85: -
• B25/100: -
• Operating Temperature: -55°C ~ 125°C
• Power - Max: 125mW
• Length - Lead Wire: -
• Mounting Type: Surface Mount
• Package / Case: 0805 (2012 Metric)

封装: 0805 (2012 Metric)

H4681KBYA

TE Connectivity Passive Product

RES 681K OHM 1/2W 0.1% AXIAL

• Resistance: 681 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H48K25BCA

TE Connectivity Passive Product

RES 8.25K OHM 1/2W 0.1% AXIAL

• Resistance: 8.25 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

C3A4K3JT

TE Connectivity Passive Product

RES 4.30K OHM 3W 5% AXIAL

• Resistance: 4.3 kOhms
• Tolerance: ±5%
• Power (Watts): 3W
• Composition: Wirewound
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.224" Dia x 0.512" L (5.70mm x 13.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H824K9BYA

TE Connectivity Passive Product

RES 24.9K OHM 1/4W 0.1% AXIAL

• Resistance: 24.9 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.098" Dia x 0.283" L (2.50mm x 7.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H838K3DCA

TE Connectivity Passive Product

RES 38.3K OHM 1/4W 0.5% AXIAL

• Resistance: 38.3 kOhms
• Tolerance: ±0.5%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.098" Dia x 0.283" L (2.50mm x 7.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

YR1B133KCC

TE Connectivity Passive Product

RES 133K OHM 1/4W 0.1% AXIAL

• Resistance: 133 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Film
• Features: -
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -65°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.091" Dia x 0.248" L (2.30mm x 6.30mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

LR1F61K9

TE Connectivity Passive Product

RES 61.9K OHM 0.6W 1% AXIAL

• Resistance: 61.9 kOhms
• Tolerance: ±1%
• Power (Watts): 0.6W
• Composition: Metal Film
• Features: -
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.091" Dia x 0.244" L (2.30mm x 6.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

LR1F100K

TE Connectivity Passive Product

RES 100K OHM 0.6W 1% AXIAL

• Resistance: 100 kOhms
• Tolerance: ±1%
• Power (Watts): 0.6W
• Composition: Metal Film
• Features: -
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.091" Dia x 0.244" L (2.30mm x 6.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

CGSSL3R005J

TE Connectivity Passive Product

RES SMD 0.005 OHM 5% 3W 6028

• Resistance: 5 mOhms
• Tolerance: ±5%
• Power (Watts): 3W
• Composition: Metal Foil
• Features: Current Sense, Moisture Resistant
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -
• Package / Case: 6028 (15270 Metric), J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.600" L x 0.276" W (15.24mm x 7.00mm)
• Height - Seated (Max): 0.255" (6.48mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 6028 (15270 Metric), J-Lead

CRGH2512F21R

TE Connectivity Passive Product

RES SMD 21 OHM 1% 2W 2512

• Resistance: 21 Ohms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.252" L x 0.126" W (6.40mm x 3.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: 2512 (6432 Metric)

CPF-A-0805B15KE1

TE Connectivity Passive Product

RES SMD 15K OHM 0.1% 1/10W 0805

• Resistance: 15 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CPF0805B402KE1

TE Connectivity Passive Product

RES SMD 402K OHM 0.1% 1/10W 0805

• Resistance: 402 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

5-2176074-7

TE Connectivity Passive Product

RES SMD 22.1KOHM 0.5% 1/32W 0201

• Resistance: 22.1 kOhms
• Tolerance: ±0.5%
• Power (Watts): 0.03W, 1/32W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0201 (0603 Metric)
• Supplier Device Package: 0201
• Size / Dimension: 0.023" L x 0.011" W (0.58mm x 0.29mm)
• Height - Seated (Max): 0.011" (0.28mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0201 (0603 Metric)

CRGV2010F8M66

TE Connectivity Passive Product

RES SMD 8.66M OHM 1% 1/2W 2010

• Resistance: 8.66 MOhms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: 2010 (5025 Metric)

CRGH2010F604R

TE Connectivity Passive Product

RES SMD 604 OHM 1% 1W 2010

• Resistance: 604 Ohms
• Tolerance: ±1%
• Power (Watts): 1W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: 2010 (5025 Metric)

CPF0603F6R49C1

TE Connectivity Passive Product

RES SMD 6.49 OHM 1% 1/16W 0603

• Resistance: 6.49 Ohms
• Tolerance: ±1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

CPF0603F5R9C1

TE Connectivity Passive Product

RES SMD 5.9 OHM 1% 1/16W 0603

• Resistance: 5.9 Ohms
• Tolerance: ±1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

CRG0201F1K47

TE Connectivity Passive Product

RES SMD 1.47K OHM 1% 1/20W 0201

• Resistance: 1.47 kOhms
• Tolerance: ±1%
• Power (Watts): 0.05W, 1/20W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0201 (0603 Metric)
• Supplier Device Package: 0201
• Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
• Height - Seated (Max): 0.010" (0.26mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0201 (0603 Metric)

CRGH0805J2K0

TE Connectivity Passive Product

RES SMD 2K OHM 5% 1/3W 0805

• Resistance: 2 kOhms
• Tolerance: ±5%
• Power (Watts): 0.333W, 1/3W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.083" L x 0.051" W (2.10mm x 1.30mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CRGH0603F32K4

TE Connectivity Passive Product

RES SMD 32.4K OHM 1% 1/5W 0603

• Resistance: 32.4 kOhms
• Tolerance: ±1%
• Power (Watts): 0.2W, 1/5W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

1-2176089-7

TE Connectivity Passive Product

RES SMD 16.2K OHM 0.1% 1/6W 0603

• Resistance: 16.2 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.167W, 1/6W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

CPF0603B300KE1

TE Connectivity Passive Product

RES SMD 300K OHM 0.1% 1/16W 0603

• Resistance: 300 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

RP73PF1J340RBTDF

TE Connectivity Passive Product

RES SMD 340 OHM 0.1% 1/6W 0603

• Resistance: 340 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.167W, 1/6W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

RP73PF1J12K1BTDF

TE Connectivity Passive Product

RES SMD 12.1K OHM 0.1% 1/6W 0603

• Resistance: 12.1 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.167W, 1/6W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

CPF0402B52K3E1

TE Connectivity Passive Product

RES SMD 52.3KOHM 0.1% 1/16W 0402

• Resistance: 52.3 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height - Seated (Max): 0.014" (0.35mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0402 (1005 Metric)

RLP73N3AR068JTE

TE Connectivity Passive Product

RES SMD 0.068 OHM 5% 2W 2512

• Resistance: 68 mOhms
• Tolerance: ±5%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±300ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.250" L x 0.124" W (6.35mm x 3.15mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 2512 (6432 Metric)

TE150B3R3J

TE Connectivity Passive Product

RES CHAS MNT 3.3 OHM 5% 150W

• Resistance: 3.3 Ohms
• Tolerance: ±5%
• Power (Watts): 150W
• Composition: Wirewound
• Temperature Coefficient: ±440ppm/°C
• Operating Temperature: -25°C ~ 225°C
• Features: Flame Proof, Safety
• Coating, Housing Type: Silicone Coated
• Mounting Feature: Brackets
• Size / Dimension: 1.575" Dia x 7.677" L (40.00mm x 195.00mm)
• Height - Seated (Max): -
• Lead Style: Solder Lugs
• Package / Case: Radial, Tubular
• Failure Rate: -

封装: Radial, Tubular