TE Connectivity Passive Product 产品

CCR222KKB

TE Connectivity Passive Product

RES 22.0K OHM 2W 10% AXIAL

• Resistance: 22 kOhms
• Tolerance: ±10%
• Power (Watts): 2W
• Composition: Ceramic
• Features: Pulse Withstanding
• Temperature Coefficient: ±1300ppm/°C
• Operating Temperature: -40°C ~ 200°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.276" Dia x 0.748" L (7.00mm x 19.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H456R2BDA

TE Connectivity Passive Product

RES 56.2 OHM 1/2W 0.1% AXIAL

• Resistance: 56.2 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H82K37BYA

TE Connectivity Passive Product

RES 2.37K OHM 1/4W 0.1% AXIAL

• Resistance: 2.37 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.098" Dia x 0.283" L (2.50mm x 7.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H85K62BDA

TE Connectivity Passive Product

RES 5.62K OHM 1/4W 0.1% AXIAL

• Resistance: 5.62 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.098" Dia x 0.283" L (2.50mm x 7.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H413K7FDA

TE Connectivity Passive Product

RES 13.7K OHM 1/2W 1% AXIAL

• Resistance: 13.7 kOhms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

RN73C1E78R7BTG

TE Connectivity Passive Product

RES SMD 78.7 OHM 0.1% 1/16W 0402

• Resistance: 78.7 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height - Seated (Max): 0.014" (0.35mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0402 (1005 Metric)

RN73C2A549RBTDG

TE Connectivity Passive Product

RES SMD 549 OHM 0.1% 1/10W 0805

• Resistance: 549 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

RN73A2A24K3BTDF

TE Connectivity Passive Product

RES SMD 24.3KOHM 0.1% 1/10W 0805

• Resistance: 24.3 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±5ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

RN73C1E4K75BTDF

TE Connectivity Passive Product

RES SMD 4.75KOHM 0.1% 1/16W 0402

• Resistance: 4.75 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height - Seated (Max): 0.014" (0.35mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0402 (1005 Metric)

RN73C1E324RBTDF

TE Connectivity Passive Product

RES SMD 324 OHM 0.1% 1/16W 0402

• Resistance: 324 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height - Seated (Max): 0.014" (0.35mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0402 (1005 Metric)

RN73C1J14R7BTDF

TE Connectivity Passive Product

RES SMD 14.7 OHM 0.1% 1/16W 0603

• Resistance: 14.7 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

RN73C2A634RBTDF

TE Connectivity Passive Product

RES SMD 634 OHM 0.1% 1/10W 0805

• Resistance: 634 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CPF0805B1K21E1

TE Connectivity Passive Product

RES SMD 1.21KOHM 0.1% 1/10W 0805

• Resistance: 1.21 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CPF0805B11R8E1

TE Connectivity Passive Product

RES SMD 11.8 OHM 0.1% 1/10W 0805

• Resistance: 11.8 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CPF0603B1K07E1

TE Connectivity Passive Product

RES SMD 1.07KOHM 0.1% 1/16W 0603

• Resistance: 1.07 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

CRGH1206J11R

TE Connectivity Passive Product

RES SMD 11 OHM 5% 1/2W 1206

• Resistance: 11 Ohms
• Tolerance: ±5%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: 1206 (3216 Metric)

CRGV0805J180K

TE Connectivity Passive Product

RES SMD 180K OHM 5% 1/8W 0805

• Resistance: 180 kOhms
• Tolerance: ±5%
• Power (Watts): 0.125W, 1/8W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.083" L x 0.051" W (2.10mm x 1.30mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CRGH0603F49K9

TE Connectivity Passive Product

RES SMD 49.9K OHM 1% 1/5W 0603

• Resistance: 49.9 kOhms
• Tolerance: ±1%
• Power (Watts): 0.2W, 1/5W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

CRG0805F680R

TE Connectivity Passive Product

RES SMD 680 OHM 1% 1/8W 0805

• Resistance: 680 Ohms
• Tolerance: ±1%
• Power (Watts): 0.125W, 1/8W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CRG0402J5R6

TE Connectivity Passive Product

RES SMD 5.6 OHM 5% 1/16W 0402

• Resistance: 5.6 Ohms
• Tolerance: ±5%
• Power (Watts): 0.063W, 1/16W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±400ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height - Seated (Max): 0.016" (0.40mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0402 (1005 Metric)

7-2176088-3

TE Connectivity Passive Product

RES SMD 5.11K OHM 0.1% 1/6W 0603

• Resistance: 5.11 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.167W, 1/6W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

RLP73N2BR051FTDF

TE Connectivity Passive Product

RES SMD 0.051 OHM 1% 1/2W 1206

• Resistance: 51 mOhms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±300ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 1206 (3216 Metric)

RN73C1E21KBTD

TE Connectivity Passive Product

RES SMD 21K OHM 0.1% 1/16W 0402

• Resistance: 21 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height - Seated (Max): 0.014" (0.35mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0402 (1005 Metric)

RLP73N2BR062JTD

TE Connectivity Passive Product

RES SMD 0.062 OHM 5% 1/2W 1206

• Resistance: 62 mOhms
• Tolerance: ±5%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±300ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 1206 (3216 Metric)

CPF0402B301RE1

TE Connectivity Passive Product

RES SMD 301 OHM 0.1% 1/16W 0402

• Resistance: 301 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height - Seated (Max): 0.014" (0.35mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0402 (1005 Metric)

BDS2A25022RK

TE Connectivity Passive Product

RES CHAS MNT 22 OHM 10% 250W

• Resistance: 22 Ohms
• Tolerance: ±10%
• Power (Watts): 250W
• Composition: Thick Film
• Temperature Coefficient: ±150ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Features: RF, High Frequency
• Coating, Housing Type: Epoxy Coated
• Mounting Feature: Flanges
• Size / Dimension: 2.638" L x 2.372" W (67.00mm x 60.25mm)
• Height - Seated (Max): 1.417" (36.00mm)
• Lead Style: M4 Threaded
• Package / Case: Box
• Failure Rate: -

封装: Box

TE500B2R7J

TE Connectivity Passive Product

RES CHAS MNT 2.7 OHM 5% 500W

• Resistance: 2.7 Ohms
• Tolerance: ±5%
• Power (Watts): 500W
• Composition: Wirewound
• Temperature Coefficient: ±440ppm/°C
• Operating Temperature: -25°C ~ 225°C
• Features: Flame Proof, Safety
• Coating, Housing Type: Silicone Coated
• Mounting Feature: Brackets
• Size / Dimension: 1.969" Dia x 12.441" L (50.00mm x 316.00mm)
• Height - Seated (Max): -
• Lead Style: Solder Lugs
• Package / Case: Radial, Tubular
• Failure Rate: -

封装: Radial, Tubular

NHSC10020RF

TE Connectivity Passive Product

RES CHAS MNT 20 OHM 1% 100W

• Resistance: 20 Ohms
• Tolerance: ±1%
• Power (Watts): 100W
• Composition: Wirewound
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Features: Non-Inductive
• Coating, Housing Type: Aluminum
• Mounting Feature: Flanges
• Size / Dimension: 2.579" L x 1.870" W (65.50mm x 47.50mm)
• Height - Seated (Max): 1.024" (26.00mm)
• Lead Style: Solder Lugs
• Package / Case: Axial, Box
• Failure Rate: -

封装: Axial, Box