TE Connectivity Passive Product 产品

H417R4BDA

TE Connectivity Passive Product

RES 17.4 OHM 1/2W 0.1% AXIAL

• Resistance: 17.4 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H4715KBCA

TE Connectivity Passive Product

RES 715K OHM 1/2W 0.1% AXIAL

• Resistance: 715 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H448K7BZA

TE Connectivity Passive Product

RES 48.7K OHM 1/2W 0.1% AXIAL

• Resistance: 48.7 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H8255RBDA

TE Connectivity Passive Product

RES 255 OHM 1/4W 0.1% AXIAL

• Resistance: 255 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.098" Dia x 0.283" L (2.50mm x 7.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H832K4BZA

TE Connectivity Passive Product

RES 32.4K OHM 1/4W 0.1% AXIAL

• Resistance: 32.4 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.098" Dia x 0.283" L (2.50mm x 7.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H820K5BZA

TE Connectivity Passive Product

RES 20.5K OHM 1/4W 0.1% AXIAL

• Resistance: 20.5 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.098" Dia x 0.283" L (2.50mm x 7.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H882KFYA

TE Connectivity Passive Product

RES 82.0K OHM 1/4W 1% AXIAL

• Resistance: 82 kOhms
• Tolerance: ±1%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.098" Dia x 0.283" L (2.50mm x 7.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H4P510RFZA

TE Connectivity Passive Product

RES 510 OHM 1W 1% AXIAL

• Resistance: 510 Ohms
• Tolerance: ±1%
• Power (Watts): 1W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

RR03J910RTB

TE Connectivity Passive Product

RES 910 OHM 3W 5% AXIAL

• Resistance: 910 Ohms
• Tolerance: ±5%
• Power (Watts): 3W
• Composition: Metal Film
• Features: Flame Retardant Coating, Pulse Withstanding, Safety
• Temperature Coefficient: ±300ppm/°C
• Operating Temperature: -55°C ~ 235°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.197" Dia x 0.591" L (5.00mm x 15.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

HB1100MFZRE

TE Connectivity Passive Product

RES 100M OHM 2W 1% RADIAL

• Resistance: 100 MOhms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: High Voltage, Pulse Withstanding
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: Radial
• Supplier Device Package: Radial Lead
• Size / Dimension: 1.043" L x 0.118" W (26.50mm x 3.00mm)
• Height - Seated (Max): 0.409" (10.40mm)
• Number of Terminations: 2
• Failure Rate: -

封装: Radial

RN73C1E453RBTDF

TE Connectivity Passive Product

RES SMD 453 OHM 0.1% 1/16W 0402

• Resistance: 453 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height - Seated (Max): 0.014" (0.35mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0402 (1005 Metric)

RP73D2A86K6BTDF

TE Connectivity Passive Product

RES SMD 86.6K OHM 0.1% 1/8W 0805

• Resistance: 86.6 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.125W, 1/8W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CPF1206B1K43E1

TE Connectivity Passive Product

RES SMD 1.43K OHM 0.1% 1/8W 1206

• Resistance: 1.43 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.125W, 1/8W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 1206 (3216 Metric)

CPF0805B562KE1

TE Connectivity Passive Product

RES SMD 562K OHM 0.1% 1/10W 0805

• Resistance: 562 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

2-2176074-2

TE Connectivity Passive Product

RES SMD 9.53KOHM 0.5% 1/32W 0201

• Resistance: 9.53 kOhms
• Tolerance: ±0.5%
• Power (Watts): 0.03W, 1/32W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0201 (0603 Metric)
• Supplier Device Package: 0201
• Size / Dimension: 0.023" L x 0.011" W (0.58mm x 0.29mm)
• Height - Seated (Max): 0.011" (0.28mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0201 (0603 Metric)

CRGH2010F301R

TE Connectivity Passive Product

RES SMD 301 OHM 1% 1W 2010

• Resistance: 301 Ohms
• Tolerance: ±1%
• Power (Watts): 1W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: 2010 (5025 Metric)

CRGH2010J3M0

TE Connectivity Passive Product

RES SMD 3M OHM 5% 1W 2010

• Resistance: 3 MOhms
• Tolerance: ±5%
• Power (Watts): 1W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: 2010 (5025 Metric)

TCR0805N560K

TE Connectivity Passive Product

RES SMD 560K OHM 1/10W 0805

• Resistance: 560 kOhms
• Tolerance: 0%, -10%
• Power (Watts): 0.1W, 1/10W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CRGH1206J220K

TE Connectivity Passive Product

RES SMD 220K OHM 5% 1/2W 1206

• Resistance: 220 kOhms
• Tolerance: ±5%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: 1206 (3216 Metric)

CRGH0805F8K06

TE Connectivity Passive Product

RES SMD 8.06K OHM 1% 1/3W 0805

• Resistance: 8.06 kOhms
• Tolerance: ±1%
• Power (Watts): 0.333W, 1/3W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.083" L x 0.051" W (2.10mm x 1.30mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CRG1206F470K

TE Connectivity Passive Product

RES SMD 470K OHM 1% 1/4W 1206

• Resistance: 470 kOhms
• Tolerance: ±1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 1206 (3216 Metric)

CPF0402B36R5E1

TE Connectivity Passive Product

RES SMD 36.5 OHM 0.1% 1/16W 0402

• Resistance: 36.5 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height - Seated (Max): 0.014" (0.35mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0402 (1005 Metric)

2-2176089-4

TE Connectivity Passive Product

RES SMD 19.1K OHM 0.1% 1/6W 0603

• Resistance: 19.1 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.167W, 1/6W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

RN73C2A7K32BTDF

TE Connectivity Passive Product

RES SMD 7.32KOHM 0.1% 1/10W 0805

• Resistance: 7.32 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CPF0805B6R8E1

TE Connectivity Passive Product

RES SMD 6.8 OHM 0.1% 1/10W 0805

• Resistance: 6.8 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CPF0603F2K67C1

TE Connectivity Passive Product

RES SMD 2.67K OHM 1% 1/16W 0603

• Resistance: 2.67 kOhms
• Tolerance: ±1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

CJT800330RJJ

TE Connectivity Passive Product

RES CHAS MNT 330 OHM 5% 800W

• Resistance: 330 Ohms
• Tolerance: ±5%
• Power (Watts): 800W
• Composition: Wirewound
• Temperature Coefficient: ±440ppm/°C
• Operating Temperature: -
• Features: -
• Coating, Housing Type: Aluminum
• Mounting Feature: Flanges
• Size / Dimension: 15.748" L x 2.402" W (400.00mm x 61.00mm)
• Height - Seated (Max): 2.323" (59.00mm)
• Lead Style: Wire Leads
• Package / Case: Rectangular Case
• Failure Rate: -

封装: Rectangular Case

HSC10016R6J

TE Connectivity Passive Product

RES CHAS MNT 16.6 OHM 5% 100W

• Resistance: 16.6 Ohms
• Tolerance: ±5%
• Power (Watts): 100W
• Composition: Wirewound
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Features: -
• Coating, Housing Type: Aluminum
• Mounting Feature: Flanges
• Size / Dimension: 2.579" L x 1.870" W (65.50mm x 47.50mm)
• Height - Seated (Max): 1.024" (26.00mm)
• Lead Style: Solder Lugs
• Package / Case: Axial, Box
• Failure Rate: -

封装: Axial, Box