TE Connectivity Passive Product 产品

C144R7JL

TE Connectivity Passive Product

RES 4.7 OHM 14W 5% AXIAL

• Resistance: 4.7 Ohms
• Tolerance: ±5%
• Power (Watts): 14W
• Composition: Wirewound
• Features: -
• Temperature Coefficient: ±90ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.335" Dia x 2.098" L (8.50mm x 53.30mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H41K78BYA

TE Connectivity Passive Product

RES 1.78K OHM 1/2W 0.1% AXIAL

• Resistance: 1.78 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H4649KBDA

TE Connectivity Passive Product

RES 649K OHM 1/2W 0.1% AXIAL

• Resistance: 649 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H457R6BZA

TE Connectivity Passive Product

RES 57.6 OHM 1/2W 0.1% AXIAL

• Resistance: 57.6 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

H422RFZA

TE Connectivity Passive Product

RES 22 OHM 1/2W 1% AXIAL

• Resistance: 22 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

RR01J750RTB

TE Connectivity Passive Product

RES 750 OHM 1W 5% AXIAL

• Resistance: 750 Ohms
• Tolerance: ±5%
• Power (Watts): 1W
• Composition: Metal Film
• Features: Flame Retardant Coating, Pulse Withstanding, Safety
• Temperature Coefficient: ±300ppm/°C
• Operating Temperature: -55°C ~ 235°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.102" Dia x 0.268" L (2.60mm x 6.80mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: Axial

RP73D2B3K48BTDF

TE Connectivity Passive Product

RES SMD 3.48K OHM 0.1% 1/4W 1206

• Resistance: 3.48 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 1206 (3216 Metric)

SMF5910RJT

TE Connectivity Passive Product

RES SMD 910 OHM 5% 5W 5329

• Resistance: 910 Ohms
• Tolerance: ±5%
• Power (Watts): 5W
• Composition: Metal Film
• Features: Flame Retardant Coating, Safety
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -80°C ~ 280°C
• Package / Case: 5329 (13573 Metric), J-Lead
• Supplier Device Package: SMD
• Size / Dimension: 0.531" L x 0.287" W (13.50mm x 7.30mm)
• Height - Seated (Max): 0.280" (7.10mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 5329 (13573 Metric), J-Lead

RN73C2A232KBTD

TE Connectivity Passive Product

RES SMD 232K OHM 0.1% 1/10W 0805

• Resistance: 232 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CPF-A-0603B330KE1

TE Connectivity Passive Product

RES SMD 330K OHM 0.1% 1/16W 0603

• Resistance: 330 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

CPF0603B60R4E1

TE Connectivity Passive Product

RES SMD 60.4 OHM 0.1% 1/16W 0603

• Resistance: 60.4 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

CRGV2010F6M65

TE Connectivity Passive Product

RES SMD 6.65M OHM 1% 1/2W 2010

• Resistance: 6.65 MOhms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: 2010 (5025 Metric)

CRGH2010F3K48

TE Connectivity Passive Product

RES SMD 3.48K OHM 1% 1W 2010

• Resistance: 3.48 kOhms
• Tolerance: ±1%
• Power (Watts): 1W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: 2010 (5025 Metric)

RL73H2AR30FTD

TE Connectivity Passive Product

RES SMD 0.3 OHM 1% 1/8W 0805

• Resistance: 300 mOhms
• Tolerance: ±1%
• Power (Watts): 0.125W, 1/8W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CPF0603F75KC1

TE Connectivity Passive Product

RES SMD 75K OHM 1% 1/16W 0603

• Resistance: 75 kOhms
• Tolerance: ±1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

CRG0201F562K

TE Connectivity Passive Product

RES SMD 562K OHM 1% 1/20W 0201

• Resistance: 562 kOhms
• Tolerance: ±1%
• Power (Watts): 0.05W, 1/20W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0201 (0603 Metric)
• Supplier Device Package: 0201
• Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
• Height - Seated (Max): 0.010" (0.26mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0201 (0603 Metric)

CRGV1206F133K

TE Connectivity Passive Product

RES SMD 133K OHM 1% 1/4W 1206

• Resistance: 133 kOhms
• Tolerance: ±1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: 1206 (3216 Metric)

CRGV0805F143K

TE Connectivity Passive Product

RES SMD 143K OHM 1% 1/8W 0805

• Resistance: 143 kOhms
• Tolerance: ±1%
• Power (Watts): 0.125W, 1/8W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.083" L x 0.051" W (2.10mm x 1.30mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

CRG1206F33K

TE Connectivity Passive Product

RES SMD 33K OHM 1% 1/4W 1206

• Resistance: 33 kOhms
• Tolerance: ±1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 1206 (3216 Metric)

CRG0603F30K

TE Connectivity Passive Product

RES SMD 30K OHM 1% 1/10W 0603

• Resistance: 30 kOhms
• Tolerance: ±1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

RN73C2A93K1BTDF

TE Connectivity Passive Product

RES SMD 93.1KOHM 0.1% 1/10W 0805

• Resistance: 93.1 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

TL3AR082FTDG

TE Connectivity Passive Product

RES SMD 0.082 OHM 1% 1W 2512

• Resistance: 82 mOhms
• Tolerance: ±1%
• Power (Watts): 1W
• Composition: Metal Foil
• Features: Current Sense
• Temperature Coefficient: ±75ppm/°C
• Operating Temperature: -65°C ~ 170°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.252" L x 0.126" W (6.40mm x 3.20mm)
• Height - Seated (Max): 0.024" (0.60mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 2512 (6432 Metric)

RLP73N3AR082JTE

TE Connectivity Passive Product

RES SMD 0.082 OHM 5% 2W 2512

• Resistance: 82 mOhms
• Tolerance: ±5%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±300ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.250" L x 0.124" W (6.35mm x 3.15mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 2512 (6432 Metric)

2176090-4

TE Connectivity Passive Product

RES SMD 140K OHM 0.1% 1/6W 0603

• Resistance: 140 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.167W, 1/6W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

RLP73K3AR18FTDF

TE Connectivity Passive Product

RES SMD 0.18 OHM 1% 2W 2512

• Resistance: 180 mOhms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.250" L x 0.124" W (6.35mm x 3.15mm)
• Height - Seated (Max): 0.033" (0.84mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 2512 (6432 Metric)

TJT2503R3J

TE Connectivity Passive Product

RES CHAS MNT 3.3 OHM 5% 250W

• Resistance: 3.3 Ohms
• Tolerance: ±5%
• Power (Watts): 250W
• Composition: Wirewound
• Temperature Coefficient: ±260ppm/°C
• Operating Temperature: -25°C ~ 250°C
• Features: -
• Coating, Housing Type: Aluminum
• Mounting Feature: Screw Holes
• Size / Dimension: 7.087" L x 3.150" W (180.00mm x 80.00mm)
• Height - Seated (Max): 0.394" (10.00mm)
• Lead Style: Wire Leads
• Package / Case: Rectangular Case
• Failure Rate: -

封装: Rectangular Case

3635B1R8PT

TE Connectivity Passive Product

FIXED IND 1.8UH 20A 3.4 MOHM SMD

• Type: Wirewound
• Material - Core: Iron
• Inductance: 1.8µH
• Tolerance: ±25%
• Current Rating: 20A
• Current - Saturation: 16A
• Shielding: Shielded
• DC Resistance (DCR): 3.4 mOhm Max
• Q @ Freq: -
• Frequency - Self Resonant: -
• Ratings: -
• Operating Temperature: -40°C ~ 105°C
• Frequency - Test: -
• Features: -
• Mounting Type: Surface Mount
• Package / Case: Nonstandard
• Supplier Device Package: -
• Size / Dimension: 0.492" L x 0.492" W (12.50mm x 12.50mm)
• Height - Seated (Max): 0.236" (6.00mm)

封装: Nonstandard

36501J4N3JTDG

TE Connectivity Passive Product

FIXED IND 4.3NH 700MA 63 MOHM

• Type: Wirewound
• Material - Core: -
• Inductance: 4.3nH
• Tolerance: ±5%
• Current Rating: 700mA
• Current - Saturation: -
• Shielding: Unshielded
• DC Resistance (DCR): 63 mOhm Max
• Q @ Freq: 22 @ 250MHz
• Frequency - Self Resonant: 5.8GHz
• Ratings: -
• Operating Temperature: -40°C ~ 125°C
• Frequency - Test: 250MHz
• Features: -
• Mounting Type: Surface Mount
• Package / Case: Nonstandard
• Supplier Device Package: -
• Size / Dimension: 0.071" L x 0.044" W (1.80mm x 1.12mm)
• Height - Seated (Max): 0.040" (1.02mm)

封装: Nonstandard