Trenz Electronic GmbH 产品

TE0600-02BM

Trenz Electronic GmbH

SOM GIGABEE XC6SLX100 2X512MB 2I

• Module/Board Type: FPGA
• Core Processor: Spartan-6 LX-100
• Co-Processor: -
• Speed: 125MHz
• Flash Size: 16MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

TE0600-03BM

Trenz Electronic GmbH

FPGA MICROMOD SPARTAN-6 LX

• Module/Board Type: FPGA
• Core Processor: Spartan-6 LX-100
• Co-Processor: -
• Speed: 125MHz
• Flash Size: 16MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

TE0722-02

Trenz Electronic GmbH

SOM ZYNQ SOFT PROPELLER 40DIP

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7010)
• Speed: 33MHz
• Flash Size: 16MB
• RAM Size: -
• Connector Type: 40 Pin
• Size / Dimension: 0.71" x 2.01" (18mm x 51mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

TE0741-03-410-2CF

Trenz Electronic GmbH

SOM KINTEX-7 410T 32MB FLASH AES

• Module/Board Type: FPGA
• Core Processor: Kintex-7 410T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

TE0715-04-15-1I

Trenz Electronic GmbH

SOM ZYNQ XC7Z015-1I 1GB DDR3

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7015)
• Speed: 125MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

TE0715-04-12S-1C

Trenz Electronic GmbH

SOM ZYNQ Z-7012S 1GB DDR3L SDRAM

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7012S)
• Speed: 766MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

TE0725-03-35-2C

Trenz Electronic GmbH

SOM FPGA ARTIX-7 35T FLASH 2C

• Module/Board Type: FPGA
• Core Processor: Artix-7 A35T
• Co-Processor: -
• Speed: 100MHz
• Flash Size: 32MB
• RAM Size: -
• Connector Type: 50 Pin
• Size / Dimension: 2.87" x 1.38" (73mm x 35mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

TE0722-02I

Trenz Electronic GmbH

SOM ZYNQ SOFT PROPELLER 40DIP

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7010)
• Speed: 33MHz
• Flash Size: 16MB
• RAM Size: -
• Connector Type: 40 Pin
• Size / Dimension: 0.71" x 2.01" (18mm x 51mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

TE0818-01-6BE21-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket - 240
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: 0°C ~ 85°C

封装: -

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TE0820-05-3AE21MA

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

• Module/Board Type: MPU Core
• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
• Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: Pin(s)
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 85°C

封装: -

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TE0820-04-4DE21FA

Trenz Electronic GmbH

MOD MPSOC ZU4EV-1E 2GB DDR4 IND

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 85°C

封装: -

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TE0600-03-52I11-A

Trenz Electronic GmbH

IC MODULE GIGABEE

• Module/Board Type: FPGA Core
• Core Processor: Spartan-6 LX-45
• Co-Processor: -
• Speed: 125MHz
• Flash Size: 16MB
• RAM Size: 256MB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

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TE0745-02-92I11-AK

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7045)
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket - 480
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

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TE0865-02-FBE23MA

Trenz Electronic GmbH

MPSOC MODULE WITH ZYNQ ULTRASCAL

• Module/Board Type: MPU Core
• Core Processor: Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E
• Co-Processor: -
• Speed: -
• Flash Size: 256MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
• Operating Temperature: 0°C ~ 85°C

封装: -

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TE0714-04-42I-7-B

Trenz Electronic GmbH

IC MODULE ARTIX-7

• Module/Board Type: FPGA
• Core Processor: Artix-7 A35T
• Co-Processor: Artix-7
• Speed: -
• Flash Size: 16MB
• RAM Size: -
• Connector Type: -
• Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

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TE0741-04-D2C-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

• Module/Board Type: FPGA Core
• Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C
• Co-Processor: -
• Speed: -
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

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TE0722-04-11C-4-A

Trenz Electronic GmbH

DIPFORTY1 "SOFT PROPELLER" MIT A

• Module/Board Type: FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Xilinx Zynq 7: XC7Z007S-1CLG225C
• Speed: -
• Flash Size: 16MB
• RAM Size: -
• Connector Type: 2 x 20 Pin
• Size / Dimension: 2.008" L x 0.709" W (51.00mm x 18.00mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

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TE0720-03-61Q33FA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7020)
• Speed: 125MHz
• Flash Size: 4GB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

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TE0720-04-61Q33MA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

• Module/Board Type: Ethernet Core
• Core Processor: ARM® Cortex®-A9
• Co-Processor: -
• Speed: -
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

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TE0600-03IC2

Trenz Electronic GmbH

IC MODULE GIGABEE

• Module/Board Type: FPGA Core
• Core Processor: Spartan-6 LX-45
• Co-Processor: -
• Speed: 125MHz
• Flash Size: 16MB
• RAM Size: 256MB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

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TE0726-03-11C64-A

Trenz Electronic GmbH

IC MODULE ZYNQBERRY

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7007S)
• Speed: -
• Flash Size: 16MB
• RAM Size: 512MB
• Connector Type: CSI, DSI
• Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

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TE0808-05-6BE81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

封装: -

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TE0745-02-93E11-KA

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7045)
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket - 480
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

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TE0712-02-81I36-AC

Trenz Electronic GmbH

FPGA MODULE ARTIX7

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 A200T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

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TE0745-02-81C31-AK

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

• Module/Board Type: MCU, FPGA
• Core Processor: ARM Cortex-A9
• Co-Processor: Zynq-7000 (Z-7035)
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket - 480
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: -40°C ~ 85°C

封装: -

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TE0865-02-ABI21MA

Trenz Electronic GmbH

MPSOC MODULE WITH ZYNQ ULTRASCAL

• Module/Board Type: MPU Core
• Core Processor: Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I
• Co-Processor: -
• Speed: -
• Flash Size: 256MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
• Operating Temperature: 0°C ~ 85°C

封装: -

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TE0741-04-B2C-1-AF

Trenz Electronic GmbH

MODULE FPGA KINTEX

• Module/Board Type: FPGA Core
• Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FFG676C
• Co-Processor: -
• Speed: -
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

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TE0803-04-3BE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: B2B
• Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
• Operating Temperature: 0°C ~ 85°C

封装: -

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