页 118 - Xilinx Inc. 产品

零件编号	制造商	描述	封装	库存
XC17S200AVO8C	Xilinx Inc.	IC PROM SER 200K 8-SOIC Programmable Type: OTP Memory Size: 2Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-TSOP	封装: 8-SOIC (0.154", 3.90mm Width)	库存5,744
XCZU17EG-2FFVD1760I	Xilinx Inc.	IC FPGA 308 I/O 1760FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封装: 1760-BBGA, FCBGA	库存5,904
XCZU15EG-L1FFVC900I	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封装: 900-BBGA, FCBGA	库存6,656
XC7K410T-2FF900C	Xilinx Inc.	IC FPGA 500 I/O 900FCBGA Number of LABs/CLBs: 31775 Number of Logic Elements/Cells: 406720 Total RAM Bits: 29306880 Number of I/O: 500 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封装: 900-BBGA, FCBGA	库存7,136
XC2V4000-5FF1152I	Xilinx Inc.	IC FPGA 824 I/O 1152FCBGA Number of LABs/CLBs: 5760 Number of Logic Elements/Cells: - Total RAM Bits: 2211840 Number of I/O: 824 Number of Gates: 4000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-CFCBGA (35x35)	封装: 1152-BBGA, FCBGA	库存3,376
XC2V500-4FGG256I	Xilinx Inc.	IC FPGA 172 I/O 256FBGA Number of LABs/CLBs: 768 Number of Logic Elements/Cells: - Total RAM Bits: 589824 Number of I/O: 172 Number of Gates: 500000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封装: 256-BGA	库存4,656
XC3S1500L-4FGG676C	Xilinx Inc.	IC FPGA 487 I/O 676FBGA Number of LABs/CLBs: 2816 Number of Logic Elements/Cells: 29952 Total RAM Bits: 589824 Number of I/O: 487 Number of Gates: 1500000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封装: 676-BGA	库存5,648
XCS40XL-4PQG208C	Xilinx Inc.	IC FPGA 169 I/O 208QFP Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 169 Number of Gates: 40000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封装: 208-BFQFP	库存13,956
XCV600E-7BG432I	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 316 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	封装: 432-LBGA, Metal	库存10,776
XCV400-5BG432C	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 2400 Number of Logic Elements/Cells: 10800 Total RAM Bits: 81920 Number of I/O: 316 Number of Gates: 468252 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	封装: 432-LBGA, Metal	库存9,792
XCV300-6FG456C	Xilinx Inc.	IC FPGA 312 I/O 456FBGA Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 6912 Total RAM Bits: 65536 Number of I/O: 312 Number of Gates: 322970 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封装: 456-BBGA	库存4,752
XCV200E-8PQ240C	Xilinx Inc.	IC FPGA 158 I/O 240QFP Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 158 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封装: 240-BFQFP	库存2,416
XCV200E-7FG256I	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 176 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封装: 256-BGA	库存9,612
XCV1000E-7BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 6144 Number of Logic Elements/Cells: 27648 Total RAM Bits: 393216 Number of I/O: 404 Number of Gates: 1569178 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	封装: 560-LBGA, Metal	库存4,800
XC4036XL-09HQ240C	Xilinx Inc.	IC FPGA 193 I/O 240HQFP Number of LABs/CLBs: 1296 Number of Logic Elements/Cells: 3078 Total RAM Bits: 41472 Number of I/O: 193 Number of Gates: 36000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	封装: 240-BFQFP Exposed Pad	库存5,760
XC7K480T-L2FFG1156E	Xilinx Inc.	IC FPGA 400 I/O 1156FCBGA Number of LABs/CLBs: 37325 Number of Logic Elements/Cells: 477760 Total RAM Bits: 35205120 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封装: 1156-BBGA, FCBGA	库存2,544
XCKU025-1FFVA1156I	Xilinx Inc.	IC FPGA 312 I/O 1156FCBGA Number of LABs/CLBs: 18180 Number of Logic Elements/Cells: 318150 Total RAM Bits: 13004800 Number of I/O: 312 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封装: 1156-BBGA, FCBGA	库存4,768
XC2VP20-6FF896I	Xilinx Inc.	IC FPGA 556 I/O 896FCBGA Number of LABs/CLBs: 2320 Number of Logic Elements/Cells: 20880 Total RAM Bits: 1622016 Number of I/O: 556 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FCBGA (31x31)	封装: 896-BBGA, FCBGA	库存4,192
XC5VLX30T-1FFG665C	Xilinx Inc.	IC FPGA 360 I/O 665FCBGA Number of LABs/CLBs: 2400 Number of Logic Elements/Cells: 30720 Total RAM Bits: 1327104 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 665-BBGA, FCBGA Supplier Device Package: 665-FCBGA (27x27)	封装: 665-BBGA, FCBGA	库存3,600
XC4VFX12-11SF363I	Xilinx Inc.	IC FPGA 240 I/O 363FCBGA Number of LABs/CLBs: 1368 Number of Logic Elements/Cells: 12312 Total RAM Bits: 663552 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 363-FBGA, FCBGA Supplier Device Package: 363-FCBGA (17x17)	封装: 363-FBGA, FCBGA	库存2,544
XC7A75T-1CSG324I	Xilinx Inc.	IC FPGA ARTIX7 210 I/O 324CSBGA Number of LABs/CLBs: 5900 Number of Logic Elements/Cells: 75520 Total RAM Bits: 3870720 Number of I/O: 210 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	封装: 324-LFBGA, CSPBGA	库存2,944
XC7A75T-2FTG256C	Xilinx Inc.	IC FPGA ARTIX7 170 I/O 256FTBGA Number of LABs/CLBs: 5900 Number of Logic Elements/Cells: 75520 Total RAM Bits: 3870720 Number of I/O: 170 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封装: 256-LBGA	库存6,800
XC3S100E-5TQ144C	Xilinx Inc.	IC FPGA 108 I/O 144TQFP Number of LABs/CLBs: 240 Number of Logic Elements/Cells: 2160 Total RAM Bits: 73728 Number of I/O: 108 Number of Gates: 100000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封装: 144-LQFP	库存6,304
XC2S100-5TQG144C	Xilinx Inc.	IC FPGA 92 I/O 144TQFP Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 40960 Number of I/O: 92 Number of Gates: 100000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封装: 144-LQFP	库存37,848
XC6SLX100-3CSG484C	Xilinx Inc.	IC FPGA 338 I/O 484CSBGA Number of LABs/CLBs: 7911 Number of Logic Elements/Cells: 101261 Total RAM Bits: 4939776 Number of I/O: 338 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19)	封装: 484-FBGA, CSPBGA	库存5,088
XC9572XL-5PCG44C	Xilinx Inc.	IC CPLD 72MC 5NS 44PLCC Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 5.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 34 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	封装: 44-LCC (J-Lead)	库存7,040
XCR3256XL-7FT256C	Xilinx Inc.	IC CPLD 256MC 7NS 256CSP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 7.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 6000 Number of I/O: 164 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封装: 256-LBGA	库存5,488
XC95288XL-7PQG208I	Xilinx Inc.	IC CPLD 288MC 7.5NS 208QFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 288 Number of Gates: 6400 Number of I/O: 168 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封装: 208-BFQFP	库存6,320

XC17S200AVO8C

Xilinx Inc.

IC PROM SER 200K 8-SOIC

Programmable Type: OTP
Memory Size: 2Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-TSOP

封装: 8-SOIC (0.154", 3.90mm Width)

库存5,744

XCZU17EG-2FFVD1760I

Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封装: 1760-BBGA, FCBGA

库存5,904

XCZU15EG-L1FFVC900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封装: 900-BBGA, FCBGA

库存6,656