页 197 - Xilinx Inc. 产品

零件编号	制造商	描述	封装	库存
XC17S30XLPD8C	Xilinx Inc.	IC PROM PROG C-TEMP 3.3V 8-DIP Programmable Type: OTP Memory Size: 300kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封装: 8-DIP (0.300", 7.62mm)	库存24,072
XC17512LPD8C	Xilinx Inc.	IC PROM SER C-TEMP 512K 8-DIP Programmable Type: OTP Memory Size: 512kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封装: 8-DIP (0.300", 7.62mm)	库存11,304
XCZU15EG-2FFVC900I	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封装: 900-BBGA, FCBGA	库存4,576
XC7Z045-2FBG676E	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封装: 676-BBGA, FCBGA	库存5,328
XCZU4CG-2SFVC784E	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封装: 784-BBGA, FCBGA	库存7,040
XCZU3CG-2SFVA625I	Xilinx Inc.	XCZU3CG-2SFVA625I Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21)	封装: 625-BFBGA, FCBGA	库存5,520
XC7K325T-3FFG900E	Xilinx Inc.	IC FPGA 500 I/O 900FCBGA Number of LABs/CLBs: 25475 Number of Logic Elements/Cells: 326080 Total RAM Bits: 16404480 Number of I/O: 500 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封装: 900-BBGA, FCBGA	库存5,904
XA3S250E-4PQG208Q	Xilinx Inc.	IC FPGA 158 I/O 208QFP Number of LABs/CLBs: 612 Number of Logic Elements/Cells: 5508 Total RAM Bits: 221184 Number of I/O: 158 Number of Gates: 250000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封装: 208-BFQFP	库存5,824
XC5VLX110T-1FFG1136CES	Xilinx Inc.	IC FPGA 640 I/O 1136FCBGA Number of LABs/CLBs: 8640 Number of Logic Elements/Cells: 110592 Total RAM Bits: 5455872 Number of I/O: 640 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	封装: 1136-BBGA, FCBGA	库存4,176
XCV150-4FG456I	Xilinx Inc.	IC FPGA 260 I/O 456FBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 260 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封装: 456-BBGA	库存4,752
XC4010XL-1PC84I	Xilinx Inc.	IC FPGA 61 I/O 84PLCC Number of LABs/CLBs: 400 Number of Logic Elements/Cells: 950 Total RAM Bits: 12800 Number of I/O: 61 Number of Gates: 10000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	封装: 84-LCC (J-Lead)	库存6,944
XC4005XL-2PQ208C	Xilinx Inc.	IC FPGA 112 I/O 208QFP Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 112 Number of Gates: 5000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封装: 208-BFQFP	库存7,248
XC4005E-2PG156I	Xilinx Inc.	IC FPGA 112 I/O 156CPGA Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 112 Number of Gates: 5000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Through Hole Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 156-BCPGA Supplier Device Package: 156-CPGA (42.17x42.17)	封装: 156-BCPGA	库存2,256
XC4005E-2PC84I	Xilinx Inc.	IC FPGA 61 I/O 84PLCC Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 61 Number of Gates: 5000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	封装: 84-LCC (J-Lead)	库存3,408
XC4013E-2PQ208C	Xilinx Inc.	IC FPGA 160 I/O 208QFP Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 160 Number of Gates: 13000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封装: 208-BFQFP	库存5,280
XC3164A-3PC84C	Xilinx Inc.	IC FPGA 70 I/O 84PLCC Number of LABs/CLBs: 224 Number of Logic Elements/Cells: - Total RAM Bits: 46064 Number of I/O: 70 Number of Gates: 4500 Voltage - Supply: 4.25 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	封装: 84-LCC (J-Lead)	库存5,280
XCVU7P-1FLVB2104E	Xilinx Inc.	XCVU7P-1FLVB2104E Number of LABs/CLBs: 98520 Number of Logic Elements/Cells: 1724100 Total RAM Bits: 236134400 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: - Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存6,608
XC2VP100-5FF1704C	Xilinx Inc.	IC FPGA 1040 I/O 1704FCBGA Number of LABs/CLBs: 11024 Number of Logic Elements/Cells: 99216 Total RAM Bits: 8183808 Number of I/O: 1040 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1704-BBGA, FCBGA Supplier Device Package: 1704-CFCBGA (42.5x42.5)	封装: 1704-BBGA, FCBGA	库存6,272
XC5VLX110-3FFG1760C	Xilinx Inc.	IC FPGA 800 I/O 1760FBGA Number of LABs/CLBs: 8640 Number of Logic Elements/Cells: 110592 Total RAM Bits: 4718592 Number of I/O: 800 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封装: 1760-BBGA, FCBGA	库存6,624
XC5VLX110-1FFG676I	Xilinx Inc.	IC FPGA 440 I/O 676FCBGA Number of LABs/CLBs: 8640 Number of Logic Elements/Cells: 110592 Total RAM Bits: 4718592 Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封装: 676-BBGA, FCBGA	库存9,480
XC2VP40-6FG676I	Xilinx Inc.	IC FPGA 416 I/O 676FBGA Number of LABs/CLBs: 4848 Number of Logic Elements/Cells: 43632 Total RAM Bits: 3538944 Number of I/O: 416 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封装: 676-BBGA, FCBGA	库存4,000
XC6SLX150T-2FGG484I	Xilinx Inc.	IC FPGA 296 I/O 484FBGA Number of LABs/CLBs: 11519 Number of Logic Elements/Cells: 147443 Total RAM Bits: 4939776 Number of I/O: 296 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BBGA	库存4,192
XC3S1000-4FT256C	Xilinx Inc.	IC FPGA 173 I/O 256FTBGA Number of LABs/CLBs: 1920 Number of Logic Elements/Cells: 17280 Total RAM Bits: 442368 Number of I/O: 173 Number of Gates: 1000000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封装: 256-LBGA	库存7,872
XC3S700A-4FGG400C	Xilinx Inc.	IC FPGA 311 I/O 400FBGA Number of LABs/CLBs: 1472 Number of Logic Elements/Cells: 13248 Total RAM Bits: 368640 Number of I/O: 311 Number of Gates: 700000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-BGA Supplier Device Package: 400-FBGA (21x21)	封装: 400-BGA	库存4,144
XC3S100E-5CP132C	Xilinx Inc.	IC FPGA 83 I/O 132CSBGA Number of LABs/CLBs: 240 Number of Logic Elements/Cells: 2160 Total RAM Bits: 73728 Number of I/O: 83 Number of Gates: 100000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 132-TFBGA, CSPBGA Supplier Device Package: 132-CSPBGA (8x8)	封装: 132-TFBGA, CSPBGA	库存7,104
XC3S500E-5PQG208C	Xilinx Inc.	IC FPGA 158 I/O 208QFP Number of LABs/CLBs: 1164 Number of Logic Elements/Cells: 10476 Total RAM Bits: 368640 Number of I/O: 158 Number of Gates: 500000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封装: 208-BFQFP	库存8,364
XC9572XL-7TQG100C	Xilinx Inc.	IC CPLD 72MC 7.5NS 100TQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 72 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-TQFP (14x14)	封装: 100-LQFP	库存13,380
XCVU190-3FLGC2104E	Xilinx Inc.	IC FPGA VIRTEX-U 2104FCBGA Number of LABs/CLBs: 134280 Number of Logic Elements/Cells: 2349900 Total RAM Bits: 150937600 Number of I/O: 416 Number of Gates: - Voltage - Supply: 0.970 V ~ 1.030 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封装: 2104-BBGA, FCBGA	库存4,992

XC17S30XLPD8C

Xilinx Inc.

IC PROM PROG C-TEMP 3.3V 8-DIP

Programmable Type: OTP
Memory Size: 300kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封装: 8-DIP (0.300", 7.62mm)

库存24,072

XC17512LPD8C

Xilinx Inc.

IC PROM SER C-TEMP 512K 8-DIP

Programmable Type: OTP
Memory Size: 512kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封装: 8-DIP (0.300", 7.62mm)

库存11,304

XCZU15EG-2FFVC900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封装: 900-BBGA, FCBGA

库存4,576

XC7Z045-2FBG676E

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封装: 676-BBGA, FCBGA

库存5,328

XCZU4CG-2SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封装: 784-BBGA, FCBGA

库存7,040

XCZU3CG-2SFVA625I

Xilinx Inc.

XCZU3CG-2SFVA625I

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 625-BFBGA, FCBGA
Supplier Device Package: 625-FCBGA (21x21)

封装: 625-BFBGA, FCBGA

库存5,520

XC7K325T-3FFG900E

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

Number of LABs/CLBs: 25475
Number of Logic Elements/Cells: 326080
Total RAM Bits: 16404480
Number of I/O: 500
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封装: 900-BBGA, FCBGA

库存5,904

XA3S250E-4PQG208Q

Xilinx Inc.

IC FPGA 158 I/O 208QFP

Number of LABs/CLBs: 612
Number of Logic Elements/Cells: 5508
Total RAM Bits: 221184
Number of I/O: 158
Number of Gates: 250000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封装: 208-BFQFP

库存5,824

XC5VLX110T-1FFG1136CES

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

Number of LABs/CLBs: 8640
Number of Logic Elements/Cells: 110592
Total RAM Bits: 5455872
Number of I/O: 640
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1136-BBGA, FCBGA
Supplier Device Package: 1136-FCBGA (35x35)

封装: 1136-BBGA, FCBGA

库存4,176

XCV150-4FG456I

Xilinx Inc.

IC FPGA 260 I/O 456FBGA

Number of LABs/CLBs: 864
Number of Logic Elements/Cells: 3888
Total RAM Bits: 49152
Number of I/O: 260
Number of Gates: 164674
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA (23x23)

封装: 456-BBGA

库存4,752

XC4010XL-1PC84I

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

Number of LABs/CLBs: 400
Number of Logic Elements/Cells: 950
Total RAM Bits: 12800
Number of I/O: 61
Number of Gates: 10000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

封装: 84-LCC (J-Lead)

库存6,944

XC4005XL-2PQ208C

Xilinx Inc.

IC FPGA 112 I/O 208QFP

Number of LABs/CLBs: 196
Number of Logic Elements/Cells: 466
Total RAM Bits: 6272
Number of I/O: 112
Number of Gates: 5000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封装: 208-BFQFP

库存7,248

XC4005E-2PG156I

Xilinx Inc.

IC FPGA 112 I/O 156CPGA

Number of LABs/CLBs: 196
Number of Logic Elements/Cells: 466
Total RAM Bits: 6272
Number of I/O: 112
Number of Gates: 5000
Voltage - Supply: 4.5 V ~ 5.5 V
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 156-BCPGA
Supplier Device Package: 156-CPGA (42.17x42.17)

封装: 156-BCPGA

库存2,256

XC4005E-2PC84I

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

Number of LABs/CLBs: 196
Number of Logic Elements/Cells: 466
Total RAM Bits: 6272
Number of I/O: 61
Number of Gates: 5000
Voltage - Supply: 4.5 V ~ 5.5 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

封装: 84-LCC (J-Lead)

库存3,408

XC4013E-2PQ208C

Xilinx Inc.

IC FPGA 160 I/O 208QFP

Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Total RAM Bits: 18432
Number of I/O: 160
Number of Gates: 13000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封装: 208-BFQFP

库存5,280

XC3164A-3PC84C

Xilinx Inc.

IC FPGA 70 I/O 84PLCC

Number of LABs/CLBs: 224
Number of Logic Elements/Cells: -
Total RAM Bits: 46064
Number of I/O: 70
Number of Gates: 4500
Voltage - Supply: 4.25 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

封装: 84-LCC (J-Lead)

库存5,280

XCVU7P-1FLVB2104E

Xilinx Inc.

XCVU7P-1FLVB2104E

Number of LABs/CLBs: 98520
Number of Logic Elements/Cells: 1724100
Total RAM Bits: 236134400
Number of I/O: 702
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: -
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存6,608

XC2VP100-5FF1704C

Xilinx Inc.

IC FPGA 1040 I/O 1704FCBGA

Number of LABs/CLBs: 11024
Number of Logic Elements/Cells: 99216
Total RAM Bits: 8183808
Number of I/O: 1040
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1704-BBGA, FCBGA
Supplier Device Package: 1704-CFCBGA (42.5x42.5)

封装: 1704-BBGA, FCBGA

库存6,272

XC5VLX110-3FFG1760C

Xilinx Inc.

IC FPGA 800 I/O 1760FBGA

Number of LABs/CLBs: 8640
Number of Logic Elements/Cells: 110592
Total RAM Bits: 4718592
Number of I/O: 800
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封装: 1760-BBGA, FCBGA

库存6,624

XC5VLX110-1FFG676I

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

Number of LABs/CLBs: 8640
Number of Logic Elements/Cells: 110592
Total RAM Bits: 4718592
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封装: 676-BBGA, FCBGA

库存9,480

XC2VP40-6FG676I

Xilinx Inc.

IC FPGA 416 I/O 676FBGA

Number of LABs/CLBs: 4848
Number of Logic Elements/Cells: 43632
Total RAM Bits: 3538944
Number of I/O: 416
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封装: 676-BBGA, FCBGA

库存4,000

XC6SLX150T-2FGG484I

Xilinx Inc.

IC FPGA 296 I/O 484FBGA

Number of LABs/CLBs: 11519
Number of Logic Elements/Cells: 147443
Total RAM Bits: 4939776
Number of I/O: 296
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BBGA

库存4,192

XC3S1000-4FT256C

Xilinx Inc.

IC FPGA 173 I/O 256FTBGA

Number of LABs/CLBs: 1920
Number of Logic Elements/Cells: 17280
Total RAM Bits: 442368
Number of I/O: 173
Number of Gates: 1000000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封装: 256-LBGA

库存7,872

XC3S700A-4FGG400C

Xilinx Inc.

IC FPGA 311 I/O 400FBGA

Number of LABs/CLBs: 1472
Number of Logic Elements/Cells: 13248
Total RAM Bits: 368640
Number of I/O: 311
Number of Gates: 700000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-BGA
Supplier Device Package: 400-FBGA (21x21)

封装: 400-BGA

库存4,144

XC3S100E-5CP132C

Xilinx Inc.

IC FPGA 83 I/O 132CSBGA

Number of LABs/CLBs: 240
Number of Logic Elements/Cells: 2160
Total RAM Bits: 73728
Number of I/O: 83
Number of Gates: 100000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 132-TFBGA, CSPBGA
Supplier Device Package: 132-CSPBGA (8x8)

封装: 132-TFBGA, CSPBGA

库存7,104

XC3S500E-5PQG208C

Xilinx Inc.

IC FPGA 158 I/O 208QFP

Number of LABs/CLBs: 1164
Number of Logic Elements/Cells: 10476
Total RAM Bits: 368640
Number of I/O: 158
Number of Gates: 500000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封装: 208-BFQFP

库存8,364

XC9572XL-7TQG100C

Xilinx Inc.

IC CPLD 72MC 7.5NS 100TQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 72
Number of Gates: 1600
Number of I/O: 72
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-TQFP (14x14)

封装: 100-LQFP

库存13,380

XCVU190-3FLGC2104E

Xilinx Inc.

IC FPGA VIRTEX-U 2104FCBGA

Number of LABs/CLBs: 134280
Number of Logic Elements/Cells: 2349900
Total RAM Bits: 150937600
Number of I/O: 416
Number of Gates: -
Voltage - Supply: 0.970 V ~ 1.030 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封装: 2104-BBGA, FCBGA

库存4,992