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最新技术

记录 1490
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Technology Cover

2019-02-22, Murata - Narrow-band IoT module stretches battery life in a small size

Murata has released what it believes to be the world’s smallest narrow-band IoT cellular wireless module. The device measures just 15.6mm x 14mm x 2.2mm and is manufactured on a PCB with a metal casing, and is intended for use in compact, battery-powered IoT/IIoT applications.

Technology Cover

2019-02-22, Vishay Intertechnology - Add heart rate monitoring capability to any type of consumer electronics device

Vishay Intertechnology can help manufacturers add a heart rate monitoring capability to any type of consumer electronic device.

Technology Cover

2019-02-22, Microchip - Technology simplifies automotive infotainment networking

Microchip has announced what is claimed to be the industry’s most efficient automotive infotainment networking solution. The solution supports all data types, including video, audio, control and Ethernet, over a single cable.

Technology Cover

2019-02-22, Renesas Electronics - System-level EV and power management expertise boosts performance for racing team

Renesas Electronics has announced it is expanding its strategic technology partnership with Mahindra & Mahindra, Ltd and Mahindra Racing competing in the ABB FIA Formula E Championship, for the 2018-19 season.

Technology Cover

2019-02-22, ROHM – New SiC power module achieves high level of reliability in extreme environments

ROHM has developed a 1700V/250A rated SiC power module that gives what is claimed to be the industry’s highest level of reliability optimised for inverter and converter applications including outdoor power generation systems and industrial high power supplies.

Technology Cover

2019-02-22, Texas Instruments - Current-shunt monitors accurate current measurements in the microamp range (INA190)

Texas Instruments INA190 Current-Shunt Monitors give overcurrent protection, precision current measurement for system optimisation, or in closed-loop feedback circuits.

Technology Cover

2019-02-22, ON Semiconductor – Intelligent power modules provide space and power saving

ON Semiconductor has a new Automotive Intelligent Power Modules (IPMs) that provides class-leading power density and improve overall performance in on-board charging and other high-voltage DC-DC conversion applications for EVs and plug-in PHEVs.

Technology Cover

2019-02-09, TDK - Series of rugged AC filter capacitors extended

TDK Corporation has expanded its EPCOS B32754* to B32758* series of AC filter capacitors.

Technology Cover

2019-02-09, Analog Devices - Demo board provides high efficiency, high-density power management IC development tool (DC2268A-G)

The Analog Devices DC2268A-G Demonstration Board is a high efficiency, high-density power management IC development tool.

Technology Cover

2019-02-09, Texas Instruments - Amplifier EVM highlights digital input closed-loop automotive Class-D audio amplifier (TAS5720A-Q1EVM)

Texas Instruments TAS5720A-Q1EVM Amplifier EVM highlights the TAS5720A-Q1 digital input closed-loop automotive Class-D audio amplifier.

Technology Cover

2019-02-09, ON Semiconductor - CE certification for Sigfox verified RF SiP solution

ON Semiconductor has achieved CE certification for its AX-SIP-SFEU SiP solution, meaning the device conforms to health, safety and environmental protection standards for products sold within the European Economic Area.

Technology Cover

2019-02-09, TDK - Wide range input dual output DC-DC converters have six-sided shielding

TDK Corporation has introduced the TDK-Lambda brand 15W and 30W rated CCG-D dual output DC-DC converters. Similar to the single output CCG15-S and CCG30‑S, the products have the industry standard 1″ x 1″ footprint and can operate over a wide 4:1 input range.

Technology Cover

2019-02-09, Analog Devices - Transceivers combine three-channel isolator and IEC EMC transient protection in single package (ADM2795E)

Analog Devices ADM2795E Transceivers are 5kVrms signal-isolated RS-485 transceivers. The transceivers offer up to ±42V of AC/DC peak bus overvoltage fault protection on the RS-485 bus pins.

Technology Cover

2019-01-16, Microchip - Accelerate development of remote IoT nodes with low-power SiP family (SAM R34/R35)

Microchip has released a highly integrated LoRa SiP family with an ultra-low-power 32-bit MCU, sub-GHz RF LoRa transceiver and software stack.

Technology Cover

2019-01-16, Analog Devices - Industrial automation solutions help accelerate the path to Industry 4.0

Analog Devices has announced a wide range of solutions within its advanced Industry 4.0 roadmap targeted at supporting industrial equipment OEMs to accelerate their path to Industry 4.0.

Technology Cover

2019-01-16, Power Integrations - Motor driver eliminates heatsinks, slashes software certification time and expense

Power Integrations has released its BridgeSwitch integrated half-bridge (IHB) motor driver IC family. BridgeSwitch ICs provide high and low-side advanced FREDFETs with integrated lossless current sensing, ending in inverter conversion efficiency of up to 98.5% in BLDC motor drive applications to 300W.

Technology Cover

2019-01-16, TDK - Ceramic capacitors in modular flex-assembly technology

TDK Corporation has extended the lineup of CeraLink capacitors with CeraLink FA types in modular flex-assembly technology.

Technology Cover

2019-01-16, Texas Instruments - Evaluation module demos function and versatility of dual-channel amplifier (OPA2810DGKEVM)

Texas Instruments OPA2810DGKEVM Evaluation Module demonstrates the functionality and versatility of the dual-channel OPA2810 amplifier in the DGK (VSSOP-8) package.