页 4 - NXP的最新技术 | 黑森尔电子
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NXP的最新技术

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Technology Cover

2021-12-02, High-performance silicon carbide diodes extend the broad - gap semiconductor family

Nexperia has entered the high power SiC diode market by introducing 650V and 10A SiC Schottky diodes. Will bring more choice and availability to this market

Technology Cover

2021-11-30, The smallest SD card level converter provides 40% less footprint

Nexperia has introduced what it claims is the world's smallest SD card-level converter, the IC-NXS0506UP. The floor area is only 1.45mm x 1.45mm x 0.45mm, the spacing is 0.35mm. It also provides integrated automatic directional control

Technology Cover

2021-11-04, The NFC front end is ideal for challenging RF and space constrained environments

The NFC Frontend is a highly integrated near-field communication (NFC) forum-compatible Frontend IC for 13.56MHz contactless communication. The device is upgraded in every aspect. It meets the needs of e-readers and application scenarios that rely on fast device-to-device communication

Technology Cover

2021-10-26, The application processor family drives a new era of security-edge intelligence

NXP Semiconductors has released the application Processor family I.MX 93 to enable efficient, fast, and secure edge machine learning. The I.mx 93-CS chip will bring opportunities for the entire industry in terms of performance optimization, sustainability and security, and lay the foundation for the development of highly secure devices for a variety of Internet of Things and industrial applications.

Technology Cover

2021-10-06, The 4D imaging radar chip is tailored for the L2+ market for both rapid and simultaneous growth

NXP's new imaging radar processor provides us with broader needs and higher security by generating high-resolution images to enhance the detection and classification of objects

Technology Cover

2020-07-26, NXP - Latest additions for innovative voice command and facial recognition projects

NXP Semiconductors provides the i.MX RT106L and i.MX RT106F EdgeReady crossover processors.

Technology Cover

2020-07-26, NXP - Wireless MCU family extended for automotive and industrial markets

NXP Semiconductors has launched new devices within its KW3x family of MCUs. The new KW39/38/37 MCUs add Bluetooth 5.0 long-range abilities and extended Bluetooth advertising channels.

Technology Cover

2016-07-14, NXP - High-efficiency low-power wireless charger for smartwatches and other wearables (NXQ1TXH5/101J)

The NXP NXQ1TXH5 One-Chip 5V Qi wireless transmitter is a controller and driver IC for 5V Qi-certified/-compliant low-power wireless chargers.

Technology Cover

2016-05-03, NXP - Ultra low-voltage Fm+ I²C bus switch with reset (PCA9846PWJ)

An ultra low-voltage, quad bidirectional translating switch controlled via the I2C bus, NXP’s PCA9846.

Technology Cover

2016-01-05, NXP Semiconductors - Highly-integrated near field communication controller speeds designs (PN7120)

The PN7120 near field communication (NFC) controller from NXP Semiconductors. The highly-integrated PN7120 provides a plug-and-play solution for easy integration into any OS environment.

Technology Cover

2015-09-24, NXP Semiconductor - Medium-power 1A transistors available in 45V, 60V and 80V versions (BC5xPAS)

NXP Semiconductor’s BC5xPAS NPN medium-power transistors are available in 45V, 60V, or 80V versions all with a 1A collector current rating.

Technology Cover

2015-09-24, NXP - Industry’s first secure and most complete total USB Type-C solution

NXP Semiconductors has unveiled ‘the industry’s first and most complete USB Type-C solution’, including authentication and power delivery capabilities to further deliver secure connections for a smarter world.

Technology Cover

2015-09-24, NXP - Near field communications controllers support various transmission modes (PN7120)

NXP’s PN7120 NFC controllers which support various transmission modes, and include an ARM Cortex-M0 MCU with integrated firmware supporting the NCI 1.0 host communication.

Technology Cover

2015-09-07, NXP - Logic-level compatible fast switching 60V dual MOSFETs (NX7002BKXB)

NXP’s NX7002BKXB 60V dual-channel logic-level compatible, fast-switching trench MOSFETs is designed for relay drivers, high-speed line drivers, low-side load switches and switching circuits.

Technology Cover

2015-08-25, NXP Semiconductor - ESD protection devices support SuperSpeed USB up to 10Gbps (PUSB3FR6Z)

NXP Semiconductor TrEOS ESD protection devices support SuperSpeed USB up to 10Gbps. TrEOS ESD devices protect against 20kV contact discharges and exceeds IEC 61000-4-2, level 4. TrEOS also delivers surge protection against a pulse up to 9A. Applications include: ultra-high-speed data lines such as USB 3.1 and HDMI 2.0, interface lines for sensitive IOs, and general ESD protection.

Technology Cover

2015-08-10, NXP - Ultra-efficient 30MHz ARM Cortex-M0+ core microcontroller (LPC800 series)

The NXP LPC800 series microcontroller, the devices feature the ultra-efficient 30MHz ARM Cortex-M0+ core, offering a range of low-power, space-efficient, low-pin-count options for basic diverse MCU applications.

Technology Cover

2015-07-07, NXP - BLE SoC integrates a Bluetooth v4.0 low-energy radio with an ARM Cortex-M0 MCU (QN902X)

The NXP QN902X ultra-low power BLE system on chip (SoC) integrates a Bluetooth v4.0 low energy radio with an ARM Cortex-M0 MCU. The single-chip solution offers room to run applications, provide signal processing, or it can be used as a Bluetooth network processor by connecting the QN902X to an application processor.

Technology Cover

2015-05-27, NXP – New MCUs support complex algorithms in data-intensive applications (LPC4300 Series)

NXP’s LPC4300 Series microcontrollers offer the high performance and flexibility of an asymmetric dual-core architecture (ARM Cortex-M4F and Cortex-M0 coprocessor) in combination with multiple high-speed connectivity options, advanced timers, analogue and optional security features.