Advantech recently launched a new ultra wide temperature SQRAM DDR4 3200 durable memory solution - SQR-SD4E, which provides reliable industrial grade stability applications in the operating temperature range of - 40~+125 ℃. The SQR-SD4E adopts the original MGL DRAM IC, which supports the working temperature of - 40~125 ℃, and solves the overheating problem. The innovative design and unique specifications of this product ensure exceptional durability in high temperature critical applications such as military, vehicular, mining and heavy industry.
Today's high performance computing applications generate more heat, especially outdoors. Higher power requirements for embedded computing in key markets mean that thermal management issues are always present. Advantech's SQR-SD4E is designed with Magnesia original car gauge DRAM IC and 30 µ" Goldfinger PCB and can support operating temperatures from -40 to 125 ° C. The SQR-SD4E series has undergone extreme long-term burning and stress testing to ensure its reliability. Supports SODIMM specifications, including 8GB, 16GB, and 32GB capacities, with a transmission rate of up to 3200MT/s.
In order to meet the diversified key industrial applications, Advantech's SQR-SD4E also meets the requirements of strong solid performance. The bottom filling technology is adopted to make the DRAM chip and the substrate have stronger structural support, effectively reducing the edge stress. At the same time, it can better prevent moisture and other environmental hazards to improve the stability and durability of memory modules.
Due to the special memory performance requirements, not all high-performance embedded computing applications can fully benefit from the hardening technology. SQR-SD4E SQRAM provides different cooling solutions for different use cases. The additional heat sink can dissipate more heat and keep the module temperature low enough to avoid overheating during operation. The additional heat sink can improve the durability of the memory module in the most critical environment.
