Laird Connectivity Summit SOM 8M Plus Development Kit | 黑森尔电子
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Laird Connectivity Summit SOM 8M Plus Development Kit

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发布日期: 2022-09-20, Laird - Embedded Wireless Solutions

   Summit SOM 8M Plus Development Kit from Laird Connectivity. This development kit enables engineers to develop with Laird Connectivity's Summit System-on-Module (SOM) 8M Plus, a highly integrated software and hardware solution powered by high-performance NXP Semiconductors i.MX 8M Plus processors. The Summit SOM 8M Plus Development Kit enables the development of advanced wireless Internet of Things (IoT) applications, including industrial IoT devices for harsh environments, IoT vision solutions, and medical devices.

     At the heart of Laird Connectivity's Summit SOM 8M Plus development kit is the Summit SOM 8M Plus, which combines NXP's i.MX 8M Plus applications processor with the NXP 88W8997 wireless system-on-chip. The Summit SOM 8M Plus includes an integrated 2.3 TOPS neural processing unit, advanced connectivity and enhanced security to provide essential hardware acceleration for complex machine learning applications. Quad-core processors can run multiple Linux instances for user interface and connectivity, etc. to develop highly advanced IoT solutions.

     The Summit SOM 8M Plus development kit includes reference designs for display, camera, audio, LTE, GPS, USB 3.0 power, and more. The kit features an extensive array of interfaces, supporting up to three displays and multiple options for audio, camera, video output and I/O. The device features dual-band 2×2 Wi-Fi 5 and Bluetooth 5.3 connectivity, ensuring reliable connectivity even in extremely harsh environments. The onboard Summit SOM 8M Plus is designed for increased security and durability, and the Summit Suite chain of trust provides hardware root-of-trust-based software verification and upcoming FIPS cryptographic module verification.

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